A microelectronic assembly is disclosed that includes a semiconductor wafer with contacts, compliant bumps of dielectric material overlying the first surface of the semiconductor wafer, and a dielectric layer overlying the first surface of the semiconductor wafer and edges of the compliant bumps. The...http://www.google.se/patents/US8115308?utm_source=gb-gplus-sharePatent US8115308 - Microelectronic assemblies having compliancy and methods therefor
