A method is disclosed that can be used to interconnect an integrated circuit (IC) multiple die assembly to conductors on a substrate such that signals can be conveyed between the dies and the conductors on the substrate. The multiple die assembly can include a first IC die and at least one secondary...http://www.google.se/patents/US7681309?utm_source=gb-gplus-sharePatent US7681309 - Method for interconnecting an integrated circuit multiple die assembly
