WO2007055455A1 - Transparent light emitting apparatus and manufacturing method thereof - Google Patents
Transparent light emitting apparatus and manufacturing method thereof Download PDFInfo
- Publication number
- WO2007055455A1 WO2007055455A1 PCT/KR2006/003021 KR2006003021W WO2007055455A1 WO 2007055455 A1 WO2007055455 A1 WO 2007055455A1 KR 2006003021 W KR2006003021 W KR 2006003021W WO 2007055455 A1 WO2007055455 A1 WO 2007055455A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- transparent
- transparent board
- electrode
- board
- electro
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 239000000853 adhesive Substances 0.000 claims abstract description 55
- 230000001070 adhesive effect Effects 0.000 claims abstract description 55
- 239000011248 coating agent Substances 0.000 claims abstract description 19
- 238000000576 coating method Methods 0.000 claims abstract description 19
- 239000000945 filler Substances 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 21
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 18
- 229910052709 silver Inorganic materials 0.000 claims description 18
- 239000004332 silver Substances 0.000 claims description 18
- 239000007788 liquid Substances 0.000 claims description 16
- 229920000642 polymer Polymers 0.000 claims description 5
- 238000007650 screen-printing Methods 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 3
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 3
- 238000010329 laser etching Methods 0.000 claims description 3
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 11
- 230000000007 visual effect Effects 0.000 abstract description 5
- 239000000463 material Substances 0.000 description 7
- 239000002390 adhesive tape Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 238000001723 curing Methods 0.000 description 4
- 239000005341 toughened glass Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 229910052754 neon Inorganic materials 0.000 description 2
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 238000001029 thermal curing Methods 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010014357 Electric shock Diseases 0.000 description 1
- 206010044565 Tremor Diseases 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
- B32B17/10036—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10165—Functional features of the laminated safety glass or glazing
- B32B17/10174—Coatings of a metallic or dielectric material on a constituent layer of glass or polymer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10165—Functional features of the laminated safety glass or glazing
- B32B17/10174—Coatings of a metallic or dielectric material on a constituent layer of glass or polymer
- B32B17/10183—Coatings of a metallic or dielectric material on a constituent layer of glass or polymer being not continuous, e.g. in edge regions
- B32B17/10192—Coatings of a metallic or dielectric material on a constituent layer of glass or polymer being not continuous, e.g. in edge regions patterned in the form of columns or grids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10165—Functional features of the laminated safety glass or glazing
- B32B17/10541—Functional features of the laminated safety glass or glazing comprising a light source or a light guide
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10761—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing vinyl acetal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10788—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing ethylene vinylacetate
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Definitions
- the present invention relates to a transparent light emitting apparatus, and more particularly to a transparent light emitting apparatus that is operable under low power consumption, and to a method of manufacturing the transparent light emitting apparatus, wherein the light emitting apparatus has a long life span and various visual aesthetic effects including an effect based on a transparent property.
- outdoor electrically-illuminated signs use a neon lamp, a cold cathode lamp (CCL), and a light emitting diode (LED), etc., as their light sources.
- Indoor electrically-illuminated signs employ an external electrode fluorescent lamp (EEFL), a cold cathode fluorescent lamp, and a light emitting diode (LED) as their light sources.
- EEFL external electrode fluorescent lamp
- LED light emitting diode
- the neon lamp or the CCL must be driven at high voltage power, thereby consuming a lot of power, causing risk of electric shock and fire, and reducing its life span.
- the EEFL or the CCFL is not appropriate for an outdoor light emitting apparatus in that it must be operated at a high frequency.
- the EEFL or the CCFL also has disadvantages in that its illumination is low and its life span is relatively short.
- the light emitting apparatuses are not only used for lighting functions but also for advertising. They are also designed to include aesthetic components, thereby widely used in interiors.
- the present invention has been made in view of the above problems, and it is an object of the present invention to provide a transparent light emitting apparatus that is operable under low power consumption and a method of manufacturing the transparent light emitting apparatus, wherein the transparent light emitting apparatus has a long life span and various visual aesthetic effects including an effect based on a transparent property.
- the above and other objects can be accomplished using a manufacturing method of a transparent light emitting apparatus having at least one or more light emitting diodes each of which has at least two or more electrodes, comprising: coating a transparent electrode on one side of a first transparent board; forming electrode dividing portions which divide the transparent electrode into a plurality of electrode regions which are electrically isolated from each other by removing a predetermined region from the transparent electrode to form a circuit pattern on the transparent electrode coated on the first transparent board; coating an electro-conductive adhesive to a predetermined position of the plurality of electrode regions, to which at least two or more electrodes of the LED are adhered, respectively; coating a non-electro-conductive adhesive to the electrode dividing portions to fix the LEDs, which form boundaries among the plurality of electrode regions to which at least two or more electrodes of the LED are adhered; adhering at least two or more electrodes of the LED to the plurality of electrode regions by using the electro-conductive adhesive in a state where
- the transparent electrode is made of one of Indium Tin Oxide (ITO) and
- Indium Zinc Oxide (IZO); and forming electrode dividing portions comprises one of: forming the electrode dividing portions by an etching process using a screen mask on which pattern corresponding to the plurality of electrode regions and the electrode dividing portions are formed; and forming the electrode dividing portions by a laser etching process.
- IZO Indium Zinc Oxide
- a manufacturing method of a transparent light emitting apparatus having at least one or more LEDs each of which has at least two or more electrodes comprising: printing circuit patterns of a plurality of electrode regions and electrode dividing portions on a first transparent board using a silk screen on which the circuit patterns are formed, with transparent liquid polymer, so that the plurality of electrode regions and the electrode dividing portions electrically isolating the respective electrode regions are formed on one side of the first transparent board; coating an electro-conductivity adhesive to a predetermined position of the plurality of electrode regions, to which at least two or more electrodes of the LED are adhered, respectively; coating a non- electro-conductive adhesive to the electrode dividing portions to fix the LEDs, which form boundaries among the plurality of electrode regions to which at least two or more electrodes of the LED are adhered; adhering at least two or more electrodes of the LED to the plurality of electrode regions by using the electro-conductive adhesive in a state where the LEDs are adhered to the
- the electro-conductive adhesive comprises silver paste; and coating electro- conductive adhesive comprises coating the silver paste to the plurality of electrode regions by a screen printing process.
- forming the power supply line comprises one of: forming the power supply line by adhering a single sided or both sided electro-conductive tapes to the first transparent board; and forming the power supply line by printing silver paste on the first transparent board by screen printing process.
- adhering the second transparent board to the first transparent board comprises one of: adhering the second transparent board to the first transparent board through lamination in a state where a filler is filled between the first transparent board and the second transparent board; and adhering the second transparent board to the first transparent by vacuum pressing and thermally curing in a state where a filler is filled between the first transparent board and the second transparent board.
- adhering the second transparent board to the first transparent board comprises one of: adhering edges of the first transparent board and the second transparent board to each other using both sided tape so that the first transparent board and the second transparent board are spaced apart from each other at a predetermined distance; injecting a liquid filler of resins between the first transparent board and the second transparent board; sealing the four edges of the first transparent board and the second transparent board; and curing the liquid filler injected between the first transparent board and the second transparent board.
- a transparent light emitting apparatus having at least one or more LEDs each of which has at least two or more electrodes, comprising: a first transparent board and a second transparent board being spaced apart from each other and facing each other; a transparent electrode coated on the face of the first transparent board, which faces the second transparent board; electrode dividing portions dividing the transparent electrode into a plurality of electrode regions which are electrically isolated from each other, such that the transparent electrode forms a circuit pattern supplying power to the LEDs; an electro-conductive adhesive adhering the two or more electrodes of the LED to the two or more electrode regions among the plurality of electrode regions, re- spectively; a non-electro-conductive adhesive being provided to the electrode dividing portions which dividing the electrode regions to which at least two or more electrodes of the LED are adhered and adhering the LEDs to the electrode dividing portions; a power supply line supplying external power to the LEDs through the electrode regions; and a filler being filled between
- the non-electro-conductive adhesive is protruded from the first transparent board toward the LEDs more than the electrode regions.
- the present invention provides the transparent light emitting apparatus, which is operable under low power consumption, has a long life span and various visual aesthetic effects including an effect based on a transparent property, and includes the manufacturing method of the transparent light emitting apparatus.
- the present invention provides the transparent light emitting apparatus which can prevent the electrodes of LEDs from shorting by an electro-conductive adhesive and adhere the LEDs to the first transparent board while and after it is manufactured, and the manufacturing method the transparent light emitting apparatus.
- FIG. 1 is a perspective view illustrating a transparent light emitting apparatus according to the present invention
- Fig. 2 is a cross-sectional view taken along lines II-II of Fig. 1;
- Fig. 3 and Fig. 4 are examples of circuit patterns formed on a first transparent board of a transparent light emitting apparatus according to the present invention.
- FIG. 5 is view for describing a manufacturing method of the transparent light emitting apparatus according to the present invention. Best Mode for Carrying Out the Invention
- the transparent light emitting apparatus 1 comprises at least one or more light emitting diodes (LEDs) 30, a first transparent board 10, a second transparent board 20, a transparent electrode 40, electrode dividing portions 43, an electro-conductive adhesive 80, a non- electro-conductive adhesive 50, power supply line 60, and filler 70.
- LEDs light emitting diodes
- the LEDs 30 serves as a source of the transparent light emitting apparatus 1.
- a surface mount device (SMD) chip LED thereby enhancing its transparency, implements the transparent light emitting apparatus according to the present invention.
- the LEDs 30 may be implemented by one of a 2-pin single-color LED, a 4-pin
- 2-chip 3-color LED or a 4-pin 3-chip full-color LED.
- the present invention will be described based on the 2-pin single-color LED, i.e., an LED having two-electrodes 31.
- the first transparent board 10 is shaped as a plate made of transparent materials, such as transparent glass, poly carbonate (PC) or acrylic.
- the first transparent board 10 according to the present invention is shaped as an approximately rectangular plate and made of glass, as an example.
- the second transparent board 20 is formed corresponding to the form of the first transparent board 10, and, like the first transparent board 10, made of transparent materials such as transparent glass, PC, or acrylic.
- the form of the second transparent board 20 will not be limited by that of the first transparent board 10. Namely, the second transparent board 20 does not have to be the same form as the first transparent board 10 nor corresponds to the form of first transparent board 10.
- the first transparent board 10 and/or the second transparent board 20 are made of transparent glass materials
- the first transparent board 10 and/or the second transparent board 20 may be made of half tempered glass materials.
- a curving phenomenon which occurs when the first transparent board 10 and/or the second transparent board 20 are made of fully tempered glass materials is prevented.
- the first transparent board 10 and/or the second transparent board 20 made of half tempered glass can minimize increase of resistance of transparent electrode 40 more than those made of fully tempered glass.
- the transparent electrode 40 is coated on the face of the first transparent board 10, facing the second transparent board 20.
- the transparent electrode 40 coated on the first transparent board 10 is divided into a plurality of electrode regions 41a and 41b, which are electrically isolated to each other by the electrode dividing portions 43.
- the plurality of electrode regions 41a and 41b divided by the electrode dividing portions 43 form circuit patterns to supply power to the LEDs 30.
- Fig. 3 shows a circuit pattern formed by four electrode regions 41a, 41b, 41c, and 4 Id which can supply power in series to the LEDs 30, and
- Fig. 4 shows a circuit pattern formed by two electrode regions 41a' and 41b' which supplies power in parallel to the LEDs 30.
- the transparent electrode 40 according to the present invention is made of
- ITO Indium Tin Oxide
- IZO Indium Zinc Oxide
- liquid polymer liquid polymer
- the LEDs 30 is adhered over at least two or more of the electrode regions 41a and 41b by the electro-conductive adhesive 80.
- the present invention will be described based on a transparent light emitting apparatus employing the LEDs 30, which have two electrodes 31. As shown in Fig. 2 to Fig. 4, the electrodes 31 of the LEDs 30 are adhered to the electrode regions 41a and 41b adjacent to each other, respectively, by the electro-conductive adhesive 80.
- the present invention will be described based on an example where the electro-conductive adhesive 80 is implemented by silver conductor or silver paste.
- the types of the silver conductor or the silver paste are properly selected such that the electro-conductive adhesive 80 can be coated onto the transparent electrode 40 through a screen print process, which will be described later.
- the silver conductor or the silver paste suitable for the screen print process preferably has a suitable viscosity of 100 ⁇ 150kcps and a low surface resistance of 50m/sq whose conditions make it adhere to glass well.
- the present invention will be described based on an example in which silver paste has a viscosity of 100 ⁇ 150kps and a conductive epoxy adhesive as an electro-conductive adhesive is used, such that adhesive force can be maintained while filler 70 is filled through laminating processes, etc.
- the non-electro-conductive adhesive 50 is positioned at the electrode dividing portions 43 which electrically isolate the electrode regions 41a and 41b, to which two electrodes 31 of the LED 30 are each correspondingly adhered.
- the non-electro-conductive adhesive 50 is positioned between part of the body of the LED 30 and part of the first transparent board 10, in which the electrode dividing portions 43 are formed, thereby adhering the LED 30 thereto.
- such a process can prevent the LED 30 from changing its adhesion position, which is caused by vibration or trembling of the LED 30 while the LED 30 is adhered to the electrode regions 41a and 41b of the transparent board 10 or when the filler 70 is inserted between the first and the second transparent boards 10 and 20.
- the non-electro-conductive adhesive 50 serves to prevent the two electrode regions 41a and 41b from being electrically connected, which is called an electrical short.
- such connection is made as the electro-conductive adhesive 80 coated on the electrode regions 41a and 41b flows between the two electrode regions 41a and 41b while adhering the two electrodes 31 of the LED 30 to the electrode regions 41a and 41b by the electro-conductive adhesive 80.
- the non- electro-conductive adhesive 50 is formed such that it is protruding from the surface of the first transparent board 10 forming the electrode dividing regions 43 toward the LED 30 more than that of the electrode regions 41a and 41b.
- the power supply line 60 supplies external power to the LED 30 through the electrode regions 41a and 41b.
- the present invention will be described b ased on a transparent light emitting apparatus 1, whose power supply line 60 is formed along the edge of the first transparent 10.
- the power supply line 60 may be implemented as a pad type in a predetermined area of the electrode regions 41a and 41b.
- the power supply line 60 may be implemented by single-sided or both sided electro-conductive adhesive tape, which is made of copper, aluminum or silver paste. Also, the power supply line 60 may be implemented by silver paste using a screen print method.
- the filler 70 is filled between the first transparent board 10 and the second transparent board 20 to fix the first transparent board 10 and the second transparent board 20 in a state where the first transparent board 10 and the second transparent board 20 are spaced apart from each other at a predetermined distance.
- a PVB film, an EVA film, and liquid filler such as resins implements the filler 70 according to the present invention.
- the transparent light emitting apparatus 1 of the present invention emits lights as to whether power is supplied to the transparent light emitting apparatus 1 through the power supply line 60.
- the first transparent board 10 is prepared. And then, the transparent electrode 40 is coated on the first transparent board 10.
- the coating of the transparent electrode 40 is achieved with a sputtering method.
- the electrode dividing portions 43 are formed, such that the transparent electrode 40 coated on the first transparent board 10 is divided into the plurality of electrode regions 41a and 41b.
- the transparent electrode 40 is partially removed by a screen mask. Namely, circuit patterns including the plurality of electrode regions 41a and 41b and electrode dividing portions 43 are formed on the first transparent board 10 through an etching process using a screen mask having patterns corresponding to the plurality of electrode regions 41a and 41b and the electrode dividing portions 43.
- the transparent electrode 40 may be partially removed to form the electrode dividing portions 43 by a laser etching method using lasers, such as an NdYag laser or a UV laser.
- the electro-conductive adhesive 80 is coated to the predetermined position of the electrode regions 41a and 41b, to which the electrodes 31 of the LED 30 are adhered.
- the silver paste may be used as the electro-conductive adhesive 80 and coated through a screen print method to the predetermined position of the electrode regions 41a and 41b, to which the electrodes 31 are adhered.
- the non-electro-conductive adhesive 50 is coated to parts of the face of the first transparent board 10, in which the electrode dividing portions 43 forming boundaries between the electrode regions 41a and 41b are formed, that is, to parts in which the body of the LED 30 is positioned.
- the coating order between the electro-conductive adhesive 80 and the non-electro-conductive adhesive 50 can be changed and then performed.
- the LED 30 is positioned on the electrode regions 41a and 41b of the first transparent board 10 so that the electrodes 31 of the LED 30 are adhered to the electro- conductive adhesive 80 and the body of the LED 30 can be adhered to the non- electro-conductive adhesive 50.
- the electro-conductive adhesive 80 is thermally cured so that the electrodes 31 may be adhered on the electrode regions 41a and 41b.
- the thermal curing is preferably performed at a curing temperature and in a curing time to comply with the characteristics of silver paste used as the electro-conductive adhesive 80.
- the thermal curing may be performed for 30 ⁇ 60min, maintaining a temperatures of 120C which will not damage the LED 30.
- the single sided or both sided electro-conductive adhesive tape is adhered to the transparent electrode 40 to form the power supply line 60.
- the power supply line 60 may be formed when silver paste is printed by a screen printing method.
- the power supply line 60 is 2 ⁇ 5mm in width at the edge of the transparent electrode 40.
- the first and the second transparent boards 10 and 20 are adhered to each other in a state where the filler 70 is filled therebetween. This process is described as follows.
- the first and the second transparent boards 10 and 20 are adhered to each other in a state where the PVB film is filled therebetween through lamentation.
- the first transparent board lOand the second transparent board 20 are adhered to each other by vacuum pressure. More specifically, the first transparent board 10 and the second transparent board 20, between which the EVA film is positioned, are pressed in a vacuum state to remove the air between them, and then are thermally cured. So the first transparent board 10 and the second transpare nt board 20 are adhered to each other in a state where the filler 70 is filled therebetween.
- the first transparent board 10 and the second transparent board 20 are adhered to each other using a transparent both sided adhesive tape. More specifically, the transparent double- sided adhesive tape, having a thickness of 2 ⁇ 5mm, is attached to the four edges of the first transparent board 10. Then, the second transparent board 20 is positioned to the first transparent board 10 so that they are adhered to each other by the transparent both sided adhesive tape. Thereafter, the adhered first and second transparent boards 10 and 20 are tilted at a predetermined angle and then with a nozzle, the liquid filling material is injected into the gap formed between the first transparent board 10 and the second transparent board 20.
- the opening of the gap is sealed so as not to leak the liquid filler.
- the first and the second transparent boards with the liquid filler is put into a UV curing furnace for a predetermined time, for example 30 ⁇ 60min, so the liquid filler can be cured by UV -ray.
- the foregoing description is about a method of manufacturing the transparent light emitting apparatus 1, where the transparent electrode 40 are coated to the first transparent board 10; some portions to form the electrode dividing portions 43 are removed from the transparent electrode 40 to form the electrode regions 41a and 41b and the electrode dividing portions 43, as shown in Fig. 5.
- the skilled person can easily appreciate that, when transparent liquid polymer is used as the transparent electrode 40, The electrode regions 41a and 41b and the electrode dividing portions 43 may be formed, as transparent liquid polymer is printed on the first transparent board 10 using a silkscreen on which patterns corresponding to the electrode regions 41a and 41b and the electrode dividing portions 43 are formed.
- the present invention can be widely applied to a transparent light emitting apparatus and to a method of manufacturing the transparent light emitting apparatus. This is because the transparent light emitting apparatus according to the present invention is manufactured to be operable under low power consumption, is designed to have a long life span, and to have various visual aesthetic effects including an effect based on a transparent property.
Abstract
The present invention relates to a transparent light emitting apparatus and a manufacturing method thereof. The manufacturing method of a transparent light emitting apparatus having at least one or more light emitting diodes each of which has at least two or more electrodes, comprising: coating a transparent electrode on one side of a first transparent board; forming electrode dividing portions which divide the transparent electrode into a plurality of electrode regions which are electrically isolated from each other by removing a predetermined region from the transparent electrode to form a circuit pattern on the transparent electrode coated on the first transparent board; coating an electro-conductive adhesive to a predetermined position of the plurality of electrode regions, to which at least two or more electrodes of the LED are adhered, respectively; coating a non-electro-conductive adhesive to the electrode dividing portions to fix the LEDs, which form boundaries among the plurality of electrode regions to which at least two or more electrodes of the LED are adhered; adhering at least two or more electrodes of the LED to the plurality of electrode regions by using the electro-conductive adhesive in a state where the LEDs are adhered to the non-electro-conductive adhesive; forming a power supply line supplying external power to the LEDs through the plurality of electrode regions; and adhering a second transparent board to the first transparent board, wherein the second transparent board is spaced apart from the first transparent board at a predetermined distance and faces the first transparent board. The transparent light emitting apparatus is operable under low power consumption, has a long life span, and has various visual aesthetic effects including an effect based on a transparent property. Also, the transparent light emitting apparatus can prevent the electrodes of LEDs from shorting by utilizing an electro-conductive adhesive, which adheres the LEDs to the first transparent board while and after it is manufactured.
Description
Description
TRANSPARENT LIGHT EMITTING APPARATUS AND MANUFACTURING METHOD THEREOF
Technical Field
[1] The present invention relates to a transparent light emitting apparatus, and more particularly to a transparent light emitting apparatus that is operable under low power consumption, and to a method of manufacturing the transparent light emitting apparatus, wherein the light emitting apparatus has a long life span and various visual aesthetic effects including an effect based on a transparent property. Background Art
[2] In general, outdoor electrically-illuminated signs use a neon lamp, a cold cathode lamp (CCL), and a light emitting diode (LED), etc., as their light sources. Indoor electrically-illuminated signs employ an external electrode fluorescent lamp (EEFL), a cold cathode fluorescent lamp, and a light emitting diode (LED) as their light sources.
[3] Here, the neon lamp or the CCL must be driven at high voltage power, thereby consuming a lot of power, causing risk of electric shock and fire, and reducing its life span. The EEFL or the CCFL is not appropriate for an outdoor light emitting apparatus in that it must be operated at a high frequency. The EEFL or the CCFL also has disadvantages in that its illumination is low and its life span is relatively short.
[4] When an electrically illuminated sign employs the LEDs, lights must be emitted from only one face because the others sides must be covered to shield the LEDs' wires or screened to inhibit leakage of light.
[5] Meanwhile, the light emitting apparatuses are not only used for lighting functions but also for advertising. They are also designed to include aesthetic components, thereby widely used in interiors.
[6] The conventional light emitting apparatuses, however, are restricted aesthetically, because the sizes of lamps and supporting stands must be limited. Disclosure of Invention
Technical Problem
[7] Therefore, the present invention has been made in view of the above problems, and it is an object of the present invention to provide a transparent light emitting apparatus that is operable under low power consumption and a method of manufacturing the transparent light emitting apparatus, wherein the transparent light emitting apparatus has a long life span and various visual aesthetic effects including an effect based on a transparent property. Technical Solution
[8] In accordance with an aspect of the present invention, the above and other objects can be accomplished using a manufacturing method of a transparent light emitting apparatus having at least one or more light emitting diodes each of which has at least two or more electrodes, comprising: coating a transparent electrode on one side of a first transparent board; forming electrode dividing portions which divide the transparent electrode into a plurality of electrode regions which are electrically isolated from each other by removing a predetermined region from the transparent electrode to form a circuit pattern on the transparent electrode coated on the first transparent board; coating an electro-conductive adhesive to a predetermined position of the plurality of electrode regions, to which at least two or more electrodes of the LED are adhered, respectively; coating a non-electro-conductive adhesive to the electrode dividing portions to fix the LEDs, which form boundaries among the plurality of electrode regions to which at least two or more electrodes of the LED are adhered; adhering at least two or more electrodes of the LED to the plurality of electrode regions by using the electro-conductive adhesive in a state where the LEDs are adhered to the non- electro-conductive adhesive; forming a power supply line supplying external power to the LEDs through the plurality of electrode regions; and adhering a second transparent board to the first transparent board, wherein the second transparent board is spaced apart from the first transparent board at a predetermined distance and faces the first transparent board.
[9] Here, the transparent electrode is made of one of Indium Tin Oxide (ITO) and
Indium Zinc Oxide (IZO); and forming electrode dividing portions comprises one of: forming the electrode dividing portions by an etching process using a screen mask on which pattern corresponding to the plurality of electrode regions and the electrode dividing portions are formed; and forming the electrode dividing portions by a laser etching process.
[10] In accordance with another aspect of the present invention, there is provided a manufacturing method of a transparent light emitting apparatus having at least one or more LEDs each of which has at least two or more electrodes, comprising: printing circuit patterns of a plurality of electrode regions and electrode dividing portions on a first transparent board using a silk screen on which the circuit patterns are formed, with transparent liquid polymer, so that the plurality of electrode regions and the electrode dividing portions electrically isolating the respective electrode regions are formed on one side of the first transparent board; coating an electro-conductivity adhesive to a predetermined position of the plurality of electrode regions, to which at least two or more electrodes of the LED are adhered, respectively; coating a non- electro-conductive adhesive to the electrode dividing portions to fix the LEDs, which form boundaries among the plurality of electrode regions to which at least two or more
electrodes of the LED are adhered; adhering at least two or more electrodes of the LED to the plurality of electrode regions by using the electro-conductive adhesive in a state where the LEDs are adhered to the non-electro-conductive adhesive; forming a power supply line supplying external power to the LEDs through the plurality of electrode regions; and adhering a second transparent board to the first transparent board, wherein the second transparent board is spaced apart from the first transparent board at a predetermined distance and faces the first transparent board.
[11] Here, the electro-conductive adhesive comprises silver paste; and coating electro- conductive adhesive comprises coating the silver paste to the plurality of electrode regions by a screen printing process.
[12] Also, forming the power supply line comprises one of: forming the power supply line by adhering a single sided or both sided electro-conductive tapes to the first transparent board; and forming the power supply line by printing silver paste on the first transparent board by screen printing process.
[13] Here, adhering the second transparent board to the first transparent board comprises one of: adhering the second transparent board to the first transparent board through lamination in a state where a filler is filled between the first transparent board and the second transparent board; and adhering the second transparent board to the first transparent by vacuum pressing and thermally curing in a state where a filler is filled between the first transparent board and the second transparent board.
[14] Also, adhering the second transparent board to the first transparent board comprises one of: adhering edges of the first transparent board and the second transparent board to each other using both sided tape so that the first transparent board and the second transparent board are spaced apart from each other at a predetermined distance; injecting a liquid filler of resins between the first transparent board and the second transparent board; sealing the four edges of the first transparent board and the second transparent board; and curing the liquid filler injected between the first transparent board and the second transparent board.
[15] In accordance with yet another aspect of the present invention, there is provided a transparent light emitting apparatus having at least one or more LEDs each of which has at least two or more electrodes, comprising: a first transparent board and a second transparent board being spaced apart from each other and facing each other; a transparent electrode coated on the face of the first transparent board, which faces the second transparent board; electrode dividing portions dividing the transparent electrode into a plurality of electrode regions which are electrically isolated from each other, such that the transparent electrode forms a circuit pattern supplying power to the LEDs; an electro-conductive adhesive adhering the two or more electrodes of the LED to the two or more electrode regions among the plurality of electrode regions, re-
spectively; a non-electro-conductive adhesive being provided to the electrode dividing portions which dividing the electrode regions to which at least two or more electrodes of the LED are adhered and adhering the LEDs to the electrode dividing portions; a power supply line supplying external power to the LEDs through the electrode regions; and a filler being filled between the first transparent board and the second transparent board.
[16] Here, the non-electro-conductive adhesive is protruded from the first transparent board toward the LEDs more than the electrode regions.
Advantageous Effects
[17] As described above, the present invention provides the transparent light emitting apparatus, which is operable under low power consumption, has a long life span and various visual aesthetic effects including an effect based on a transparent property, and includes the manufacturing method of the transparent light emitting apparatus.
[18] Also, the present invention provides the transparent light emitting apparatus which can prevent the electrodes of LEDs from shorting by an electro-conductive adhesive and adhere the LEDs to the first transparent board while and after it is manufactured, and the manufacturing method the transparent light emitting apparatus. Brief Description of the Drawings
[19] The above and other objects, features and other advantages of the present invention will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:
[20]
[21] Fig. 1 is a perspective view illustrating a transparent light emitting apparatus according to the present invention;
[22] Fig. 2 is a cross-sectional view taken along lines II-II of Fig. 1;
[23] Fig. 3 and Fig. 4 are examples of circuit patterns formed on a first transparent board of a transparent light emitting apparatus according to the present invention; and
[24] Fig. 5 is view for describing a manufacturing method of the transparent light emitting apparatus according to the present invention. Best Mode for Carrying Out the Invention
[25] Now, preferred embodiments of the present invention will be described in detail with reference to the annexed drawings. The concept of the word, 'transparent,' in the present application is not limited to materials through which light passes 100%, but instead it is extended to materials that are visually transparent to the naked eye. Namely, the word 'transparent' in this application may be analyzed as a concept including a certain degree of transparency.
[26] As show in Fig. 1 and Fig. 2, the transparent light emitting apparatus 1 according to
the present invention comprises at least one or more light emitting diodes (LEDs) 30, a first transparent board 10, a second transparent board 20, a transparent electrode 40, electrode dividing portions 43, an electro-conductive adhesive 80, a non- electro-conductive adhesive 50, power supply line 60, and filler 70.
[27] The LEDs 30 serves as a source of the transparent light emitting apparatus 1. A surface mount device (SMD) chip LED, thereby enhancing its transparency, implements the transparent light emitting apparatus according to the present invention.
[28] The LEDs 30 may be implemented by one of a 2-pin single-color LED, a 4-pin
2-chip 3-color LED, or a 4-pin 3-chip full-color LED. The present invention will be described based on the 2-pin single-color LED, i.e., an LED having two-electrodes 31.
[29] The first transparent board 10 is shaped as a plate made of transparent materials, such as transparent glass, poly carbonate (PC) or acrylic. The first transparent board 10 according to the present invention is shaped as an approximately rectangular plate and made of glass, as an example.
[30] The second transparent board 20 is formed corresponding to the form of the first transparent board 10, and, like the first transparent board 10, made of transparent materials such as transparent glass, PC, or acrylic. On the other hand, the form of the second transparent board 20 will not be limited by that of the first transparent board 10. Namely, the second transparent board 20 does not have to be the same form as the first transparent board 10 nor corresponds to the form of first transparent board 10.
[31] Here, in the case that the first transparent board 10 and/or the second transparent board 20 are made of transparent glass materials, the first transparent board 10 and/or the second transparent board 20 may be made of half tempered glass materials. Thus, it may be prevented that transparencies of the first transparent board 10 and/or the second transparent board 20 are decreased because of scratches, and that the first transparent board 10 and/or the second transparent board 20 are broken because of external impacts. Also, a curving phenomenon which occurs when the first transparent board 10 and/or the second transparent board 20 are made of fully tempered glass materials is prevented. Also, the first transparent board 10 and/or the second transparent board 20 made of half tempered glass can minimize increase of resistance of transparent electrode 40 more than those made of fully tempered glass.
[32] The transparent electrode 40 is coated on the face of the first transparent board 10, facing the second transparent board 20. Here, the transparent electrode 40 coated on the first transparent board 10 is divided into a plurality of electrode regions 41a and 41b, which are electrically isolated to each other by the electrode dividing portions 43.
[33] Here, the plurality of electrode regions 41a and 41b divided by the electrode dividing portions 43 form circuit patterns to supply power to the LEDs 30. For example, Fig. 3 shows a circuit pattern formed by four electrode regions 41a, 41b, 41c,
and 4 Id which can supply power in series to the LEDs 30, and Fig. 4 shows a circuit pattern formed by two electrode regions 41a' and 41b' which supplies power in parallel to the LEDs 30.
[34] Here, the transparent electrode 40 according to the present invention is made of
Indium Tin Oxide (ITO), Indium Zinc Oxide (IZO), or liquid polymer.
[35] Meanwhile, the LEDs 30 is adhered over at least two or more of the electrode regions 41a and 41b by the electro-conductive adhesive 80. The present invention will be described based on a transparent light emitting apparatus employing the LEDs 30, which have two electrodes 31. As shown in Fig. 2 to Fig. 4, the electrodes 31 of the LEDs 30 are adhered to the electrode regions 41a and 41b adjacent to each other, respectively, by the electro-conductive adhesive 80.
[36] Here, the present invention will be described based on an example where the electro-conductive adhesive 80 is implemented by silver conductor or silver paste. The types of the silver conductor or the silver paste are properly selected such that the electro-conductive adhesive 80 can be coated onto the transparent electrode 40 through a screen print process, which will be described later. The silver conductor or the silver paste suitable for the screen print process preferably has a suitable viscosity of 100~150kcps and a low surface resistance of 50m/sq whose conditions make it adhere to glass well. The present invention will be described based on an example in which silver paste has a viscosity of 100~150kps and a conductive epoxy adhesive as an electro-conductive adhesive is used, such that adhesive force can be maintained while filler 70 is filled through laminating processes, etc.
[37] Meanwhile, the non-electro-conductive adhesive 50 is positioned at the electrode dividing portions 43 which electrically isolate the electrode regions 41a and 41b, to which two electrodes 31 of the LED 30 are each correspondingly adhered. Here, the non-electro-conductive adhesive 50 is positioned between part of the body of the LED 30 and part of the first transparent board 10, in which the electrode dividing portions 43 are formed, thereby adhering the LED 30 thereto. Thus, such a process can prevent the LED 30 from changing its adhesion position, which is caused by vibration or trembling of the LED 30 while the LED 30 is adhered to the electrode regions 41a and 41b of the transparent board 10 or when the filler 70 is inserted between the first and the second transparent boards 10 and 20.
[38] Also, the non-electro-conductive adhesive 50 serves to prevent the two electrode regions 41a and 41b from being electrically connected, which is called an electrical short. Here, such connection is made as the electro-conductive adhesive 80 coated on the electrode regions 41a and 41b flows between the two electrode regions 41a and 41b while adhering the two electrodes 31 of the LED 30 to the electrode regions 41a and 41b by the electro-conductive adhesive 80. To prevent such connection, the non-
electro-conductive adhesive 50 is formed such that it is protruding from the surface of the first transparent board 10 forming the electrode dividing regions 43 toward the LED 30 more than that of the electrode regions 41a and 41b.
[39] Meanwhile, the power supply line 60 supplies external power to the LED 30 through the electrode regions 41a and 41b. The present invention will be described b ased on a transparent light emitting apparatus 1, whose power supply line 60 is formed along the edge of the first transparent 10. Also, the power supply line 60 may be implemented as a pad type in a predetermined area of the electrode regions 41a and 41b.
[40] The power supply line 60 may be implemented by single-sided or both sided electro-conductive adhesive tape, which is made of copper, aluminum or silver paste. Also, the power supply line 60 may be implemented by silver paste using a screen print method.
[41] Meanwhile, the filler 70 is filled between the first transparent board 10 and the second transparent board 20 to fix the first transparent board 10 and the second transparent board 20 in a state where the first transparent board 10 and the second transparent board 20 are spaced apart from each other at a predetermined distance. One of a PVB film, an EVA film, and liquid filler (such as resins) implements the filler 70 according to the present invention.
[42] According to the above-mentioned configuration, the transparent light emitting apparatus 1 of the present invention emits lights as to whether power is supplied to the transparent light emitting apparatus 1 through the power supply line 60.
[43] Hereinafter, a manufacturing method of the transparent light emitting apparatus according to the present invention is described in detail referring to FIG. 5.
[44] Firstly, the first transparent board 10 is prepared. And then, the transparent electrode 40 is coated on the first transparent board 10. Here, the coating of the transparent electrode 40 is achieved with a sputtering method.
[45] After that, the electrode dividing portions 43 are formed, such that the transparent electrode 40 coated on the first transparent board 10 is divided into the plurality of electrode regions 41a and 41b. Here, to form the electrode dividing portions 43, the transparent electrode 40 is partially removed by a screen mask. Namely, circuit patterns including the plurality of electrode regions 41a and 41b and electrode dividing portions 43 are formed on the first transparent board 10 through an etching process using a screen mask having patterns corresponding to the plurality of electrode regions 41a and 41b and the electrode dividing portions 43. Also, the transparent electrode 40 may be partially removed to form the electrode dividing portions 43 by a laser etching method using lasers, such as an NdYag laser or a UV laser.
[46] The following is a description of processes for adhering the LED 30 to the electrode regions 41a and 41b as formed on the first transparent board 10 according to the
above-mentioned method.
[47] Firstly, the electro-conductive adhesive 80 is coated to the predetermined position of the electrode regions 41a and 41b, to which the electrodes 31 of the LED 30 are adhered. Here, the silver paste may be used as the electro-conductive adhesive 80 and coated through a screen print method to the predetermined position of the electrode regions 41a and 41b, to which the electrodes 31 are adhered.
[48] After that, the non-electro-conductive adhesive 50 is coated to parts of the face of the first transparent board 10, in which the electrode dividing portions 43 forming boundaries between the electrode regions 41a and 41b are formed, that is, to parts in which the body of the LED 30 is positioned. Here, the coating order between the electro-conductive adhesive 80 and the non-electro-conductive adhesive 50 can be changed and then performed.
[49] After that, the LED 30 is positioned on the electrode regions 41a and 41b of the first transparent board 10 so that the electrodes 31 of the LED 30 are adhered to the electro- conductive adhesive 80 and the body of the LED 30 can be adhered to the non- electro-conductive adhesive 50.
[50] Here, the electro-conductive adhesive 80 is thermally cured so that the electrodes 31 may be adhered on the electrode regions 41a and 41b. The thermal curing is preferably performed at a curing temperature and in a curing time to comply with the characteristics of silver paste used as the electro-conductive adhesive 80. For example, the thermal curing may be performed for 30~60min, maintaining a temperatures of 120C which will not damage the LED 30.
[51] Thereafter, as described above, the single sided or both sided electro-conductive adhesive tape is adhered to the transparent electrode 40 to form the power supply line 60. In addition, the power supply line 60 may be formed when silver paste is printed by a screen printing method. The power supply line 60 is 2~5mm in width at the edge of the transparent electrode 40.
[52] In a state where the electrode regions 41a and 41b, electrode dividing portions 43, the LED 30 and the power supply line 60 are formed on the first transparent board 10 according to the above-mentioned method, the first transparent board 10 and the second transparent board 20 are adhered to each other, thereby completing the manufacturing process of the transparent light emitting apparatus 1.
[53] Here, the first and the second transparent boards 10 and 20 are adhered to each other in a state where the filler 70 is filled therebetween. This process is described as follows.
[54] When the PVB film used as the filler 70 is employed, the first and the second transparent boards 10 and 20 are adhered to each other in a state where the PVB film is filled therebetween through lamentation.
[55] When the EVA film is employed, the first transparent board lOand the second transparent board 20 are adhered to each other by vacuum pressure. More specifically, the first transparent board 10 and the second transparent board 20, between which the EVA film is positioned, are pressed in a vacuum state to remove the air between them, and then are thermally cured. So the first transparent board 10 and the second transpare nt board 20 are adhered to each other in a state where the filler 70 is filled therebetween.
[56] When the liquid filling material of resins used as the filler 70 is employed, the first transparent board 10 and the second transparent board 20 are adhered to each other using a transparent both sided adhesive tape. More specifically, the transparent double- sided adhesive tape, having a thickness of 2~5mm, is attached to the four edges of the first transparent board 10. Then, the second transparent board 20 is positioned to the first transparent board 10 so that they are adhered to each other by the transparent both sided adhesive tape. Thereafter, the adhered first and second transparent boards 10 and 20 are tilted at a predetermined angle and then with a nozzle, the liquid filling material is injected into the gap formed between the first transparent board 10 and the second transparent board 20. After completing the injection of the liquid filler, the opening of the gap is sealed so as not to leak the liquid filler. After that, the first and the second transparent boards with the liquid filler is put into a UV curing furnace for a predetermined time, for example 30~60min, so the liquid filler can be cured by UV -ray.
[57] The foregoing description is about a method of manufacturing the transparent light emitting apparatus 1, where the transparent electrode 40 are coated to the first transparent board 10; some portions to form the electrode dividing portions 43 are removed from the transparent electrode 40 to form the electrode regions 41a and 41b and the electrode dividing portions 43, as shown in Fig. 5. The skilled person can easily appreciate that, when transparent liquid polymer is used as the transparent electrode 40, The electrode regions 41a and 41b and the electrode dividing portions 43 may be formed, as transparent liquid polymer is printed on the first transparent board 10 using a silkscreen on which patterns corresponding to the electrode regions 41a and 41b and the electrode dividing portions 43 are formed.
[58] Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims. Industrial Applicability
[59] The present invention can be widely applied to a transparent light emitting apparatus and to a method of manufacturing the transparent light emitting apparatus.
This is because the transparent light emitting apparatus according to the present invention is manufactured to be operable under low power consumption, is designed to have a long life span, and to have various visual aesthetic effects including an effect based on a transparent property.
Claims
[1] A manufacturing method of a transparent light emitting apparatus having at least one or more light emitting diodes each of which has at least two or more electrodes, comprising: coating a transparent electrode on one side of a first transparent board; forming electrode dividing portions which divide the transparent electrode into a plurality of electrode regions which are electrically isolated from each other by removing a predetermined region from the transparent electrode to form a circuit pattern on the transparent electrode coated on the first transparent board; coating an electro-conductive adhesive to a predetermined position of the plurality of electrode regions, to which at least two or more electrodes of the LED are adhered, respectively; coating a non-electro-conductive adhesive to the electrode dividing portions to fix the LEDs, which form boundaries among the plurality of electrode regions to which at least two or more electrodes of the LED are adhered; adhering at least two or more electrodes of the LED to the plurality of electrode regions by using the electro-conductive adhesive in a state where the LEDs are adhered to the non-electro-conductive adhesive; forming a power supply line supplying external power to the LEDs through the plurality of electrode regions; and adhering a second transparent board to the first transparent board, wherein the second transparent board is spaced apart from the first transparent board at a predetermined distance and faces the first transparent board.
[2] The manufacturing method of the transparent light emitting apparatus according to claim 1, wherein: the transparent electrode is made of one of Indium Tin Oxide (ITO) and Indium Zinc Oxide (IZO); and forming electrode dividing portions comprises one of: forming the electrode dividing portions by an etching process using a screen mask on which pattern corresponding to the plurality of electrode regions and the electrode dividing portions are formed; and forming the electrode dividing portions by a laser etching process.
[3] A manufacturing method of a transparent light emitting apparatus having at least one or more LEDs each of which has at least two or more electrodes, comprising: printing circuit patterns of a plurality of electrode regions and electrode dividing portions on a first transparent board using a silk screen on which the circuit patterns are formed, with transparent liquid polymer, so that the plurality of
electrode regions and the electrode dividing portions electrically isolating the respective electrode regions are formed on one side of the first transparent board; coating an electro-conductivity adhesive to a predetermined position of the plurality of electrode regions, to which at least two or more electrodes of the LED are adhered, respectively; coating a non-electro-conductive adhesive to the electrode dividing portions to fix the LEDs, which form boundaries among the plurality of electrode regions to which at least two or more electrodes of the LED are adhered; adhering at least two or more electrodes of the LED to the plurality of electrode regions by using the electro-conductive adhesive in a state where the LEDs are adhered to the non-electro-conductive adhesive; forming a power supply line supplying external power to the LEDs through the plurality of electrode regions; and adhering a second transparent board to the first transparent board, wherein the second transparent board is spaced apart from the first transparent board at a predetermined distance and faces the first transparent board.
[4] The manufacturing method of the transparent light emitting apparatus according to any one of claims 1 to 3, wherein: the electro-conductive adhesive comprises silver paste; and coating electro-conductive adhesive comprises coating the silver paste to the plurality of electrode regions by a screen printing process.
[5] The manufacturing method of the transparent light emitting apparatus according to claim 4, wherein forming the power supply line comprises one of: forming the power supply line by adhering a single sided or both sided electro- conductive tapes to the first transparent board; and forming the power supply line by printing silver paste on the first transparent board by screen printing process.
[6] The manufacturing method of the transparent light emitting apparatus according to claim 4, wherein adhering the second transparent board to the first transparent board comprises one of: adhering the second transparent board to the first transparent board through lamination in a state where a filler is filled between the first transparent board and the second transparent board; and adhering the second transparent board to the first transparent by vacuum pressing and thermally curing in a state where a filler is filled between the first transparent board and the second transparent board.
[7] The manufacturing method of the transparent light emitting apparatus according to claim 4, wherein adhering the second transparent board to the first transparent
board comprises one of: adhering edges of the first transparent board and the second transparent board to each other using both sided tape so that the first transparent board and the second transparent board are spaced apart from each other at a predetermined distance; injecting a liquid filler of resins between the first transparent board and the second transparent board; sealing the four edges of the first transparent board and the second transparent board; and curing the liquid filler injected between the first transparent board and the second transparent board.
[8] A transparent light emitting apparatus having at least one or more LEDs each of which has at least two or more electrodes, comprising: a first transparent board and a second transparent board being spaced apart from each other and facing each other; a transparent electrode coated on the face of the first transparent board, which faces the second transparent board; electrode dividing portions dividing the transparent electrode into a plurality of electrode regions which are electrically isolated from each other, such that the transparent electrode forms a circuit pattern supplying power to the LEDs; an electro-conductive adhesive adhering the two or more electrodes of the LED to the two or more electrode regions among the plurality of electrode regions, respectively; a non-electro-conductive adhesive being provided to the electrode dividing portions which dividing the electrode regions to which at least two or more electrodes of the LED are adhered and adhering the LEDs to the electrode dividing portions; a power supply line supplying external power to the LEDs through the electrode regions; and a filler being filled between the first transparent board and the second transparent board.
[9] The transparent light emitting apparatus according to claim 8, wherein the non- electro-conductive adhesive is protruded from the first transparent board toward the LEDs more than the electrode regions.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007544282A JP2008505509A (en) | 2005-11-08 | 2006-08-01 | Transparent light emitting device and manufacturing method thereof |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050106700A KR100618941B1 (en) | 2005-11-08 | 2005-11-08 | Transparent light emitting apparatus and manufacturing method thereof |
KR10-2005-0106700 | 2005-11-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2007055455A1 true WO2007055455A1 (en) | 2007-05-18 |
Family
ID=37625612
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2006/003021 WO2007055455A1 (en) | 2005-11-08 | 2006-08-01 | Transparent light emitting apparatus and manufacturing method thereof |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2008505509A (en) |
KR (1) | KR100618941B1 (en) |
CN (1) | CN101069291A (en) |
WO (1) | WO2007055455A1 (en) |
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010013875A2 (en) * | 2008-07-29 | 2010-02-04 | Top Nanosys, Inc. | Led illumination apparatus |
JP2010532087A (en) * | 2007-06-04 | 2010-09-30 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Optical output device |
JP2010538413A (en) * | 2007-08-27 | 2010-12-09 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Optical output device |
WO2013041266A1 (en) * | 2011-09-20 | 2013-03-28 | Agc Glass Europe | Glass panel including a first glass sheet at least partially coated with an electrically conductive coating |
US9076940B2 (en) | 2005-01-10 | 2015-07-07 | Cree, Inc. | Solid state lighting component |
EP2876630A4 (en) * | 2012-07-18 | 2016-03-23 | G Smatt Co Ltd | Transparent electronic display board and method for manufacturing same |
US9335006B2 (en) | 2006-04-18 | 2016-05-10 | Cree, Inc. | Saturated yellow phosphor converted LED and blue converted red LED |
US9425172B2 (en) | 2008-10-24 | 2016-08-23 | Cree, Inc. | Light emitter array |
EP2975657A4 (en) * | 2013-03-15 | 2016-12-07 | G-Smatt Co Ltd | Pattern safety device for preventing interference between patterns |
WO2017076546A1 (en) * | 2015-11-04 | 2017-05-11 | Robert Bosch Gmbh | Lighting unit |
US9786811B2 (en) | 2011-02-04 | 2017-10-10 | Cree, Inc. | Tilted emission LED array |
US9793247B2 (en) | 2005-01-10 | 2017-10-17 | Cree, Inc. | Solid state lighting component |
US10056534B2 (en) | 2013-03-18 | 2018-08-21 | G-Smatt Co., Ltd. | Method for coating conductive substrate with adhesive |
US10295147B2 (en) | 2006-11-09 | 2019-05-21 | Cree, Inc. | LED array and method for fabricating same |
US10842016B2 (en) | 2011-07-06 | 2020-11-17 | Cree, Inc. | Compact optically efficient solid state light source with integrated thermal management |
WO2021234146A3 (en) * | 2020-05-22 | 2022-03-31 | Scio Holding Gmbh | Process for manufacturing a component, assembly, and method for electrically contacting the printed circuit board of the component or of the assembly |
US11592166B2 (en) | 2020-05-12 | 2023-02-28 | Feit Electric Company, Inc. | Light emitting device having improved illumination and manufacturing flexibility |
US11791442B2 (en) | 2007-10-31 | 2023-10-17 | Creeled, Inc. | Light emitting diode package and method for fabricating same |
US11876042B2 (en) | 2020-08-03 | 2024-01-16 | Feit Electric Company, Inc. | Omnidirectional flexible light emitting device |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006059411A1 (en) * | 2006-12-15 | 2008-06-26 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method for producing optical sensor for mounting on carrier substrate, involves providing optical transparent plate with lateral dimensions larger than sensor chip |
KR101402258B1 (en) * | 2007-02-07 | 2014-06-02 | 삼성디스플레이 주식회사 | Touch screen display device and methode for manufacturing the same |
CN102305369A (en) * | 2011-05-10 | 2012-01-04 | 无锡科依德光电科技有限公司 | Wall-surface invisible digital point light source system of building |
KR101188747B1 (en) * | 2012-07-18 | 2012-10-10 | 지스마트 주식회사 | Transparent display board and manucfacturing method |
KR101442705B1 (en) * | 2012-10-18 | 2014-09-19 | 지스마트 주식회사 | Transparent display board possible to even light emitting |
CN103227277A (en) * | 2013-03-27 | 2013-07-31 | 王定锋 | Welding-wire-free LED packaging method and LED packaging structure |
CN104050887A (en) * | 2014-04-28 | 2014-09-17 | 大连集思特科技有限公司 | Colored transparent electronic display plate and manufacturing method of colored transparent electronic display plate |
CN104715684A (en) * | 2015-03-30 | 2015-06-17 | 赵琪科 | Light transmitting glass display screen and manufacturing method |
KR101785528B1 (en) | 2015-09-14 | 2017-10-17 | 루미마이크로 주식회사 | Interconnects structure of transparent LED display having net pattern |
KR101780688B1 (en) | 2015-09-14 | 2017-10-23 | 루미마이크로 주식회사 | Mesh interconnects having net pattern and transparent LED display having the same |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03290982A (en) * | 1990-04-06 | 1991-12-20 | Stanley Electric Co Ltd | Manufacture of led display element |
JPH0774394A (en) * | 1993-09-03 | 1995-03-17 | Rohm Co Ltd | Light emitting device |
JPH10163261A (en) * | 1996-11-29 | 1998-06-19 | Kyocera Corp | Manufacture of electronic component mounting wiring board |
JP2004241509A (en) * | 2003-02-04 | 2004-08-26 | Matsushita Electric Ind Co Ltd | Led optical source, led illumination device and led display device |
JP2005093681A (en) * | 2003-09-17 | 2005-04-07 | Toyoda Gosei Co Ltd | Light-emitting device |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05251747A (en) * | 1992-03-06 | 1993-09-28 | Takiron Co Ltd | Light emitting display and its manufacture |
JPH0818106A (en) * | 1994-06-28 | 1996-01-19 | Mitsubishi Chem Corp | Light emitting device |
JP2000114602A (en) | 1998-09-30 | 2000-04-21 | Iwasaki Electric Co Ltd | Light emitting diode/light emitting device |
DE10308866A1 (en) * | 2003-02-28 | 2004-09-09 | Osram Opto Semiconductors Gmbh | Lighting module and method for its production |
-
2005
- 2005-11-08 KR KR1020050106700A patent/KR100618941B1/en active IP Right Grant
-
2006
- 2006-08-01 WO PCT/KR2006/003021 patent/WO2007055455A1/en active Application Filing
- 2006-08-01 JP JP2007544282A patent/JP2008505509A/en not_active Withdrawn
- 2006-08-01 CN CNA2006800008596A patent/CN101069291A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03290982A (en) * | 1990-04-06 | 1991-12-20 | Stanley Electric Co Ltd | Manufacture of led display element |
JPH0774394A (en) * | 1993-09-03 | 1995-03-17 | Rohm Co Ltd | Light emitting device |
JPH10163261A (en) * | 1996-11-29 | 1998-06-19 | Kyocera Corp | Manufacture of electronic component mounting wiring board |
JP2004241509A (en) * | 2003-02-04 | 2004-08-26 | Matsushita Electric Ind Co Ltd | Led optical source, led illumination device and led display device |
JP2005093681A (en) * | 2003-09-17 | 2005-04-07 | Toyoda Gosei Co Ltd | Light-emitting device |
Cited By (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9076940B2 (en) | 2005-01-10 | 2015-07-07 | Cree, Inc. | Solid state lighting component |
US9793247B2 (en) | 2005-01-10 | 2017-10-17 | Cree, Inc. | Solid state lighting component |
US9335006B2 (en) | 2006-04-18 | 2016-05-10 | Cree, Inc. | Saturated yellow phosphor converted LED and blue converted red LED |
US10295147B2 (en) | 2006-11-09 | 2019-05-21 | Cree, Inc. | LED array and method for fabricating same |
JP2010532087A (en) * | 2007-06-04 | 2010-09-30 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Optical output device |
JP2010538413A (en) * | 2007-08-27 | 2010-12-09 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Optical output device |
US11791442B2 (en) | 2007-10-31 | 2023-10-17 | Creeled, Inc. | Light emitting diode package and method for fabricating same |
WO2010013875A3 (en) * | 2008-07-29 | 2011-05-26 | Top Nanosys, Inc. | Led illumination apparatus |
WO2010013875A2 (en) * | 2008-07-29 | 2010-02-04 | Top Nanosys, Inc. | Led illumination apparatus |
US9425172B2 (en) | 2008-10-24 | 2016-08-23 | Cree, Inc. | Light emitter array |
US9484329B2 (en) | 2008-10-24 | 2016-11-01 | Cree, Inc. | Light emitter array layout for color mixing |
US9786811B2 (en) | 2011-02-04 | 2017-10-10 | Cree, Inc. | Tilted emission LED array |
US10842016B2 (en) | 2011-07-06 | 2020-11-17 | Cree, Inc. | Compact optically efficient solid state light source with integrated thermal management |
EA026828B1 (en) * | 2011-09-20 | 2017-05-31 | Агк Гласс Юроп | Glazing panel and process for the manufacture thereof |
WO2013041266A1 (en) * | 2011-09-20 | 2013-03-28 | Agc Glass Europe | Glass panel including a first glass sheet at least partially coated with an electrically conductive coating |
BE1020255A3 (en) * | 2011-09-20 | 2013-07-02 | Agc Glass Europe | GLASS PANEL COMPRISING A PERMIERE GLASS SHEET COATED AT LEAST PARTIALLY WITH A CONDUCTIVE COATING OF ELECTRICITY. |
US10036193B2 (en) | 2011-09-20 | 2018-07-31 | Agc Glass Europe | Glass panel including a first glass sheet at least partially coated with an electrically conductive coating |
EP2876630A4 (en) * | 2012-07-18 | 2016-03-23 | G Smatt Co Ltd | Transparent electronic display board and method for manufacturing same |
EP2975657A4 (en) * | 2013-03-15 | 2016-12-07 | G-Smatt Co Ltd | Pattern safety device for preventing interference between patterns |
US10056534B2 (en) | 2013-03-18 | 2018-08-21 | G-Smatt Co., Ltd. | Method for coating conductive substrate with adhesive |
WO2017076546A1 (en) * | 2015-11-04 | 2017-05-11 | Robert Bosch Gmbh | Lighting unit |
US11592166B2 (en) | 2020-05-12 | 2023-02-28 | Feit Electric Company, Inc. | Light emitting device having improved illumination and manufacturing flexibility |
US11796163B2 (en) | 2020-05-12 | 2023-10-24 | Feit Electric Company, Inc. | Light emitting device having improved illumination and manufacturing flexibility |
WO2021234146A3 (en) * | 2020-05-22 | 2022-03-31 | Scio Holding Gmbh | Process for manufacturing a component, assembly, and method for electrically contacting the printed circuit board of the component or of the assembly |
US11876042B2 (en) | 2020-08-03 | 2024-01-16 | Feit Electric Company, Inc. | Omnidirectional flexible light emitting device |
Also Published As
Publication number | Publication date |
---|---|
JP2008505509A (en) | 2008-02-21 |
CN101069291A (en) | 2007-11-07 |
KR100618941B1 (en) | 2006-09-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2007055455A1 (en) | Transparent light emitting apparatus and manufacturing method thereof | |
EP1080609B1 (en) | Electroluminescent devices | |
KR101535064B1 (en) | Light source module for display device and display device having the same | |
KR100618943B1 (en) | Transparent electric sign and chip led applied thereto | |
US20100079989A1 (en) | Flexible Thin-Type Light-Emitting-Diode Circuit Substrate and a Light-Emitting-Diode Lamp Strip | |
US20150289358A1 (en) | Heat radiation printed circuit board, method of manufacturing the same, backlight unit including the same, and liquid crystal display device | |
US11715433B2 (en) | Display device and assembling method thereof | |
CN101625463B (en) | Compound adhesive tape and display device | |
CN107492588A (en) | Transparent LED film | |
KR20040106272A (en) | LED Illuminating Apparatus and Method There of Using Transparent Electrode and Transparental Panel | |
KR20100129414A (en) | Lighting sheet | |
KR101509089B1 (en) | Type of flexible transparent board using the LED chip emitting LED billboards module | |
GB2464668A (en) | Thin light emitting diode circuit substrate and lamp strip | |
KR100779950B1 (en) | Transparent electric sign and line forming chip applied thereto | |
KR101512661B1 (en) | Transparent display board with a multi-layer structure can be installed on the window frame and manufacturing method thereof | |
WO2015175794A1 (en) | Led lighting structure | |
KR102428820B1 (en) | LED light-emitting board using transparent substrate, manufacturing method thereof | |
KR20080012511A (en) | Led unit, backlight unit using the same and display device having the same | |
JP2006058828A (en) | Display device and light source therefor | |
KR101762791B1 (en) | Light emitting device array | |
KR100847598B1 (en) | Backlight unit and method for manufacturing the unit | |
CN107017351B (en) | OLED plane lamp source module | |
KR20080018338A (en) | Backlight assembly and liquid crystal display device having the same | |
KR101649212B1 (en) | Transparent display board with retroreflective prevention device | |
KR100766959B1 (en) | Uniting Structure Of LCD Mold Frame For Improving Light Of Efficiency |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 2007544282 Country of ref document: JP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 200680000859.6 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
NENP | Non-entry into the national phase |
Ref country code: DE |
|
32PN | Ep: public notification in the ep bulletin as address of the adressee cannot be established |
Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 16/07/2008) |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 06783479 Country of ref document: EP Kind code of ref document: A1 |