A high quality factor on-package, off-die inductor assembly is disclosed. The assembly includes a flip-chip, ball-grid array package substrate, an on-package, off-die trace line is coupled to one or more bumps attached to an upper surface of the package substrate. The trace line has a self-inductance...http://www.google.se/patents/US6972965?utm_source=gb-gplus-sharePatent US6972965 - Method for integrated high Q inductors in FCGBA packages
