A method and associated apparatus for electro-chemically depositing a metal film on a substrate having a metal seed layer. The apparatus comprises a substrate holder that holds the substrate. The electrolyte cell receives the substrate in a processing position. The actuator is connected to the substrate...http://www.google.se/patents/US6837978?utm_source=gb-gplus-sharePatent US6837978 - Deposition uniformity control for electroplating apparatus, and associated method
