A carrier for use in a chip-scale package includes a polymeric film with apertures defined therethrough. The apertures, which are alignable with corresponding bond pads of a semiconductor device over which the carrier is to be positioned are at least partially filled with a quantity of conductive material....http://www.google.se/patents/US6873046?utm_source=gb-gplus-sharePatent US6873046 - Chip-scale package and carrier for use therewith
