The present invention provides for a BGA solder ball interconnection to an outer conductive layer of a laminated circuit assembly having an underlying circuit layer. The invention includes a raised BGA solder ball pad substantially co-planar with the outer conductive layer, the raised pad having a raised...http://www.google.se/patents/US7253510?utm_source=gb-gplus-sharePatent US7253510 - Ball grid array package construction with raised solder ball pads
