A back-to-back semiconductor device module including two semiconductor devices, the backs of each being secured to one another. Each of the bond pads of both of the semiconductor devices are disposed adjacent a single, mutual edge of the back-to-back semiconductor device module. The back-to-back semiconductor...http://www.google.se/patents/US6147411?utm_source=gb-gplus-sharePatent US6147411 - Vertical surface mount package utilizing a back-to-back semiconductor device module
