A high speed electrochemical metal removal technique provides for planarization of multilayer copper interconnection in thin film modules. The process uses a neutral salt solution, is compatible with the plating process and has minimum safety and waste disposal problems. The process offers tremendous...http://www.google.se/patents/US5567300?utm_source=gb-gplus-sharePatent US5567300 - Electrochemical metal removal technique for planarization of surfaces
