A microelectronic assembly includes units superposed on one another to form at least one stack having a vertical direction. Each unit includes one or more microelectronic devices and has top and bottom surfaces. Top unit terminals are exposed at the top surfaces and bottom unit terminals are exposed...http://www.google.se/patents/US20100013108?utm_source=gb-gplus-sharePatent US20100013108 - STACKED PACKAGES AND MICROELECTRONIC ASSEMBLIES INCORPORATING THE SAME
