A method of making a semiconductor-mounting substrate suitable for high density packaging and the substrate so made. In order to package an electron part having many terminals to be mounted in a high density, the substrate is constructed by using a lead frame comprised of a die pad and leads as a base,...http://www.google.se/patents/US5175060?utm_source=gb-gplus-sharePatent US5175060 - Leadframe semiconductor-mounting substrate having a roughened adhesive conductor circuit substrate and method of producing the same
