A carrier structure and method for fabricating a carrier structure with through-vias each having a conductive structure with an effective coefficient of thermal expansion which is less than or closely matched to that of the substrate, and having an effective elastic modulus value which is less than or...http://www.google.se/patents/US7276787?utm_source=gb-gplus-sharePatent US7276787 - Silicon chip carrier with conductive through-vias and method for fabricating same
