A substrate having a ground plane, a first side, and a second side is provided. A via that electrically connects the first side to the second side is formed. A printed wire is formed on the first side, and a printed wire is formed on the second side. A passive component is formed on the first side. The...http://www.google.se/patents/US7733661?utm_source=gb-gplus-sharePatent US7733661 - Chip carrier and fabrication method
