A semiconductor device is disposed on a circuit board such that respective bumps are brought in direct contact with respective circuit electrodes, and diffusion bonding is caused to occur at respective bonding faces between the respective bumps and the respective circuit electrodes by applying ultrasonic...http://www.google.se/patents/US6465879?utm_source=gb-gplus-sharePatent US6465879 - Structure for mounting semiconductor device, method of mounting same, semiconductor device, and method of fabricating same
