Pin-mounted components, such as DIP-packaged devices, multi-pin toroids and memory cubes are integrated into high density interconnect (HDI) structures by external attachment. Frozen spheres of conductive epoxy are placed, using automated pick-and-place equipment, into laser-drilled well-like via holes...http://www.google.se/patents/US5255431?utm_source=gb-gplus-sharePatent US5255431 - Method of using frozen epoxy for placing pin-mounted components in a circuit module
