A planarization method includes providing a second and/or third Group VIII metal-containing surface (preferably, a platinum-containing surface) and positioning it for contact with a polishing surface in the presence of a planarization composition that includes an oxidizing gas. ...http://www.google.se/patents/US20030119321?utm_source=gb-gplus-sharePatent US20030119321 - Methods for planarization of Group VIII metal-containing surfaces using oxidizing gases
