A surface mount type semiconductor device can be configured to include a pair of lead frames that are butted to each other with a spacing such that ends of the lead frames are opposite to each other. A bare chip can be mounted on a chip mount portion on one end side of one of the lead frames, and wire-bonded...http://www.google.se/patents/US20050151231?utm_source=gb-gplus-sharePatent US20050151231 - Surface mount type semiconductor device and lead frame structure thereof
