Novel slurries for the chemical mechanical polishing of thin films used in integrated circuit manufacturing. A tungsten slurry of the present invention comprises an oxidizing agent, such as potassium ferricyanide, an abrasive such as silica, and has a pH between two and four. The tungsten slurry of the...http://www.google.se/patents/US5516346?utm_source=gb-gplus-sharePatent US5516346 - Slurries for chemical mechanical polishing
