A manufacturing pallet 100 has provisions for supporting an opto-electronic package 10 on a frame 112. Openings 110A, 110B are provided through the frame to enable mechanical access to the opto-electronic package from below the frame. Additionally, lead access openings 114A, 114B are provided to enable...http://www.google.se/patents/US6714714?utm_source=gb-gplus-sharePatent US6714714 - Butterfly package pallet