A interconnect structure is inexpensively manufactured and easily insertable into a socket. The interconnect structure is manufactured by forming a sacrificial substrate with cavities that is covered by a masking material having openings corresponding to the cavities. A first plating process is performed...http://www.google.se/patents/US20050167816?utm_source=gb-gplus-sharePatent US20050167816 - Method for making a socket to perform testing on integrated circuits
