A wafer or a portion of a wafer including capped chips such as surface acoustic wave (SAW) chips is provided with terminals by applying a terminal-bearing element such as a dielectric element with terminals and leads thereon, or a lead frame, so that the terminal-bearing element covers the caps, and...http://www.google.se/patents/US7754537?utm_source=gb-gplus-sharePatent US7754537 - Manufacture of mountable capped chips
