A wire bonding method includes a first bonding process for forming a first ball-shaped part in a wire and bonding the first ball-shaped part to a first connected member; a ball-shaped part forming process for guiding the wire away from a position where the wire is bonded to an inner lead so as to form...http://www.google.se/patents/US6495773?utm_source=gb-gplus-sharePatent US6495773 - Wire bonded device with ball-shaped bonds
