A method of forming a bond structure for use with integrated circuits and semiconductor electronics and carrier assemblies is disclosed. Metallurgical paste is screen printed through a stencil and the stencil is left in place during the reflow process. The melting point of the bond structure and the...http://www.google.se/patents/US5873512?utm_source=gb-gplus-sharePatent US5873512 - Application of low temperature metallurgical paste to form a bond structure to attach an electronic component to a carrier
