A method for conditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers. Waste matter on the polishing pad is dissolved with a conditioning solution selected to chemically dissolve the material of the waste matter. The conditioning solution preferably coats the areas...http://www.google.se/patents/US6238270?utm_source=gb-gplus-sharePatent US6238270 - Method for conditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers
