The present invention provides a multichip package wherein a plurality of semiconductor chip packages (100) in each of which first electrode pads (16a) provided in a main surface of a semiconductor chip, and first bonding pads (20a) and first central bonding pads (18a) formed in an upper area of the...http://www.google.se/patents/US7576431?utm_source=gb-gplus-sharePatent US7576431 - Semiconductor chip package and multichip package
