A method of improving step coverage of a copper seed layer deposited over a semiconductor feature surface which is particularly useful for small size features having a high aspect ratio. Using a contact via as an example of a high aspect ratio feature, we have demonstrated that it is possible to increase...http://www.google.se/patents/US6391776?utm_source=gb-gplus-sharePatent US6391776 - Method of depositing a copper seed layer which promotes improved feature surface coverage
