The present invention relates to a system and method for performing reliability screening on semi-conductor wafers and particularly to a highly planar burn in apparatus and method for uses including wafer level burn-in (WLBI), diced die burn-in (DDBI), and packaged die burn-in (PDBI). The burn-in system...http://www.google.se/patents/US6046060?utm_source=gb-gplus-sharePatent US6046060 - Method of making a high planarity, low CTE base for semiconductor reliability screening
