A leadframe strip production process provides encapsulated semiconductor chips with more than two annular rows of exposed leads by utilizing two types of frames, a leadframe to which IC devices are mounted, and a ring frame strip that is attached to the leadframe with a non-conductive adhesive. The leadframe...http://www.google.se/patents/US7846774?utm_source=gb-gplus-sharePatent US7846774 - Multiple row exposed leads for MLP high density packages
