WO2011101166A1

WO2011101166A1 - Contacting device

Info

Publication number: WO2011101166A1
Application number: PCT/EP2011/000802
Authority: WO
Inventors: Gerhard Goldammer
Original assignee: Pro Design Electronic Gmbh
Priority date: 2010-02-20
Filing date: 2011-02-18
Publication date: 2011-08-25
Also published as: DE202010002560U1

Abstract

The invention relates to a contacting device for electrically connecting electronic components to an application device, especially a test device, said contacting device comprising a receiving component (1) having a receiving element (10) for at least one electronic component (3) to be tested, that comprises, on at least one side, a plurality of electrical contacts (30) arranged in a grid, and an adapter device (6) provided between the receiving element (10) and the application device (2). The adapter device (6) comprises contacts (60), on the component side, that are associated respectively with an electrical contact (30) of the component (3) and can be electroconductively connected to said contacts (30). The adapter device (6) comprises electroconductive connection devices (64, 65) that connect respectively an electrical contact (60, 60') on the component side, to an associated contact (62, 62') on the application side. The invention is characterised in that the component-side contacts (60, 60') are arranged in a first grid (R1) and the application-side contacts (62, 62') are arranged in a second grid (R2), and in that the respective grid distance (a) between the contacts (62, 62') of the second grid (R2) is wider than the respective grid distance (b) between the contacts (60, 60') of the first grid (R1).

Description

DR. TUNGSTEN SLIM

PATENT

LL.M. · DIPL.-ING. · DIPL.-WI TSCHAFTS-ING.

applicant:

PATENT ATTORNEY

PRO DESIGN Electronic GmbH EUROPEAN PATENT ATTORNEY Albert-Mayer-Strasse 16 EUROPEAN TRADE MARK ATTORNEY

D - 83052 BRUCKMÜHL POSTFACH 13 66

D - 85505 OTTOBRUNN

HAIDGRABEN 2

D - 85521 OTTOBRUNN

Ottobrunn, 18 February 2011

Amtl, file number: PHONE 089 - 60 80 77 2-0

TELEFAX 089 - 60 80 77 2-27 Attorney's file: P 1054 E-MAIL info@wspatent.de

INTERNET www.wspatent.de

Contacting device

The present invention relates to a

Contacting device for electrically connecting electronic components to an application device, in particular a test device for electronic components, such as integrated circuits. Furthermore, the present application relates to an arrangement of such a contacting device and a

Application device. Such contact ierungsvorrichtungen, which are also referred to for use on a test device for electronic components as a measuring adapter are in the measuring and

Testing technology of electronic components used to check their function before delivery to the customer. About the measuring adapter is a connection between the electronic component and the test device, for example, a Tester Interface Board (TIB), which with the

Test device and its resources is connected,

produced . The progressive miniaturization of devices and

The consequence of electronic components is that even the housings of electronic components are getting smaller and smaller. More and more connections are in the smallest space from the component

brought out to reduce the material and process costs in the production. A housing of an example in Fig. 1 in principle illustrated electronic

Component 103 of the type BGA-256 (Ball-Grids array or

Ball grid arrangement) with a 16 x 16 contact pin matrix and an assumed 0.40 mm pitch (pitch between the contacts), has already 256 contacts as electrical connections on an edge length of about 6.00 mm x 6.00 mm. The individual connections only have a diameter of about 0.30 mm. The distance between the connections is only 0.10 mm. Currently, BGAs with a pitch of 0.50 mm and 0.40 mm are already standard. However, housings for BGAs with a pitch of 0.30 mm and smaller are already being used

prepared . The test costs for the electronic components are also of great importance. Therefore, ever larger and because of the mechanical stability always thicker

Test interface boards, so PCBs for connection to the test device, used to measure four times, eight times and more and to reduce the cost of testing. In Fig. 13 and Fig. 14 are schematic representations of a

Four times measurement mapped, wherein the measuring adapter 101 on the test interface board 102 with the resources 107 of

Test device are connected. The thicknesses of

different test interface boards, depending on

Test device and design, at the time 2.00 mm, 3.20 mm or 3.80 mm and more recently even up to 6.00 mm.

In the current state of the art, the mechanical adaptation of the component to be tested 103, in the example of FIG. 1 is a BGA-256, on the measuring adapter 101 on the Test interface board 102 in the ratio 1: 1 performed. That said, the BGA pitch is exactly the same

Connection pitch on the test interface board 102. The respective electrical contact is made via per se known spring loaded pogo pins 105 (spring pins), as shown in Fig. 3,

produced. The measuring adapter 101 is connected to the test interface board 102 by means of screws 104.

For a quadruple measurement of the electronic component 103 specified in the example, up to about 1000 connections to the tester resources 107 (FIGS

Fig. 19). Therefore, test interface boards 102 are usually designed as a multilayer board to the plurality of

Allow connections. In any case, must be through a large number of plated-through and metallized

Drilled holes in the connection field, the connection to the inner layers of the test interface board 102 are made to the

Signals of the device under test 103 via the

Measuring adapter 101 and the test interface board 102 for

Test device and its resources 107 to transmit.

One problem, however, is that thick circuit boards and smallest bore diameter or smallest distances between the holes technologically do not match.

The increasing board thickness of the test interface boards 102 and the ever decreasing pitch of the components meanwhile make the production of the test interface boards 102 more and more expensive, if not impossible, because in the case of the

Production of printed circuit boards in the field of

technical feasibility exists. Drill diameter,

Minimum clearances and minimum track widths must be adhered to in order to ensure safe and cost-effective production

guarantee. The smallest drill diameter is in

Relative to the PCB thickness. This is

required because this hole further Manufacturing process must be metallized again to ensure the electrical connection to the inner layers. One speaks here at the drilling of "Aspect Ratio".

The Aspect Ratio to IPC Class II is usually 1:10. That is, with a board thickness of, for example, 2.00 mm, the smallest hole diameter is 0.20 mm

can metallize the hole in the further manufacturing process and the test interface boards safely and

to manufacture cost-effective. Add to that

Restring around the hole of about 0.10 mm. On this rest ring is a so-called Päd as a closure lid for the bore and forms a contact surface for an associated Pogopin. In the above example, a päd of 0.40 mm will be required. Add one more

Minimum distance of 0.10 mm between the pads added, you come purely arithmetically to a pitch of 0.50 mm. That means that a test interface board with a thickness of 2.00 mm

normally only suitable for BGA's with a pitch of 0.50 mm or larger.

To illustrate this problem even better, a second example is given: let us assume that

Test interface board has a thickness of 4.00 mm, which means that the smallest drill diameter may be 0.40 mm in order to produce the test interface board safely and inexpensively. In addition, there is a remaining ring around the hole of about 0.20 mm. Here, therefore, a päd of 0.80 mm will be required. If one adds a minimum distance of 0.20 mm between the pads, one calculates mathematically on a pitch of 1.00 mm. This means that a 4.00 mm thick test interface board is normally only suitable for BGAs with a pitch of 1.00 mm or larger. BGA's with

smaller pitch can not be measured with this test interface board, as it would require even smaller holes. These may be due to the thickness of the test interface board However, not sufficiently and safely metallized and are therefore difficult to manufacture.

Electronic components with a small contact pitch can not be measured or tested with thick test interface boards.

From US 2002/0027445 AI is a generic

Contacting device is known in which between a receiving device for an electronic component and a test device, a contacting board may be provided with the individual contacts of the receiving device via offset signal paths to certain terminals of the

Test device are passed.

From US 2004/0046583 AI a recording device for electronic components is known in the individual arranged in a grid contacts the receiving device to

Contact rows are led to two of each other

opposite sides of a between the receiving device and a mounted on a circuit board base device

be inserted inserted inserter.

Both previously known from the prior art constructions are not able to a plurality of closely rastered contacts of the electronic component with a

corresponding variety of contacts one

Application device, such as a test device to connect.

It is therefore an object of the present invention to provide a generic contacting device, which allows electronic components having a plurality of arranged in a grid electrical contacts, by means of an adapter device with a Application device, such as a test device for the electronic component to electrically connect.

This object is achieved by the specified in claim 1 contacting device.

This contacting device according to the invention for

electrical connection of electronic components with an application device, in particular a test device, is provided with a receiving device, which is a receptacle for at least one electronic component to be tested

comprising at least one side of a plurality of arranged in a grid electrical contacts, and an adapter device which is provided between the receptacle and the application device, wherein the

Adapter device component-side contacts, each associated with an electrical contact of the component and are electrically conductively connected to these contacts, and wherein the adapter device electrically conductive

Having connecting devices, each having a

Connect component-side electrical contact with an associated application-side contact. These

Contacting device according to the invention is characterized in that the component-side contacts in a first grid and the application-side contacts are arranged in a second grid and that the respective

Grid spacing of the contacts of the second grid is greater than the respective grid spacing of the contacts of the first grid. This grid widening according to the invention makes it possible to electrically connect electronic components with a very narrow pitch between the individual contacts to a contact grid of the application apparatus in a simple manner, which has a larger contact spacing in the contact grid due to the properties and dimensions of the application apparatus. Preferably, the adapter device has a multilayer printed circuit board. Another connection technique may be provided for the adapter device.

It is particularly advantageous if the contacts of the first grid are arranged on a first surface of the circuit board and the contacts of the second grid on a side facing away from the first surface second

Surface of the circuit board are arranged. This variant makes it possible that the designed as a printed circuit board

Adapter device saves space in the overall structure

can be integrated and that especially short

Signal propagation paths are achieved.

It is particularly advantageous if the number of conductive layers of the printed circuit board is at least half of the maximum number of adjacent rows of the grid

corresponds.

A particularly preferred and advantageous embodiment of the contacting device according to the invention is characterized in that at an outer edge of the first

Rasters located contacts are each electrically connected to a conductor of a first grid facing the first conductive layer of the circuit board; in that the contacts located on an outer edge of the second grid are each connected to an associated conductor track of the first conductive

Layer of the circuit board are electrically connected; in that the contacts of the inner row of the first grid adjacent to the outer edge are each electrically connected to a conductor track of an inner conductive layer located below the first layer with respect to the first surface of the printed circuit board; in that the contacts of the inner row of the second grid adjacent to the outer edge are each connected to an associated conductor track of the inner conductive layer the circuit board are electrically connected. This embodiment ensures a particularly compact

Expansion of the contact grid with minimized signal paths between the contacts of the first grid and the contacts of the second grid.

If the contact grids have more than four rows, it is particularly advantageous if the contacts of each other within the preceding row of the first grid

each row of contacts are each electrically connected to a track of another electrically conductive layer located below the preceding electrically conductive layer, and if the contacts of each other within the preceding row of the second

Rasters located row of contacts are each electrically connected to an associated trace of the further electrically conductive layer. Through this also repeatedly realizable repetition of the Kontaktierungsprinzips the individual rows of contacts with the individual PCB layers, ie the individual contained in a circuit board

electrically conductive layers, and contact grid can be expanded, which consist of a plurality of contact rows. It is particularly advantageous if a one-to-one relationship exists between the contacts of the first grid and the contacts of the second grid, so that each contact of the second grid with respect to the other contacts occupies the same relative position as the contact connected to it of the first grid with respect to the other contacts in the first grid.

A particularly advantageous embodiment of the

Contacting device according to the invention is characterized in that between two adjacent and with

Contacts connected electrically conductive layers of the Printed circuit board at least one with a ground potential

connected electrically conductive layer is provided. By means of this at least one electrically conductive layer connected to a ground potential, a shield is created between two signal-transmitting conductive layers of the printed circuit board.

It is particularly advantageous if, on both sides of an electrically conductive layer connected to contacts

Printed circuit board is provided in each case at least one electrically conductive layer connected to a ground potential. This embodiment, wherein at least one with a

Ground potential connected electrically conductive layer is provided on each side of a signal-transmitting layer, it is possible, via individual contacts RF signals or even signals from an even higher frequency band

to be transmitted without interference.

A particularly advantageous mechanical design

is characterized in that the adapter device is arranged in a recess of the receiving device or received in the receiving device. At this

Embodiment is the adapter device by the

Recording device protected from external influences from the outside.

This protection can be improved in particular by the fact that the receiving device for direct mechanical

Connection is formed with the application device. As an alternative to the arrangement of the adapter device in one

Recess of the receiving device, the

Adapter device in a recess with the

Recording device to be connected to the application device be provided. Again, it may be beneficial if the

Receiving device for direct mechanical connection with the application device is designed to the

Isolate adapter device against external influences.

The invention will be explained in more detail by way of examples with reference to the drawing; 1 shows a perspective view of a measuring adapter from the prior art;

FIG. 2 is a sectional view of the measuring adapter of FIG. 1; FIG. Fig. 3 is an enlarged view of a

Spring contact pin (pogopins);

Fig. 4 is an external perspective view of an arrangement with an inventive

Contacting device;

Fig. 5 is a sectional drawing of the invention

Arrangement of FIG. 4; Fig. 6, the SchnittZeichnung of Fig. 5 in the

Receiving device inserted electronic component;

Fig. 7 shows an alternative embodiment of the in the figures

5 and 6 shown arrangement in separated representation;

Fig. 8 shows the embodiment of Fig. 7 in mounted

Status; 9A shows a side view of an adapter device of the contacting device according to the invention;

9B is a plan view of the adapter device of

Fig. 9A in the direction of the arrow IX on the side with the expanded contact grid;

10 is a schematic representation of a

Vertical section through the adapter device shown in Figures 9A and 9B along the section line X-X;

11 is a plan view of the adapter device of

Fig. 9A in the direction of the arrow XI;

Fig. 12 is a to that shown in Figures 7 and 8

Embodiment alternative embodiment of the contacting device according to the invention;

FIG. 13 shows a variant of that shown in FIG. 12

embodiment;

Fig. 14 is an external perspective view of another

Arrangement with an inventive

Contacting device;

Fig. 15 is a sectional drawing of the invention

Arrangement of Fig. 14;

Fig. 16, the SchnittZeichnung of Fig. 15 with in the

Receiving device inserted electronic component;

Fig. 17 shows yet another embodiment in the

Sectional view; Fig. 18 shows a first variant of a known

FIG. 19 shows an alternative embodiment to FIG. 14. FIG.

In Fig. 4 a contacting device according to the invention is shown, in which between the receiving device 1 for the electronic component to be tested 3 and the

Application device 2, which is formed in the example shown by a test interface board, an adapter device 6 is provided, which will be described in more detail below. Figures 5 and 6 show the mechanical assembly of

Adapter device 6 between the receiving device 1 and the application device 2. The receiving device 1 is provided with an upper recess 10 into which the electronic component 3 can be inserted accurately such that the provided on the underside of the component 3 contacts 30 with first contacts 50 of in the receiving device 1 inserted spring pins 5 (Pogopins) can get into electrically conductive contact. The spring pins 5 penetrate the receiving device 1 in the vertical direction and have at their end facing away from the first contacts 50 second contacts 52, which for electrical contact with on the top of the

Adapter means 6 provided component-side contacts 60 are electrically conductively connected.

At the bottom of the adapter device 6, the

Application device 2 facing, are at the

Adapter device 6 application-side contacts 62nd

provided, each with an associated component-side electrical contact 60 are electrically conductively connected.

On the upper side of the application device 2 are also provided connection contacts 20, which are for electrical

Contacting with the application-side contacts 62 of the adapter device 6 are formed. In Fig. 6 it can be seen how the individual contact pairings in the assembled state of the arrangement of contacting device and

Application device with each other in electrical

Contact contact, wherein the individual components are clamped together with screws 4.

FIGS. 7 and 8 show an alternative second embodiment to that shown in FIGS. 5 and 6

Embodiment in which the application device 2 is provided with a recess 22 into which the

Adapter device 6 is flush. Functionally, there is no difference between the first embodiment of FIGS. 5 and 6 and the second embodiment of FIGS. 5 and 8.

Fig. 9A shows a side view of one

Adapter device 6, in which the component-side contacts 60 and the application-side contacts 62 are clearly visible, wherein the individual contacts are each formed by a Päd.

Fig. 9B shows the adapter device 6 of Fig. 9A in the view from below, so on the application side

Contacts 62. It can be clearly seen that the contacts 62 are arranged in a plurality of parallel aligned rows in a square shape with a contact distance a. The contacts 62 thus form a first

Contact grid Rl with a pitch a, which in both

Extension directions of the grid Rl is the same. FIG. 11 shows the adapter device 6 from FIG. 9A in a plan view of the component-side contacts 60, which are arranged in a grid-like manner in the same manner as FIG

application-side contacts 62, but this second grid R2 of the component-side contacts 60 a

Contact distance b, which is less than that

Contact distance a between the application side

Contacts 62.

The component-side contacts 60 are connected to the application side via electrically conductive connection devices 64

Contacts 62 so electrically connected, that each component-side electrical contact 60 via a him

associated electrically conductive connection device 64 with one located at the same grid position

application-side contact 62 is electrically conductively connected. This is schematically illustrated in a section through the adapter device 6 shown in FIGS. 9A, 9B and 11 in FIG.

The adapter device 6 has a multilayer board 61 (ultilayer board) with in the example shown eight conductive layers LI to L8. The component-side contacts 60 located on the outer edge of the first, upper grid R 1 are each connected to a conductor track 64 'of a first conductive layer L 1 facing the first grid R 1. This conductive layer LI is connected via a conventionally metallized bore 64 "to an associated one

application-side contact 62 on the outer edge of the second grid R2 in electrically conductive connection. The

Contacts 60 'of the outer edge adjacent inner row of the first grid Rl are each provided with a conductor 65' of a respect to the first surface of the circuit board 61 below the first electrically conductive layer LI

located inner electrically conductive layer L2 electrically connected. For this purpose, the contact 60 'has a metallized hole 65 "in a conventional manner, which electrically contacts the conductor track 65' in the interior of the printed circuit board 61. The conductor track 65 * is furthermore remote from the latter

Surface leading metallized bore 65 '' ¹ with an associated contact 62 'on the outer edge

adjacent inner row of the second grid Rl connected so that an electrically conductive connection between the contact 60 'and the contact 62' is made. In this way, all component-side contacts of the first

Contact grids Rl with one at the same

Grid position located application side contact of the second grid R2 connected. Fig. 12 shows in section a third variant of

inventive arrangement, where there the

Adapter device 6 in a recess on the

Application device 2 facing the underside of

Recording device 1 is included. This is also the case with the embodiment according to FIG. 13, where additional fitting screws 4 'are provided there, which constitute the

Fix adapter device 6 on the receiving device 1 and position. 14 shows an alternative embodiment, in which the measuring adapter 1 is divided into an upper part 1 'and a lower part 1 ". The adapter device 6 is inserted between the upper part 1' and the lower part 1", as also in FIGS 16, which show this embodiment in section.

In Fig. 15 and Fig. 16 is in sectional drawings

shown how the individual components make the mechanical adjustment. The exemplified device 3 (BGA-256) with a pitch of 0.30 mm is with his

Original pitch of 0.30 mm in the measuring adapter shell 1 ' added. The contacting takes place via upper Pogopins 5 to the underlying formed as a printed circuit board

Adapter device 6. The PCB makes the mechanical adjustment from 0.30 mm to a pitch of 0.60 mm. The pitch of 0.60 mm is over lower pogopins 9 over the

Transfer measuring adapter lower part 1 "to the test interface board 2. All three components 1 ', 6 and 1" are placed on the

Test interface board 2 mounted. The upper and lower

Pogopins 5 and 9 differ only in size or in diameter.

A further alternative embodiment is shown in FIG. 17, where the adapter device 6 in the

Receiving device 1 is received and arranged immediately below the receptacle 10 for the block 3. In this embodiment, a direct contact without Pogopins is shown by way of example.

According to the invention, the adaptation or

Expansion of the mechanical limits, as in FIG. 10

represented by a very thin variable circuit board 61 for grid extension. At this very thin variable

Printed circuit board 61 are smallest bore diameter

production technology possible.

The component 3 (for example BGA-256) with a pitch of

0.30mm comes in. With its original pitch of .30mm

Measuring adapter 1 added. The contacting takes place via Pogopins 5 to the upper side of the underlying printed circuit board 61 of the adapter device 6. The variable printed circuit board makes the mechanical adaptation from a pitch of 0.30 mm to a pitch of 0.60 mm. The pitch of 0.60 mm is from the bottom of the variable board to

Tester interface board 2 transferred. Through this grid extension in the variable

PCB 61 can now also electronic components with a small pitch on thick Testerinterfaceboards be measured.

The technology for implementing or adapting the pitch is made possible by the variable printed circuit board 61. Depending on the adaptation, then almost all of today and

realized on future component grid and on

different thickness Testerinterfaceboards 2 are implemented.

This variable printed circuit board 61 is flexible in so far as many different grids can be adapted with this principle. The pitch of, for example, 0.30 mm could just as well be set to, for example, 0.50 mm or 1.00 mm or 1.50 mm or other values, depending on the thickness of the

used tester interface boards. The raster extension allows larger bore diameters in the tester interface board. This will be the

Manufacture of thick tester interface boards and the measurement of electronic components with a small pitch on thick

Tester interface boards only possible.

The invention is not limited to the above embodiment, which merely serves to generally explain the essence of the invention. As part of the

Scope of protection, the device of the invention may assume other than the above-described embodiments. In this case, the device can in particular have features which are a combination of the respective ones

Represent individual features of the claims. Reference signs in the claims, the description and the drawings are only for the better understanding of the invention and are not intended to limit the scope.

Claims

New International Patent Application (PCT)

Applicant: PRO DESIGN Electronic GmbH, BRUCKMÜHL

Lawyer's file: P 1054

February 18th, 2011

claims

1. contacting device for electrically connecting electronic components with an application device, in particular a test device, with

a receiving device (1) which has a receptacle (10) for at least one electronic component (3) to be tested, which on at least one side has a

Variety of arranged in a grid

having electrical contacts (30); and

an adapter device (6) provided between the receptacle (10) and the application device (2);

wherein the adapter means (6) component side

Having contacts (60), each one

associated electrical contact (30) of the component (3) and with these contacts (30) are electrically conductively connected, and

wherein the adapter device (6) has electrically conductive connecting devices (64, 65), each of which has a component-side electrical

Contact (60, 60 ') with an associated one

connect application side contact (62, 62 ');

characterized ,

that the component-side contacts (60, 60 ') in a first grid (Rl) and the application-side contacts (62, 62') in a second grid (R2) are arranged and

that the respective grid spacing (a) of

Contacts (62, 62 ') of the second grid (R2) is greater than the respective grid spacing (b) of

Contacts (60, 60 ') of the first grid (Rl). Contacting device according to claim 1,

characterized ,

that the receiving device (1) arranged in a grid contacting elements (5), di on the one hand in each case an electrical contact (30) of the component (3) and on the other hand in each case a component-side electrical contact (60, 60 ') of the adapter device (6) assigned and can be electrically connected with these contacts.

Contacting device according to claim 1 or 2, characterized in that it e e c e n e,

the adapter device (6) is a multilayered one

Printed circuit board (61).

Contacting device according to claim 3,

characterized ,

that the contacts (60) of the first grid (Rl) are arranged on a first surface of the printed circuit board (61) and

in that the contacts (62) of the second grid (R2) are arranged on a second surface of the printed circuit board (61) remote from the first surface.

Contacting device according to claim 3 or 4, characterized g e n e c e c e s t e,

in that the number of conductive layers (LI to L8) of the printed circuit board (61) corresponds to at least half of the maximum number of adjacent rows of the grid (Rl).

Contacting device according to claim 3, 4 or 5, characterized in that it e e c e n e,

in that the contacts (60) situated on an outer edge of the first grid (Rl) are each provided with a Conductor track (64 ') of the first grid (Rl) facing first conductive layer (LI) of

Printed circuit board (61) are electrically connected;

that at one outer edge of the second

Rasters (R2) located contacts (62) each with an associated conductor track (64 ') of the first conductive layer of the circuit board electrically

are connected;

that the contacts (60 ¹ ) of the outer edge

adjacent inner row of the first grid (R1) are each electrically connected to a trace (65 ') of an inner conductive layer (L2) located with respect to the first surface of the printed circuit board (61) below the first layer (LI);

that the contacts (62 ') of the outer edge

adjacent inner row of the second grid (R2) are each electrically connected to an associated conductor track (65 ') of the inner conductive layer (L2) of the printed circuit board (61).

Contacting device according to claim 6,

characterized ,

that the contacts of each other within the previous row of the first grid (Rl)

a number of contacts, each with a

Track another, below the

preceding electrically conductive layer located electrically conductive layer are electrically connected and

that the contacts of each other within the previous row of the second grid (R2)

lying row of contacts are each electrically connected to an associated conductor track of the further electrically conductive layer.

8. contacting device according to claim 6 or 7,

characterized ,

that between the contacts (60, 60 ') of the first

Rasters (Rl) and the contacts (62, 62 ') of the second grid (R2) is a one-to-one relationship, so that each contact of the second grid (R2) with respect to the other contacts occupies the same relative position as the Contact of the first grid (R1) connected to it with respect to the other contacts in the first grid (R1).

9. contacting device according to one of

Claims 3 to 8,

characterized ,

that between two adjacent and with contacts

connected electrically conductive layers of

Printed circuit board (61) is provided at least one connected to a ground potential electrically conductive layer.

10. contacting device according to one of

Claims 3 to 9,

characterized ,

that on both sides of a connected with contacts

electrically conductive layer of the printed circuit board (61) in each case at least one with a ground potential

connected electrically conductive layer is provided.

11. contacting device according to one of the preceding claims,

characterized ,

in that the adapter device (6) is arranged in a recess (12) of the receiving device (1) or in the

Recording device (1) is included.

12. contacting device according to claim 11,

characterized ,

that the Aufmeeinrichtung (1) for direct mechanical connection with the application device (2) is formed.

13. Arrangement of a contacting device (1,6) according to one of the preceding claims and a

Application device (2),

characterized ,

that the application device (2) with a

Recess (22) for receiving the adapter device (6) is provided.

14. Arrangement according to claim 13,

characterized ,

that the receiving device (1) for direct

mechanical connection with the application device (2) is formed.