A bonding component for electrically connecting a semiconductor chip or wafer to a support substrate includes a dielectric layer having a central region, elongated slots defining the central region, and a peripheral region surrounding the slots. Metallic bonding pads are arranged on the central region,...http://www.google.se/patents/US5994222?utm_source=gb-gplus-sharePatent US5994222 - Method of making chip mountings and assemblies
