A thin metal layer with a thickness of 1 to 5 .mu. is formed electrolytically (S2) on an electrically conductive single-plate substrate having a predetermined roughness, a resist mask is formed (S3) on the surface of the thin metal layer, and a conductor circuit is then electroformed thereon (S4) using...http://www.google.se/patents/US4790902?utm_source=gb-gplus-sharePatent US4790902 - Method of producing conductor circuit boards
