A fabrication method of a semiconductor package with a photosensitive chip is provided. A substrate having a core is prepared. An interposer is mounted on the substrate, with a peripheral portion of the substrate exposed from the interposer. A molding process is performed and the substrate is clamped...http://www.google.se/patents/US6989296?utm_source=gb-gplus-sharePatent US6989296 - Fabrication method of semiconductor package with photosensitive chip
