A stacked multi-chip package comprising a substrate, a first chip, a lead frame, and a second chip is provided. The first chip is placed on and electrically connected with the substrate. The lead frame is placed on the substrate and forming a space therebeneath to accommodate the first chip. The second...http://www.google.se/patents/US7180166?utm_source=gb-gplus-sharePatent US7180166 - Stacked multi-chip package
