A method includes receiving a first set of parameters associated with a subset of a plurality of die on a wafer. A die health metric is determined for at least a portion of the plurality of die based on the first set of parameters. The die health metric includes at least one process component associated...http://www.google.se/patents/US8041518?utm_source=gb-gplus-sharePatent US8041518 - Determining die test protocols based on process health
