A semiconductor multi-package module has stacked first and second packages, each of which includes a die attached to a substrate, in which the second package is inverted, in which the first and second substrates are interconnected by wire bonding, and in which the first package includes a flip-chip ball...http://www.google.se/patents/US7045887?utm_source=gb-gplus-sharePatent US7045887 - Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package
