A cooling mechanism having a heat sink, a first conduction device, and a convection device is provided. The first conduction device conducts heat from a heat source to the heat sink. The convection device has a first side, a second side, a peripheral dimension. The heat sink is disposed about the peripheral...http://www.google.se/patents/US6752201?utm_source=gb-gplus-sharePatent US6752201 - Cooling mechanism for an electronic device
