A cooling arrangement useful for semiconductors or solid-state assemblages mounts the semiconductor or other solid-state device directly onto a first surface of a thermally conductive "heat spreader." The heat spreader contains microchannels which open into coolant fluid ports on the second side of the...http://www.google.se/patents/US6388317?utm_source=gb-gplus-sharePatent US6388317 - Solid-state chip cooling by use of microchannel coolant flow
