A process and configuration are described which enable the I/O metal fingers of any high density interconnect (HDI) module to be extended over the edge of a substrate at the end of circuit fabrication, thus enabling fabrication of circuits for arrangement in three-dimensional stacks. The module includes...http://www.google.se/patents/US5285571?utm_source=gb-gplus-sharePatent US5285571 - Method for extending an electrical conductor over an edge of an HDI substrate
