An improved wire bond is provided with the bond pads of semiconductor devices and the lead fingers of lead frames or an improved conductive lead of a TAB tape bond with the bond pad of a semiconductor device. More specifically, an improved wire bond is described wherein the bond pad on a surface of the...http://www.google.se/patents/US7338889?utm_source=gb-gplus-sharePatent US7338889 - Method of improving copper interconnects of semiconductor devices for bonding
