A multi-layer printed-wiring board including a substrate having a plurality of wiring pattern layers sequentially transferred thereon, each wiring pattern layer containing an electrically conductive layer and an electrically insulating layer. The wiring pattern layers are attached to the substrate through...http://www.google.se/patents/US6378199?utm_source=gb-gplus-sharePatent US6378199 - Multi-layer printed-wiring board process for producing
