A structure in which an electronic part is mounted on a substrate via mount resin and has electrodes thereof connected to electrodes arranged on the substrate for wire bonding by conductors is disclosed. A frame for preventing the mount resin from flowing out is formed on the substrate between a portion...http://www.google.se/patents/US6101098?utm_source=gb-gplus-sharePatent US6101098 - Structure and method for mounting an electric part
