A high-density electrical package utilizing an array of high performance demountable electrical contacts such as UEC, T-Spring, F-Spring and their equivalent contained in a carrier in the form of an interposer between one or more components and a substrate. The carrier is made of a thermally conductive...http://www.google.se/patents/US7358603?utm_source=gb-gplus-sharePatent US7358603 - High density electronic packages
