An LOC semiconductor package includes: a semiconductor chip; a plurality of two-sided tapes being attached on predetermined portions of the semiconductor chip inthe form of layers; a lead frame having a step coverage corresponding to the form of the two-sided tape; wires ...http://www.google.se/patents/US5834830?utm_source=gb-gplus-sharePatent US5834830 - LOC (lead on chip) package and fabricating method thereof
