The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating...http://www.google.se/patents/US7560941?utm_source=gb-gplus-sharePatent US7560941 - Method and system for compensating thermally induced motion of probe cards
