A process for fabricating an integrated circuit package includes: selectively etching a first side of a substrate thereby providing etched regions of the substrate to partially define at least a plurality of contact pads; adding a dielectric material to the etched regions of the substrate; selectively...http://www.google.se/patents/US7348663?utm_source=gb-gplus-sharePatent US7348663 - Integrated circuit package and method for fabricating same
