WO2006135496A3 - Led package - Google Patents

Led package Download PDF

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Publication number
WO2006135496A3
WO2006135496A3 PCT/US2006/016259 US2006016259W WO2006135496A3 WO 2006135496 A3 WO2006135496 A3 WO 2006135496A3 US 2006016259 W US2006016259 W US 2006016259W WO 2006135496 A3 WO2006135496 A3 WO 2006135496A3
Authority
WO
WIPO (PCT)
Prior art keywords
reflector
substrate
molding
reflective
led package
Prior art date
Application number
PCT/US2006/016259
Other languages
French (fr)
Other versions
WO2006135496A2 (en
Inventor
Michael Leung
James Ibbetson
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree Inc filed Critical Cree Inc
Priority to JP2008515699A priority Critical patent/JP2008544488A/en
Priority to DE112006001539T priority patent/DE112006001539T5/en
Publication of WO2006135496A2 publication Critical patent/WO2006135496A2/en
Publication of WO2006135496A3 publication Critical patent/WO2006135496A3/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • H01L33/60Reflective elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483Containers
    • H01L33/486Containers adapted for surface mounting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Adhesive-free assembly of the substrate (12) and reflector components (16) of a semiconductor die package (10) is achieved by injection molding the reflector (16) onto a surface (22) of the substrate (12) or by molding the reflector (16) separate from the substrate (12) and securing it in place on the substrate (12) through deformation of a portion (36) of the reflector (16) . The reflector (16) may be made reflective either by molding the reflector (16) using a light scattering material or through the addition of a reflective element (20) , such as a piece of foil material that is secured to the reflector (16) . A variety of interchangeable reflective elements (20) having different surface shapes, and thus different light reflecting properties, may be made.
PCT/US2006/016259 2005-06-10 2006-04-27 Led package WO2006135496A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008515699A JP2008544488A (en) 2005-06-10 2006-04-27 LED package
DE112006001539T DE112006001539T5 (en) 2005-06-10 2006-04-27 Power control lamp housing

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/149,998 2005-06-10
US11/149,998 US8669572B2 (en) 2005-06-10 2005-06-10 Power lamp package

Publications (2)

Publication Number Publication Date
WO2006135496A2 WO2006135496A2 (en) 2006-12-21
WO2006135496A3 true WO2006135496A3 (en) 2007-04-26

Family

ID=37523361

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/016259 WO2006135496A2 (en) 2005-06-10 2006-04-27 Led package

Country Status (5)

Country Link
US (1) US8669572B2 (en)
JP (1) JP2008544488A (en)
DE (1) DE112006001539T5 (en)
TW (1) TW200735414A (en)
WO (1) WO2006135496A2 (en)

Families Citing this family (84)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10340424B2 (en) 2002-08-30 2019-07-02 GE Lighting Solutions, LLC Light emitting diode component
US7915085B2 (en) 2003-09-18 2011-03-29 Cree, Inc. Molded chip fabrication method
JP2006186297A (en) * 2004-12-03 2006-07-13 Toshiba Corp Semiconductor light emitting device and its manufacturing method
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US7939842B2 (en) * 2005-01-27 2011-05-10 Cree, Inc. Light emitting device packages, light emitting diode (LED) packages and related methods
JP4991173B2 (en) * 2005-04-27 2012-08-01 京セラ株式会社 Light-emitting element mounting substrate and light-emitting device using the same
US7554177B2 (en) * 2005-10-05 2009-06-30 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Attachment system incorporating a recess in a structure
US7378686B2 (en) * 2005-10-18 2008-05-27 Goldeneye, Inc. Light emitting diode and side emitting lens
KR100648628B1 (en) * 2005-12-29 2006-11-24 서울반도체 주식회사 Light emitting diode
US7521728B2 (en) * 2006-01-20 2009-04-21 Cree, Inc. Packages for semiconductor light emitting devices utilizing dispensed reflectors and methods of forming the same
US7675145B2 (en) * 2006-03-28 2010-03-09 Cree Hong Kong Limited Apparatus, system and method for use in mounting electronic elements
US8748915B2 (en) * 2006-04-24 2014-06-10 Cree Hong Kong Limited Emitter package with angled or vertical LED
US8735920B2 (en) 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
US7485480B2 (en) * 2006-09-21 2009-02-03 Harvatek Corporation Method of manufacturing high power light-emitting device package and structure thereof
US9024349B2 (en) 2007-01-22 2015-05-05 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US9159888B2 (en) 2007-01-22 2015-10-13 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
TW200839378A (en) * 2007-03-21 2008-10-01 Chi Mei Optoelectronics Corp Light emitting element, backlight module and plane display apparatus
WO2009000106A1 (en) * 2007-06-25 2008-12-31 Jenshyan Chen Led lighting device
US7652297B2 (en) * 2007-09-11 2010-01-26 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Light emitting device
JP2009094282A (en) * 2007-10-09 2009-04-30 Cosmo Electronics Corp High-power light emitting diode structure
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
US8866169B2 (en) 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
US9041285B2 (en) 2007-12-14 2015-05-26 Cree, Inc. Phosphor distribution in LED lamps using centrifugal force
US8878219B2 (en) 2008-01-11 2014-11-04 Cree, Inc. Flip-chip phosphor coating method and devices fabricated utilizing method
TWI385781B (en) * 2008-01-23 2013-02-11 I Chiun Precision Ind Co Ltd Lead frame
US8791471B2 (en) 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules
CN101430052A (en) * 2008-12-15 2009-05-13 伟志光电(深圳)有限公司 PCB rubber shell integrated packaging LED illumination light source and its production technique
US8368112B2 (en) 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
US20110037083A1 (en) * 2009-01-14 2011-02-17 Alex Chi Keung Chan Led package with contrasting face
JP5331512B2 (en) * 2009-02-26 2013-10-30 株式会社アイ・ライティング・システム LED lighting equipment
JP2012532441A (en) 2009-07-03 2012-12-13 ソウル セミコンダクター カンパニー リミテッド Light emitting diode package
TWI364122B (en) * 2009-07-06 2012-05-11 Led package structure for increasing light-emitting efficiency and controlling light-projecting angle and method for manufacturing the same
DE102009033287A1 (en) * 2009-07-15 2011-01-20 Osram Opto Semiconductors Gmbh Light-emitting diode and method for producing a light-emitting diode
WO2011007874A1 (en) 2009-07-17 2011-01-20 電気化学工業株式会社 Led chip assembly, led package, and manufacturing method of led package
US8593040B2 (en) 2009-10-02 2013-11-26 Ge Lighting Solutions Llc LED lamp with surface area enhancing fins
JP5359817B2 (en) * 2009-11-26 2013-12-04 セイコーエプソン株式会社 Light emitting device and projector
CN102130266B (en) * 2010-01-20 2013-08-28 光宝电子(广州)有限公司 Packaging structure and light emitting diode packaging structure
US8525213B2 (en) * 2010-03-30 2013-09-03 Lg Innotek Co., Ltd. Light emitting device having multiple cavities and light unit having the same
TWM394578U (en) 2010-04-20 2010-12-11 Sdi Corp Frame substrate of illumination device and its package structure
US10546846B2 (en) 2010-07-23 2020-01-28 Cree, Inc. Light transmission control for masking appearance of solid state light sources
JP5488310B2 (en) * 2010-07-30 2014-05-14 市光工業株式会社 Light source unit of semiconductor light source for vehicle lamp, vehicle lamp
US10309627B2 (en) 2012-11-08 2019-06-04 Cree, Inc. Light fixture retrofit kit with integrated light bar
US9822951B2 (en) 2010-12-06 2017-11-21 Cree, Inc. LED retrofit lens for fluorescent tube
US9166126B2 (en) 2011-01-31 2015-10-20 Cree, Inc. Conformally coated light emitting devices and methods for providing the same
KR20120108437A (en) 2011-03-24 2012-10-05 삼성전자주식회사 Light emitting device package
KR101259052B1 (en) * 2011-03-30 2013-04-29 박재훈 Light emitting diode package with reflector having thermal radiation funtion, light emitting diode package assembly with reflector having thermal radiation funtion and method of manufacturing the same
CN103081132B (en) * 2011-04-07 2017-09-29 惠州科锐半导体照明有限公司 Light-emitting diode display with the LED component for tilting peak emission and comprising such devices
JP5681035B2 (en) * 2011-04-25 2015-03-04 電気化学工業株式会社 LED light source package
WO2013061228A1 (en) * 2011-10-28 2013-05-02 Koninklijke Philips Electronics N.V. Light emitting device with integral shaped reflector
US10043960B2 (en) * 2011-11-15 2018-08-07 Cree, Inc. Light emitting diode (LED) packages and related methods
KR20130087249A (en) * 2012-01-27 2013-08-06 삼성전자주식회사 Semiconductor apparatus and image sensor package using the same
CN103378252B (en) * 2012-04-16 2016-01-06 展晶科技(深圳)有限公司 Light emitting diode module
US9500355B2 (en) 2012-05-04 2016-11-22 GE Lighting Solutions, LLC Lamp with light emitting elements surrounding active cooling device
CN103515520B (en) * 2012-06-29 2016-03-23 展晶科技(深圳)有限公司 Package structure for LED and manufacture method thereof
JP2014082453A (en) * 2012-09-25 2014-05-08 Toyoda Gosei Co Ltd Method of manufacturing light-emitting device
US10788176B2 (en) 2013-02-08 2020-09-29 Ideal Industries Lighting Llc Modular LED lighting system
US9482396B2 (en) 2012-11-08 2016-11-01 Cree, Inc. Integrated linear light engine
US9494304B2 (en) 2012-11-08 2016-11-15 Cree, Inc. Recessed light fixture retrofit kit
US9441818B2 (en) 2012-11-08 2016-09-13 Cree, Inc. Uplight with suspended fixture
US8727567B1 (en) 2012-12-18 2014-05-20 Jds Uniphase Corporation Semiconductor light source having a reflector
JP5998962B2 (en) * 2013-01-31 2016-09-28 三菱電機株式会社 Semiconductor optical device
US9874333B2 (en) 2013-03-14 2018-01-23 Cree, Inc. Surface ambient wrap light fixture
US10584860B2 (en) 2013-03-14 2020-03-10 Ideal Industries, Llc Linear light fixture with interchangeable light engine unit
US9461024B2 (en) 2013-08-01 2016-10-04 Cree, Inc. Light emitter devices and methods for light emitting diode (LED) chips
JP5956396B2 (en) * 2013-09-06 2016-07-27 京セラコネクタプロダクツ株式会社 lighting equipment
US10900653B2 (en) 2013-11-01 2021-01-26 Cree Hong Kong Limited LED mini-linear light engine
US10100988B2 (en) 2013-12-16 2018-10-16 Cree, Inc. Linear shelf light fixture with reflectors
US10612747B2 (en) * 2013-12-16 2020-04-07 Ideal Industries Lighting Llc Linear shelf light fixture with gap filler elements
DE102013114345A1 (en) * 2013-12-18 2015-06-18 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component
USD757324S1 (en) 2014-04-14 2016-05-24 Cree, Inc. Linear shelf light fixture with reflectors
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces
US10453825B2 (en) * 2014-11-11 2019-10-22 Cree, Inc. Light emitting diode (LED) components and methods
DE102015112042B4 (en) * 2015-07-23 2021-07-01 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelectronic lighting device
CN106449954A (en) * 2015-08-13 2017-02-22 比亚迪股份有限公司 Power type LED bracket and preparing method thereof
CN205037120U (en) * 2015-08-21 2016-02-17 全亿大科技(佛山)有限公司 Light emitting diode (LED) lamp
JP1563810S (en) * 2016-03-24 2016-11-21
US10263587B2 (en) 2016-12-23 2019-04-16 Avago Technologies International Sales Pte. Limited Packaged resonator with polymeric air cavity package
US10511285B1 (en) * 2017-02-28 2019-12-17 Avago Technologies International Sales Pte. Limited Anchored polymeric package for acoustic resonator structures
CN108540086A (en) * 2018-01-18 2018-09-14 浙江人和光伏科技有限公司 A kind of conductive module of solar battery connecting box
US10957736B2 (en) 2018-03-12 2021-03-23 Cree, Inc. Light emitting diode (LED) components and methods
JP7082280B2 (en) * 2018-03-30 2022-06-08 日亜化学工業株式会社 Light emitting device
TWI737505B (en) * 2020-09-29 2021-08-21 力成科技股份有限公司 Package structure

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5130761A (en) * 1990-07-17 1992-07-14 Kabushiki Kaisha Toshiba Led array with reflector and printed circuit board
JP2001060072A (en) * 1999-08-23 2001-03-06 Matsushita Electric Ind Co Ltd Display device
WO2002017405A1 (en) * 2000-08-23 2002-02-28 Osram Opto Semiconductors Gmbh Optoelectronic component and method for the production thereof, module and device comprising a module of this type
EP1187228A1 (en) * 2000-02-09 2002-03-13 Nippon Leiz Corporation Light source
WO2004044877A2 (en) * 2002-11-11 2004-05-27 Cotco International Limited A display device and method for making same
EP1521313A2 (en) * 2003-10-03 2005-04-06 LumiLeds Lighting U.S., LLC Integrated reflector cup for a light emitting device mount
WO2005043627A1 (en) * 2003-10-22 2005-05-12 Cree, Inc. Power surface mount light emitting die package

Family Cites Families (201)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3760237A (en) 1972-06-21 1973-09-18 Gen Electric Solid state lamp assembly having conical light director
JPS53126570U (en) 1977-03-15 1978-10-07
FR2436505A1 (en) 1978-09-12 1980-04-11 Radiotechnique Compelec OPTOELECTRONIC DEVICE WITH COUPLED TRANSMITTER AND RECEIVER
JPS604991B2 (en) 1979-05-11 1985-02-07 株式会社東芝 display device
US4511425A (en) 1983-06-13 1985-04-16 Dennison Manufacturing Company Heated pad decorator
JPH0416467Y2 (en) 1986-03-31 1992-04-13
EP1187227A3 (en) 1989-05-31 2002-08-28 Osram Opto Semiconductors GmbH & Co. OHG Surface-mountable optical element and method of fabrication
US5167556A (en) 1990-07-03 1992-12-01 Siemens Aktiengesellschaft Method for manufacturing a light emitting diode display means
US5122943A (en) 1991-04-15 1992-06-16 Miles Inc. Encapsulated light emitting diode and method for encapsulation
US5351106A (en) 1991-07-01 1994-09-27 Amergraph Corporation Exposure system
US5915752A (en) 1992-07-24 1999-06-29 Tessera, Inc. Method of making connections to a semiconductor chip assembly
US5790298A (en) * 1994-05-03 1998-08-04 Gentex Corporation Method of forming optically transparent seal and seal formed by said method
JPH08156324A (en) * 1994-12-12 1996-06-18 Rohm Co Ltd Protective cover attaching device in led array head
DE4446566A1 (en) 1994-12-24 1996-06-27 Telefunken Microelectron Multipole, surface-mountable, electronic component
WO1996036075A2 (en) 1995-05-10 1996-11-14 Philips Electronics N.V. Miniature semiconductor device for surface mounting
DE19549818B4 (en) 1995-09-29 2010-03-18 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor device
ES2171920T3 (en) 1996-03-19 2002-09-16 Donnelly Mirrors Ltd ELECTRO-OPTICAL REAR VIEW MIRROR SYSTEM.
DE19621124A1 (en) 1996-05-24 1997-11-27 Siemens Ag Optoelectronic converter and its manufacturing process
JPH09321343A (en) 1996-05-31 1997-12-12 Dowa Mining Co Ltd Component device for optical communication
DE19638667C2 (en) 1996-09-20 2001-05-17 Osram Opto Semiconductors Gmbh Mixed-color light-emitting semiconductor component with luminescence conversion element
JP3316838B2 (en) * 1997-01-31 2002-08-19 日亜化学工業株式会社 Light emitting device
JP3741512B2 (en) 1997-04-14 2006-02-01 ローム株式会社 LED chip parts
US5813753A (en) 1997-05-27 1998-09-29 Philips Electronics North America Corporation UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light
DE29825022U1 (en) 1997-07-29 2004-04-01 Osram Opto Semiconductors Gmbh Optoelectronic component
US6183100B1 (en) * 1997-10-17 2001-02-06 Truck-Lite Co., Inc. Light emitting diode 360° warning lamp
DE19755734A1 (en) 1997-12-15 1999-06-24 Siemens Ag Method for producing a surface-mountable optoelectronic component
DE19829197C2 (en) 1998-06-30 2002-06-20 Siemens Ag Component emitting and / or receiving radiation
US5959316A (en) 1998-09-01 1999-09-28 Hewlett-Packard Company Multiple encapsulation of phosphor-LED devices
US6274924B1 (en) 1998-11-05 2001-08-14 Lumileds Lighting, U.S. Llc Surface mountable LED package
JP3334864B2 (en) 1998-11-19 2002-10-15 松下電器産業株式会社 Electronic equipment
JP2000223751A (en) 1998-11-25 2000-08-11 Nichia Chem Ind Ltd Led lamp and display device using the led lamp
US6429583B1 (en) 1998-11-30 2002-08-06 General Electric Company Light emitting device with ba2mgsi2o7:eu2+, ba2sio4:eu2+, or (srxcay ba1-x-y)(a1zga1-z)2sr:eu2+phosphors
JP3784976B2 (en) 1998-12-22 2006-06-14 ローム株式会社 Semiconductor device
JP4279388B2 (en) 1999-01-29 2009-06-17 日亜化学工業株式会社 Optical semiconductor device and method for forming the same
JP3349109B2 (en) 1999-03-04 2002-11-20 株式会社シチズン電子 Surface mount type light emitting diode and method of manufacturing the same
US6259608B1 (en) 1999-04-05 2001-07-10 Delphi Technologies, Inc. Conductor pattern for surface mount devices and method therefor
JP2001042792A (en) 1999-05-24 2001-02-16 Sony Corp Led display device
JP2001044506A (en) 1999-07-26 2001-02-16 Ichikoh Ind Ltd Fixation structure for light emitting diode
US6454437B1 (en) * 1999-07-28 2002-09-24 William Kelly Ring lighting
US6710373B2 (en) 1999-09-27 2004-03-23 Shih-Yi Wang Means for mounting photoelectric sensing elements, light emitting diodes, or the like
US6296367B1 (en) 1999-10-15 2001-10-02 Armament Systems And Procedures, Inc. Rechargeable flashlight with step-up voltage converter and recharger therefor
JP2001168400A (en) 1999-12-09 2001-06-22 Rohm Co Ltd Chip type light emitting device with case and its manufacturing method
DE19964252A1 (en) 1999-12-30 2002-06-06 Osram Opto Semiconductors Gmbh Surface mount component for an LED white light source
DE10002521A1 (en) 2000-01-21 2001-08-09 Infineon Technologies Ag Electro-optical data transmission module
US6224216B1 (en) 2000-02-18 2001-05-01 Infocus Corporation System and method employing LED light sources for a projection display
JP3729012B2 (en) 2000-02-24 2005-12-21 松下電工株式会社 LED module
US6517218B2 (en) 2000-03-31 2003-02-11 Relume Corporation LED integrated heat sink
CN1189951C (en) 2000-04-24 2005-02-16 罗姆股份有限公司 Edge-emitting light-emitting semiconductor device and method of manufacturing thereof
US20020066905A1 (en) 2000-06-20 2002-06-06 Bily Wang Wing-shaped surface mount package for light emitting diodes
DE60137995D1 (en) * 2000-08-09 2009-04-30 Avago Technologies General Ip Light-emitting devices
EP1187226B1 (en) 2000-09-01 2012-12-26 Citizen Electronics Co., Ltd. Surface-mount type light emitting diode and method of manufacturing same
US7064355B2 (en) 2000-09-12 2006-06-20 Lumileds Lighting U.S., Llc Light emitting diodes with improved light extraction efficiency
US6940704B2 (en) 2001-01-24 2005-09-06 Gelcore, Llc Semiconductor light emitting device
JP2002223005A (en) 2001-01-26 2002-08-09 Toyoda Gosei Co Ltd Light emitting diode and display device
WO2002086972A1 (en) 2001-04-23 2002-10-31 Plasma Ireland Limited Illuminator
US20020163001A1 (en) 2001-05-04 2002-11-07 Shaddock David Mulford Surface mount light emitting device package and fabrication method
JP2002344029A (en) * 2001-05-17 2002-11-29 Rohm Co Ltd Method of adjusting color tone of light-emitting diode
JP2002374007A (en) 2001-06-15 2002-12-26 Toyoda Gosei Co Ltd Light-emitting apparatus
TW543128B (en) 2001-07-12 2003-07-21 Highlink Technology Corp Surface mounted and flip chip type LED package
US6686580B1 (en) * 2001-07-16 2004-02-03 Amkor Technology, Inc. Image sensor package with reflector
US6700136B2 (en) 2001-07-30 2004-03-02 General Electric Company Light emitting device package
CN2498694Y (en) 2001-08-14 2002-07-03 北京利亚德电子科技有限公司 Inclined LED image module
US6812481B2 (en) 2001-09-03 2004-11-02 Toyoda Gosei Co., Ltd. LED device and manufacturing method thereof
US7009627B2 (en) 2001-11-21 2006-03-07 Canon Kabushiki Kaisha Display apparatus, and image signal processing apparatus and drive control apparatus for the same
DE10241989A1 (en) 2001-11-30 2003-06-18 Osram Opto Semiconductors Gmbh Optoelectronic component
JP4009097B2 (en) 2001-12-07 2007-11-14 日立電線株式会社 LIGHT EMITTING DEVICE, ITS MANUFACTURING METHOD, AND LEAD FRAME USED FOR MANUFACTURING LIGHT EMITTING DEVICE
KR100439402B1 (en) 2001-12-24 2004-07-09 삼성전기주식회사 Light emission diode package
US6480389B1 (en) 2002-01-04 2002-11-12 Opto Tech Corporation Heat dissipation structure for solid-state light emitting device package
JP3973082B2 (en) 2002-01-31 2007-09-05 シチズン電子株式会社 Double-sided LED package
US6924514B2 (en) 2002-02-19 2005-08-02 Nichia Corporation Light-emitting device and process for producing thereof
JP2003258305A (en) 2002-02-27 2003-09-12 Oki Degital Imaging:Kk Semiconductor element array
CN100524703C (en) 2002-03-08 2009-08-05 罗姆股份有限公司 Semiconductor device using semiconductor chip
JP3924481B2 (en) 2002-03-08 2007-06-06 ローム株式会社 Semiconductor device using semiconductor chip
JP3939177B2 (en) * 2002-03-20 2007-07-04 シャープ株式会社 Method for manufacturing light emitting device
JP3707688B2 (en) * 2002-05-31 2005-10-19 スタンレー電気株式会社 Light emitting device and manufacturing method thereof
WO2004001862A1 (en) 2002-06-19 2003-12-31 Sanken Electric Co., Ltd. Semiconductor light emitting device, method for producing the same and reflector for semiconductor light emitting device
TW546799B (en) 2002-06-26 2003-08-11 Lingsen Precision Ind Ltd Packaged formation method of LED and product structure
DE10229067B4 (en) 2002-06-28 2007-08-16 Osram Opto Semiconductors Gmbh Optoelectronic component and method for its production
JP2004047748A (en) 2002-07-12 2004-02-12 Stanley Electric Co Ltd Light-emitting diode
TWI226598B (en) 2002-07-15 2005-01-11 Au Optronics Corp Display driving device and the method thereof
WO2004038759A2 (en) 2002-08-23 2004-05-06 Dahm Jonathan S Method and apparatus for using light emitting diodes
JP4407204B2 (en) 2002-08-30 2010-02-03 日亜化学工業株式会社 Light emitting device
US7224000B2 (en) 2002-08-30 2007-05-29 Lumination, Llc Light emitting diode component
US7264378B2 (en) 2002-09-04 2007-09-04 Cree, Inc. Power surface mount light emitting die package
JP2004103775A (en) 2002-09-09 2004-04-02 Eeshikku Kk Chip led light emitting body and method for manufacturing the same
DE10243247A1 (en) 2002-09-17 2004-04-01 Osram Opto Semiconductors Gmbh Leadframe-based component housing, leadframe tape, surface-mountable electronic component and method of manufacture
JP2004146815A (en) 2002-09-30 2004-05-20 Sanyo Electric Co Ltd Light emitting device
US6686609B1 (en) 2002-10-01 2004-02-03 Ultrastar Limited Package structure of surface mounting led and method of manufacturing the same
TW200414572A (en) 2002-11-07 2004-08-01 Matsushita Electric Ind Co Ltd LED lamp
DE10255932A1 (en) 2002-11-29 2004-06-17 Osram Opto Semiconductors Gmbh Optoelectronic component
US7692206B2 (en) 2002-12-06 2010-04-06 Cree, Inc. Composite leadframe LED package and method of making the same
JP4299535B2 (en) 2002-12-16 2009-07-22 パナソニック株式会社 Light emitting diode display device
CN2617039Y (en) 2003-02-21 2004-05-19 游尚桦 Sticking LED lead frame
KR101025234B1 (en) 2003-02-28 2011-04-01 오스람 옵토 세미컨덕터스 게엠베하 Optoelectronic component comprising a housing body which is metallised in a structured manner, method for producing one such component, and method for the structured metallisation of a body containing plastic
USD517025S1 (en) 2003-03-17 2006-03-14 Nichia Corporation Light emitting diode
US20040188696A1 (en) 2003-03-28 2004-09-30 Gelcore, Llc LED power package
JP4504662B2 (en) 2003-04-09 2010-07-14 シチズン電子株式会社 LED lamp
EP2270887B1 (en) 2003-04-30 2020-01-22 Cree, Inc. High powered light emitter packages with compact optics
US7005679B2 (en) 2003-05-01 2006-02-28 Cree, Inc. Multiple component solid state white light
JP4341951B2 (en) 2003-05-07 2009-10-14 シチズン電子株式会社 Light emitting diode and its package structure
JP2004335880A (en) 2003-05-09 2004-11-25 Toshiba Lighting & Technology Corp Light emitting device
US7021797B2 (en) 2003-05-13 2006-04-04 Light Prescriptions Innovators, Llc Optical device for repositioning and redistributing an LED's light
JP2004356506A (en) 2003-05-30 2004-12-16 Stanley Electric Co Ltd Glass sealed type light emitting diode
JP3977774B2 (en) 2003-06-03 2007-09-19 ローム株式会社 Optical semiconductor device
JP4120813B2 (en) 2003-06-12 2008-07-16 セイコーエプソン株式会社 Optical component and manufacturing method thereof
JP4645071B2 (en) 2003-06-20 2011-03-09 日亜化学工業株式会社 Package molded body and semiconductor device using the same
JP4034241B2 (en) 2003-06-27 2008-01-16 日本ライツ株式会社 LIGHT SOURCE DEVICE AND LIGHT SOURCE DEVICE MANUFACTURING METHOD
TWI312582B (en) 2003-07-24 2009-07-21 Epistar Corporatio Led device, flip-chip led package and light reflecting structure
JP4360858B2 (en) 2003-07-29 2009-11-11 シチズン電子株式会社 Surface mount type LED and light emitting device using the same
US6876008B2 (en) 2003-07-31 2005-04-05 Lumileds Lighting U.S., Llc Mount for semiconductor light emitting device
JP3969660B2 (en) * 2003-08-05 2007-09-05 スタンレー電気株式会社 White LED lamp
JP2005064047A (en) 2003-08-13 2005-03-10 Citizen Electronics Co Ltd Light emitting diode
JP2005079167A (en) 2003-08-28 2005-03-24 Kyocera Corp Light emitting element housing package and light emitting device
US20050077535A1 (en) 2003-10-08 2005-04-14 Joinscan Electronics Co., Ltd LED and its manufacturing process
CN2646873Y (en) 2003-10-16 2004-10-06 上海三思科技发展有限公司 A surface sticking type LED with tilted light axis
US20050117325A1 (en) 2003-11-14 2005-06-02 Hsieh Hsin-Mao Desk lamp with function of generating negative ions
JP4231391B2 (en) 2003-11-19 2009-02-25 パナソニック株式会社 Lead frame for semiconductor device and surface light emitting device using the same
JP2005159081A (en) * 2003-11-27 2005-06-16 Kyocera Corp Package for light emitting element housing, and light emitting device
JP2005191530A (en) 2003-12-03 2005-07-14 Sumitomo Electric Ind Ltd Light emitting device
JP2005183531A (en) 2003-12-17 2005-07-07 Sharp Corp Semiconductor light emitting device
US7321161B2 (en) 2003-12-19 2008-01-22 Philips Lumileds Lighting Company, Llc LED package assembly with datum reference feature
JP4442216B2 (en) 2003-12-19 2010-03-31 豊田合成株式会社 LED lamp device
JP2005197369A (en) * 2004-01-05 2005-07-21 Toshiba Corp Optical semiconductor device
US7675231B2 (en) * 2004-02-13 2010-03-09 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Light emitting diode display device comprising a high temperature resistant overlay
US20050179041A1 (en) 2004-02-18 2005-08-18 Lumileds Lighting U.S., Llc Illumination system with LEDs
US7326583B2 (en) * 2004-03-31 2008-02-05 Cree, Inc. Methods for packaging of a semiconductor light emitting device
US7514867B2 (en) 2004-04-19 2009-04-07 Panasonic Corporation LED lamp provided with optical diffusion layer having increased thickness and method of manufacturing thereof
JP2005310935A (en) 2004-04-20 2005-11-04 Sumitomo Metal Electronics Devices Inc Storing package for light-emitting element
JP2005347401A (en) 2004-06-01 2005-12-15 Meiko:Kk Optical element chip component
TWM258416U (en) 2004-06-04 2005-03-01 Lite On Technology Corp Power LED package module
US20070295975A1 (en) 2004-06-25 2007-12-27 Sanyo Electric Co., Ltd. Light-Emitting Device
JP2006019557A (en) 2004-07-02 2006-01-19 Fujikura Ltd Light emitting device, its mounting method, lighting apparatus and display
JP4547569B2 (en) 2004-08-31 2010-09-22 スタンレー電気株式会社 Surface mount type LED
EP1794808B1 (en) 2004-09-10 2017-08-09 Seoul Semiconductor Co., Ltd. Light emitting diode package having multiple molding resins
JP2006114854A (en) 2004-10-18 2006-04-27 Sharp Corp Semiconductor light emitting device, and backlight device for liquid crystal display
JP2006119357A (en) 2004-10-21 2006-05-11 Koha Co Ltd Display device
US8816369B2 (en) 2004-10-29 2014-08-26 Led Engin, Inc. LED packages with mushroom shaped lenses and methods of manufacturing LED light-emitting devices
JP4796293B2 (en) 2004-11-04 2011-10-19 株式会社 日立ディスプレイズ Manufacturing method of lighting device
JP2006140281A (en) 2004-11-11 2006-06-01 Stanley Electric Co Ltd Power led and its manufacturing method
GB2420221B (en) 2004-11-12 2009-09-09 Unity Opto Technology Co Ltd Solid-state semiconductor light emitting device
US7419839B2 (en) 2004-11-12 2008-09-02 Philips Lumileds Lighting Company, Llc Bonding an optical element to a light emitting device
US7119422B2 (en) 2004-11-15 2006-10-10 Unity Opto Technology Co., Ltd. Solid-state semiconductor light emitting device
JP5038147B2 (en) 2004-11-18 2012-10-03 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Luminescent body and method for producing the luminous body
WO2006065007A1 (en) 2004-12-16 2006-06-22 Seoul Semiconductor Co., Ltd. Leadframe having a heat sink supporting ring, fabricating method of a light emitting diodepackage using the same and light emitting diodepackage fabbricated by the method
US7285802B2 (en) * 2004-12-21 2007-10-23 3M Innovative Properties Company Illumination assembly and method of making same
CN100389503C (en) 2005-01-07 2008-05-21 北京大学 Method for preparing LED chip with separate crystal grain vertical structure
US9793247B2 (en) 2005-01-10 2017-10-17 Cree, Inc. Solid state lighting component
TWI255566B (en) 2005-03-04 2006-05-21 Jemitek Electronics Corp Led
JP4915052B2 (en) 2005-04-01 2012-04-11 パナソニック株式会社 LED component and manufacturing method thereof
US7994702B2 (en) 2005-04-27 2011-08-09 Prysm, Inc. Scanning beams displays based on light-emitting screens having phosphors
JP2006324331A (en) 2005-05-17 2006-11-30 Sony Corp Light emitting diode and its manufacturing method, integrated light emitting diode and its manufacturing method, growing method of nitride- based group iii-v compound semiconductor, nitride-based group iii-v compound semiconductor growing substrate, light emitting diode backlight, light emitting diode lighting apparatus, light emitting diode display, and electronic equipment
CN1874011A (en) 2005-06-03 2006-12-06 邢陈震仑 LED device
JP2007012323A (en) 2005-06-28 2007-01-18 Cheil Ind Co Ltd Surface light source device, and liquid crystal display device
KR100757196B1 (en) 2005-08-01 2007-09-07 서울반도체 주식회사 Light emitting device with a lens of silicone
US20070034886A1 (en) 2005-08-11 2007-02-15 Wong Boon S PLCC package with integrated lens and method for making the package
JP2007094088A (en) 2005-09-29 2007-04-12 Matsushita Electric Ind Co Ltd Display device
US20070096139A1 (en) 2005-11-02 2007-05-03 3M Innovative Properties Company Light emitting diode encapsulation shape control
JP4724618B2 (en) 2005-11-11 2011-07-13 株式会社 日立ディスプレイズ LIGHTING DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE USING THE SAME
JP3992059B2 (en) 2005-11-21 2007-10-17 松下電工株式会社 Method for manufacturing light emitting device
JP2007184542A (en) 2005-12-09 2007-07-19 Matsushita Electric Ind Co Ltd Light-emitting module, manufacturing method thereof, and backlight apparatus using same
JP2007165029A (en) 2005-12-12 2007-06-28 Hitachi Displays Ltd Display device
JP2007201420A (en) 2005-12-27 2007-08-09 Sharp Corp Semiconductor light-emitting device, semiconductor light-emitting element, and method of manufacturing semiconductor light-emitting device
JP2007189150A (en) 2006-01-16 2007-07-26 Enomoto Co Ltd Lead frame for low-height led device and method for manufacturing same
JP2009087538A (en) 2006-01-20 2009-04-23 Sharp Corp Light source unit, lighting device using it, and display device using it
US20070170449A1 (en) 2006-01-24 2007-07-26 Munisamy Anandan Color sensor integrated light emitting diode for LED backlight
USD572670S1 (en) 2006-03-30 2008-07-08 Nichia Corporation Light emitting diode
JP2007273763A (en) 2006-03-31 2007-10-18 Sony Corp Semiconductor device and its manufacturing method
JP2007287981A (en) 2006-04-18 2007-11-01 Konica Minolta Opto Inc Light emitting device
JP2009534866A (en) 2006-04-24 2009-09-24 クリー, インコーポレイティッド Horizontally mounted white LED
US7635915B2 (en) 2006-04-26 2009-12-22 Cree Hong Kong Limited Apparatus and method for use in mounting electronic elements
JP2007299905A (en) 2006-04-28 2007-11-15 Nichia Chem Ind Ltd Semiconductor device
US20070269586A1 (en) 2006-05-17 2007-11-22 3M Innovative Properties Company Method of making light emitting device with silicon-containing composition
KR100789951B1 (en) 2006-06-09 2008-01-03 엘지전자 주식회사 Apparatus and method for manufacturing Light Emitting Unit
KR100904152B1 (en) 2006-06-30 2009-06-25 서울반도체 주식회사 Leadframe having a heat sink supporting part, fabricating method of the light emitting diode package using the same and light emitting diode package fabricated by the method
TWM303325U (en) 2006-07-13 2006-12-21 Everlight Electronics Co Ltd Light emitting diode package
US7960819B2 (en) 2006-07-13 2011-06-14 Cree, Inc. Leadframe-based packages for solid state emitting devices
TWI313943B (en) 2006-10-24 2009-08-21 Chipmos Technologies Inc Light emitting chip package and manufacturing thereof
USD572210S1 (en) 2006-11-01 2008-07-01 Lg Innotek Co., Ltd. Light-emitting diode (LED)
KR101329413B1 (en) 2006-12-19 2013-11-14 엘지디스플레이 주식회사 Optical lens, optical module having the optical lens and backlight unit having the optical module
US7687823B2 (en) 2006-12-26 2010-03-30 Nichia Corporation Light-emitting apparatus and method of producing the same
US7800304B2 (en) 2007-01-12 2010-09-21 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Multi-chip packaged LED light source
JP5106862B2 (en) 2007-01-15 2012-12-26 昭和電工株式会社 Light emitting diode package
US7777412B2 (en) 2007-03-22 2010-08-17 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Phosphor converted LED with improved uniformity and having lower phosphor requirements
US7923831B2 (en) 2007-05-31 2011-04-12 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. LED-based light source having improved thermal dissipation
US7999283B2 (en) 2007-06-14 2011-08-16 Cree, Inc. Encapsulant with scatterer to tailor spatial emission pattern and color uniformity in light emitting diodes
USD576574S1 (en) 2007-07-17 2008-09-09 Rohm Co., Ltd. Light emitting diode module
CN100574543C (en) 2007-07-30 2009-12-23 深圳莱特光电有限公司 The method of isolating silver layer in a kind of warm white LED encapsulation process
US11114594B2 (en) 2007-08-24 2021-09-07 Creeled, Inc. Light emitting device packages using light scattering particles of different size
US7791093B2 (en) 2007-09-04 2010-09-07 Koninklijke Philips Electronics N.V. LED with particles in encapsulant for increased light extraction and non-yellow off-state color
JP2007329516A (en) 2007-09-14 2007-12-20 Sharp Corp Semiconductor light-emitting apparatus
CN101388161A (en) 2007-09-14 2009-03-18 科锐香港有限公司 LED surface mounting device and LED display with the device
US7524087B1 (en) 2007-11-16 2009-04-28 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Optical device
CN101897040B (en) 2007-12-11 2013-06-12 皇家飞利浦电子股份有限公司 Side emitting device with hybrid top reflector
US8049230B2 (en) 2008-05-16 2011-11-01 Cree Huizhou Opto Limited Apparatus and system for miniature surface mount devices
GB2458972B (en) 2008-08-05 2010-09-01 Photonstar Led Ltd Thermally optimised led chip-on-board module
JP5284006B2 (en) 2008-08-25 2013-09-11 シチズン電子株式会社 Light emitting device
GB2466633A (en) 2008-12-12 2010-07-07 Glory Science Co Ltd Method of manufacturing a light emitting unit
US20110049545A1 (en) 2009-09-02 2011-03-03 Koninklijke Philips Electronics N.V. Led package with phosphor plate and reflective substrate
WO2011057102A1 (en) 2009-11-05 2011-05-12 Luminit Llc Method to Provide Microstructure for Encapsulated High-Brightness Led Chips
JP5678629B2 (en) 2010-02-09 2015-03-04 ソニー株式会社 Method for manufacturing light emitting device
KR101659357B1 (en) 2010-05-12 2016-09-23 엘지이노텍 주식회사 Light emitting device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5130761A (en) * 1990-07-17 1992-07-14 Kabushiki Kaisha Toshiba Led array with reflector and printed circuit board
JP2001060072A (en) * 1999-08-23 2001-03-06 Matsushita Electric Ind Co Ltd Display device
EP1187228A1 (en) * 2000-02-09 2002-03-13 Nippon Leiz Corporation Light source
WO2002017405A1 (en) * 2000-08-23 2002-02-28 Osram Opto Semiconductors Gmbh Optoelectronic component and method for the production thereof, module and device comprising a module of this type
WO2004044877A2 (en) * 2002-11-11 2004-05-27 Cotco International Limited A display device and method for making same
EP1521313A2 (en) * 2003-10-03 2005-04-06 LumiLeds Lighting U.S., LLC Integrated reflector cup for a light emitting device mount
WO2005043627A1 (en) * 2003-10-22 2005-05-12 Cree, Inc. Power surface mount light emitting die package

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US20060278882A1 (en) 2006-12-14
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