A three dimensional integrated circuit interconnect for connecting a plurality of chips in a module with a standard footprint for pin grid array or quad flat pack mounting. Each IC is mounted on a custom interconnect slice and tested. The slices are stacked together with electrical connections from one...http://www.google.se/patents/US5383269?utm_source=gb-gplus-sharePatent US5383269 - Method of making three dimensional integrated circuit interconnect module
