A packaged integrated circuit that includes a substrate 310; a chip 300 mounted on the substrate; and a heatsink 350 mounted on the chip. The heatsink has a spacer 360 attached to one of its surfaces to provide a standoff distance between the heatsink and the substrate. The substrate and the heatsink...http://www.google.se/patents/US6936919?utm_source=gb-gplus-sharePatent US6936919 - Heatsink-substrate-spacer structure for an integrated-circuit package
