Improved interconnects are produced by injection molded solder which fills mold arrays with molten solder so that columns that have much greater height to width aspect ratios greater than one are formed, rather than conventional flip chip bumps. The columns may have filler particles or reinforcing conductors...http://www.google.se/patents/US7523852?utm_source=gb-gplus-sharePatent US7523852 - Solder interconnect structure and method using injection molded solder
