WO2006135496A2 - Led package - Google Patents
Led package Download PDFInfo
- Publication number
- WO2006135496A2 WO2006135496A2 PCT/US2006/016259 US2006016259W WO2006135496A2 WO 2006135496 A2 WO2006135496 A2 WO 2006135496A2 US 2006016259 W US2006016259 W US 2006016259W WO 2006135496 A2 WO2006135496 A2 WO 2006135496A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- reflector cup
- package
- reflective element
- reflector
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 123
- 239000000463 material Substances 0.000 claims abstract description 57
- 239000004065 semiconductor Substances 0.000 claims abstract description 38
- 238000001746 injection moulding Methods 0.000 claims abstract description 9
- 239000011888 foil Substances 0.000 claims abstract description 6
- 238000000465 moulding Methods 0.000 claims abstract description 4
- 238000000149 argon plasma sintering Methods 0.000 claims abstract 4
- 238000000034 method Methods 0.000 claims description 23
- 229920003023 plastic Polymers 0.000 claims description 12
- 239000004033 plastic Substances 0.000 claims description 11
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 3
- 238000004873 anchoring Methods 0.000 claims description 3
- 229920003986 novolac Polymers 0.000 claims 2
- 239000004956 Amodel Substances 0.000 claims 1
- 239000012777 electrically insulating material Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 5
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- 229910002601 GaN Inorganic materials 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229940024548 aluminum oxide Drugs 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
- 230000005499 meniscus Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- This invention relates to semiconductor device die packages, and more particularly to light emitting diode (LED) die packages.
- LED light emitting diode
- LED package generally includes a substrate member on which a light emitting device is mounted.
- the light emitting device may, for example, include an LED chip/submount assembly mounted to the substrate member with electrical connections being made to the LED for applying an electrical bias.
- LEDs generally comprise an active region of semiconductor material sandwiched between two oppositely doped layers. .When a bias is applied across the doped layers, holes and electrons are injected into the active region where they recombine to generate light.
- the substrate member may also include traces or metal leads for connecting the package to external circuitry and the substrate may also act as a heat sink to conduct heat away from the LED during operation.
- a reflector such as the reflector cup, may be mounted on the substrate and surround the LED, with the reflector cup including an angled or sloped lower sidewall for reflecting light generated by the LED upwardly and away from the LED package.
- the reflector cup may also include upwardly-extending walls that may act as a cavity or opening surrounding the LED.
- the reflective cup cavity has a bottom surface defined by the substrate to provide a closed cavity capable of retaining the liquid encapsulating material.
- a lens may then be placed over the reflector cup cavity in contact with the encapsulating material and the encapsulating material is typically cured to form the final die package.
- the reflective cup can be silver plated in portions, such as on its angled or sloped lower sidewall, to further enhance its reflectivity.
- One conventional reflector cup comprises silver plated copper.
- a current LED die package manufacturing process includes a step of mounting the silver plated copper reflector to the substrate by an adhesive. It has been noted that the adhesive used to bond the reflector to the substrate may potentially cause the silver plated copper reflector to tarnish and its reflective properties to become degraded. The bonding step may also introduce variations in the relative height positioning between the reflector and other package components including the LED. This in turn may adversely affect the reflective capabilities of the reflector and the light output of the LED package.
- the invention is directed to semiconductor die packages and methods of making such packages.
- the invention relates to a semiconductor device die package that includes a substrate having a first surface for supporting a semiconductor device, a second surface and at least one thru-hole between the first and second surfaces.
- the package also includes a base on the first surface that is secured to the substrate at least partially through the at least one thru-hole.
- the invention in another aspect, relates to a method of forming a semiconductor die package.
- a substrate having a first surface for supporting a semiconductor device, a second surface and at least one thru-hole between the first and second surfaces is obtained and a base is formed on the first surface.
- the invention in another aspect, relates to a light emitting diode (LED) die package that includes a substrate having first and second surfaces, at least one thru-hole between the first and second surfaces and a mounting pad on the first surface.
- the package also includes a base on the first surface that is at least partially secured to the substrate through the at least one thru-hole.
- the base has an inner surface that substantially surrounds the mounting pad.
- the package further includes a reflective element associated with the inner surface and an LED assembly that is mounted on the mounting pad.
- the invention in yet another aspect, relates to a light emitting diode (LED) die package that includes a substrate having first and second surfaces and a mounting pad on the first surface.
- the package also includes a base that is secured to the first surface.
- the base has an inner surface that substantially surrounds the mounting pad.
- the package further includes a reflective element that is associated with the inner surface and an LED assembly that is mounted on the mounting pad.
- LED light emitting diode
- FIG. 1 is a perspective view of one embodiment of a semiconductor die package according to the present invention.
- FIG. 2 is an exploded view of the semiconductor die package of FIG. 1;
- FIG. 3 is a plan view of the substrate in the semiconductor die package of FIG. 1;
- FIG. 4 is a plan view of the reflector cup in the semiconductor die package of FIG. 1;
- FIG. 5 is a sectional view of one embodiment of a semiconductor die package according to the present invention wherein the reflector cup includes a press-fit reflective element;
- FIG. 6 is a sectional view of another embodiment of a semiconductor die package according to the present invention wherein the reflector assembly includes a snap- fit reflective element;
- FIG. 7 is a sectional view of another embodiment of a semiconductor die package according to the present invention wherein the reflector assembly includes a snap- fit reflective element having a different shape than the reflective element of FIG. 6;
- FIG. 8 is a sectional view of another embodiment of a semiconductor die package according to the present invention wherein the reflector assembly includes a snap- fitted reflective element having still a different shape;
- FIG. 9 is a sectional view of another embodiment of a semiconductor die package according to the present invention wherein reflector cup's posts pass through part of the substrate;
- FIG.' 10 is a sectional view of another embodiment of a semiconductor die package according to the present invention wherein the reflector cup's posts pass through part of the substrate;
- FIG. 11 is a sectional view of one embodiment of a semiconductor die package according to the present invention at a manufacturing step with an injection molded reflector cup;
- FIG. 12 is a sectional view of another embodiment of a semiconductor die package according the present invention at a manufacturing step with a reflector cup secured through post deformation;
- FIG. 13 is a sectional view of the partial package of FIG. 11 with a LED assembly mounted on the substrate;
- FIG. 14 is a cross-section of the partial package of FIG. 11 with a reflective element press-fit to an inner wall of the reflector cup;
- FIG. 15 is a sectional view of another embodiment of a semiconductor die package according to the present invention wherein the reflector assembly is formed of a light reflective material;
- FIG. 16 is a perspective view of one embodiment of a die package according to the present invention having a lens;
- FIG. 17 is a exploded perspective view of the die package in FIG. 16.
- the present invention provides improved semiconductor die package performance through adhesive- free assembly of the substrate and reflector cup components of the package.
- the reflector cup is injection molded onto a surface of the substrate and is held in place by adhesive free anchors.
- the reflector cup is molded separate from the substrate and is secured in place on the substrate through various processes including deformation of a portion of the reflector cup such that the reflector cup is again held in place by adhesive free anchors.
- Portions of the reflector cup may be made reflective either by molding it from light reflective/scattering material or through the addition of a reflective element, such as a piece of foil material that is secured to the reflector preferably without the use of an adhesive.
- a variety of interchangeable reflective elements having different surface shapes, and thus different light reflecting properties, may be used.
- the die package 10 includes a substrate 12, a semiconductor light emitting device assembly 14 mounted on the substrate and a reflector cup assembly ("reflector cup”) 16 also mounted on the substrate 12.
- FIGs. 3 and 4 show the substrate 12 and reflector cup 16, respectively.
- the term semiconductor light emitting device may include a light emitting diode (LED) , laser diode and/or other semiconductor device which includes one or more semiconductor layers, which may include silicon, silicon carbide, gallium nitride and/or other semiconductor materials, a substrate which may include sapphire, silicon, silicon carbide and/or other microelectronic substrates, and one or more contact layers which may include metal and/or other conductive layers.
- LED light emitting diode
- laser diode and/or other semiconductor device which includes one or more semiconductor layers, which may include silicon, silicon carbide, gallium nitride and/or other semiconductor materials, a substrate which may include sapphire, silicon, silicon carbide and/or other microelectronic substrates, and one or more contact layers which may include metal and/or other conductive layers.
- the semiconductor light emitting device may be gallium nitride-based LEDs or lasers fabricated on a silicon carbide substrate such as those devices manufactured and sold by Cree, Inc.
- the light emitting device assembly 14 shown in FIGs. 1 and 2 preferably comprises an LED 17 mounted to a submount 18.
- the LED/subtnount assembly is then mounted . to the substrate 12 and electrical connection is made to the LED using methods known in the art.
- the LED 17 and submount 18 are generally referred to herein as LED 17.
- the substrate 12 may be formed of many different materials with a preferred material being electrically insulating. Suitable substrate .material include, but are not limited to ceramic materials such as aluminum-oxide or aluminum-nitride.
- the reflector cup 16 should be formed of durable, high melting temperature material that can withstand subsequent packaging manufacturing steps and the heat generated by the package during operation. Many different materials can be used, such as high melting temperature materials including plastics, such as a Novella resin, or liquid crystal polymers, such as those available from Quantum Leap (www.qlpkg.com). As used herein "high temperature material” means a material able to withstand 150-200° C, at a minimum. As further described below, the reflector cup 16 can be made of a material that reflects/scatters light from the LED 17.
- the reflector cup 16 is arranged to reflect light generated by the LED 17 upwardly and away from the die package 10 so that it can contribute to useful light emission of the package 10.
- the reflector cup 16 can have many different shapes and sizes and to enhance its reflectivity, may include a reflective element 20 covering different portions of the reflective cup area around the LED 17, such as surface surrounding the LED 17.
- the reflector cup 16 can be made of a reflective material such that light from the LED directed toward the surfaces of the reflective cup is reflected, to contribute to die package emission.
- Packages 10 according to the present invention are arranged so that the reflector cup 16 and substrate 12 cooperate to anchor the reflector cup 16 to the substrate 12 without the use of adhesives.
- a preferred die package according to the present invention uses no adhesives for mounting the reflector cup 16, but in other embodiments adhesives can be used in conjunction with the reflective cup and anchor arrangement .
- the substrate 12 has a top surface 22 and a bottom surface 24 , with the top surface 22 comprising electrical traces 25 and a mounting pad 26, with LED 17 mounted to the mounting pad 26 and the electrical traces providing an conductive path for electrical connection to the LED 17.
- the mounting pad 26 covers a portion of the top surface (including portions of the traces 25) and is typically located near the center of the top surface 22.
- the traces 25 provide electrical connection to the LED 17 either through the submount 18 or by a bond wire between one of the traces 25 and the LED 17.
- the substrate 12 comprises a number of thru-holes 28 running between its top and bottom surfaces 22, 24. In other embodiments, all or some of the holes 28 can pass partially through the substrate 12 as further described below.
- the substrate 12 includes four thru-holes 28, although fewer or more thru- holes can also be used.
- the thru-holes 28 and traces 25 are arranged such that the holes 28 do not interfere with the electrical path provided by the traces 25.
- the reflector cup 16 comprises four mounting posts 30 arranged and sized to mate with the thru-holes 28 in the substrate 12.
- the reflector cup 16 can be injection molded onto the substrate 12 with the reflector cup material filling the substrate thru-holes 28 and forming the posts 30.
- the reflector cup 16 can be separately formed with posts 30 and then placed on the substrate 12, with the posts 30 inserted into the thru-holes 28.
- the posts 30 can then be heated, deformed or otherwise manipulated so that the reflector cup 16 is anchored in place on the substrate 12 by the posts 30 and positioned substantially flush with the top surface 22 of the substrate 12.
- FIGs. 5-10 show different embodiments of the reflector cup 16 and substrate 12 combinations, with the reflector cup mounted by the cooperation of its posts 30 with the substrate thru-holes 28.
- the thru-holes 28 run through the substrate 12 form the top surface 22 to bottom surface 24.
- the bottom surface 24 of the substrate 12 around thru-holes 28 is shaped to provide a larger diameter surface that helps secure the posts 30 in the thru-holes 28.
- the larger diameter surface can have different shapes, and in one embodiment, it is shaped to provide a tapered portion 32 surrounding the thru-holes 28. In another embodiment, it is shaped to provide an oversized ring 34 around the thru-hole 28.
- the posts 30 fill the thru-holes 28 so that reflector cup 16 is at least partially secured to the substrate 12 by larger diameter portions of the posts that extend over the tapered portions 32 or the ring 34. As shown, the posts 30 fill the holes 28, but it is understood that the posts 30 could fill less than all of the holes 28 as long as the posts 30 and thru-holes 28 cooperate to anchor the reflector cup 16 to the substrate 12.
- FIG. 6 shows another embodiment of a die package according to the present invention wherein the thu-holes 28 do not have a larger diameter surface and the bottom surface 24 of the substrate 12 is flat in the area of the thru-holes 28.
- the reflector cup 16 is secured to the substrate by deformed portions 36 of the reflector c ⁇ p posts 30 that extend beyond the bottom surface 24 with the deformed potions 36 having diameters greater than the diameter of the thru-holes 28.
- the reflector cup 16 has an inner wall 38 and an outer wall 40 separated by a moat 42 ; with a reflective element 20 located on the inner wall 38.
- the reflective element 20 comprises a reflective material, such as silver foil, in the form of a ring that can be press fit to conform to the inner wall 38 surrounding the LED 17. Accordingly, the reflective element 20 can be mounted in place without the use of adhesives.
- the reflective element 20 is a foil ring that snap fits to the reflector cup 16.
- the inner wall 38 of the reflector cup 16 is formed to include a snap-fit structure 46 that interacts with a snap-fit structure 48 on the reflective element 20.
- the reflective elements 20 illustrated in FIGs. 5 and 6 are of substantially uniform thickness and provide a reflective surface having a surface shape substantially the same as the inner wall 38 of the reflector cup 16.
- the reflective element may have varying thickness characteristics that produce a surface shape different from the inner "wall 38.
- FIG. 7 shows another embodiment of a die package according to the present invention having a reflector cup 16 anchored to a substrate 12, wherein the reflective element 20 may have a thickened portion 52 at the top, and a substantially straight inner wall 54 that transitions to a curved lower portion 56 having a gradually decreasing thickness.
- FIG. 7 shows another embodiment of a die package according to the present invention having a reflector cup 16 anchored to a substrate 12, wherein the reflective element 20 may have a thickened portion 52 at the top, and a substantially straight inner wall 54 that transitions to a curved lower portion 56 having a gradually decreasing thickness.
- FIG. 8 shows still another embodiment of a die package with a reflector cup 16 anchored to a substrate 12, wherein the reflective element 20 may have a thickness that gradually decreases from the top 57 to a certain point at the bottom where it then begins to increase to form a concave lower portion 58.
- These different shaped surfaces reflect light from the LED differently and thus provide different light output characteristics, e.g., a more focused light or more scattered light.
- the reflective elements 20 illustrated in the figures are a few examples of different surface shapes that may be imparted to the reflective surface 50 of the reflector cup 16.
- a great variety of different shaped reflective elements 20, each compatible with the reflector cup 16, may be designed depending on the desired light beam output pattern.
- a variety of LED packages having different light output characteristics may be fabricated without having to modify the shape of the reflector cup 16.
- the reflector cup 16 can be anchored to the substrate 12 using many different cooperating elements beyond those shown above in FIGs. 5-8.
- the substrate 12 can have holes 60 that do not pass completely though, but instead pass only partially from the top surface 22 to the bottom surface 24, through the substrate 12.
- the base of the holes 60 can have a tapered portion 62 such that when the posts 64 fill the holes 60, the taped portion 62 is filled by the post material to anchor the reflector cup 16 to the substrate 12.
- the holes 60 and tapered portion 62 can be formed in many different ways such as by etching or drilling.
- the substrate 12 can be formed of upper and lower portions 65, 66, with the holes 60 and tapered portions 62 formed in the upper portion 65 and the upper and lower portions 65, 66 bonded together.
- FIG. 10 shows another embodiment of the substrate holes 61 that pass partially though the substrate 12 and do not have a tapered portion. Posts 69 are arranged to mate with the holes 67 to anchor the reflector cup 16.
- the reflector cup 16 can be injection molded onto the substrate 12 or it can be separately formed and then mounted to the substrate. It is also understood that different types of reflector cup and die components can cooperate to anchor the reflector cup such as hooks, snaps, clamps, etc., with each of these anchoring the reflector cup without the use of an adhesive .
- a die package configured in accordance with the invention may be manufactured by first providing a substrate 12 with thru-holes and anchoring a reflector cup 16 to the substrate 12. As discussed above, in one embodiment, this may be done by injection molding reflector cup material such that the material passes into and through the thru-holes 28, to form the posts 30. The material is also injected directly onto the top surface 22 of the substrate 12 to form the reflector cup 16 anchored to the substrate 12. During the injection molding process, the base material adheres to the top surface and to the walls of the thru-holes to at least partially secure the reflector cup 16 in place.
- a reflector 16 having thru-hole posts 30 may be -molded separate from the substrate 12, such as by injection molding, and then secured to the substrate 12 during a separate manufacturing step.
- the reflector cup 16 may be placed on the substrate by positioning the posts 30 through the substrate thru-holes 28 and secured in place by deforming the portions 36 of the posts 30 that extend beyond the bottom surface 24 of the substrate to secure the reflector base in place.
- the extending portion of the posts may be deformed, for example by melting them with a hot knife.
- the reflector cup 16 can include many features to assist in encapsulation and/or attachment of secondary optics such as a meniscus defining rim or snap-fit aligning tabs.
- the LED assembly 14 is mounted on the top .surface 22 of the substrate (preferably on a mounting pad 26 as shown in FIG. 3) using known stack and reflow processes.
- the assembly can be cleaned and a reflective element 20 can be placed on the inner wall 38 of the reflector cup 16.
- the reflective element 20 can be press-fit on the inner surface using a pick-up collet process to shape and secure the reflective element 20 in place .
- the reflective element 20 may be placed on the inner wall 38 prior to mounting the LED assembly 14.
- the reflective element 20 press fitted or snap fitted to the reflector cup 16 immediately after the injection molding process.
- the reflector element 20 may be placed on the reflector base either prior to or after securing the reflector base to the substrate 12.
- the LED assembly 14 can be wire bonded 71 to the substrate, preferably to a wire trace 25 as shown in FIG. 3.
- the LED assembly 14 can then be encapsulated in the substrate/reflector assembly using encapsulation material such as, for example, silicones or polymers.
- the encapsulation material is preferably high temperature polymer with high light transmissivity and a refractive index that matches or closely matches the refractive index of the lens 18, which may be made from glass, quartz, high temperature and transparent plastic, silicone or a combination of these materials.
- a lens can be placed on top of and adheres to the encapsulation material as described below.
- FIG. 15 shows another embodiment of a die package 80 according to the present invention, comprising a substrate 12 and LED 14.
- a reflector cup 82 is included that is made from a plastic that has light reflecting/scattering properties. As discussed above an example of one such plastic is AmodelTM, which is available from Solvay Advanced Polymers, LLC, (www.solvayadvancedpolymers.com). In this configuration, a separate reflective element is not needed due to the reflective properties of the reflector cup 82 material. Thus, the reflector cup 82 by itself has reflective properties sufficient to reflect the LED light.
- reflector cup 82 has posts 84 that cooperate with the substrate thru- holes 86 to mount the reflector cup 82 to the substrate 12. The thru-holes 86 can be fully or partially through the substrate ⁇ 12 and the corresponding post is sized to fit its corresponding thru-hole.
- the embodiment of FIG. 15 may be manufactured using either of the injection-molded or the separate-molded processes previously described.
- the reflector cup material may have a low tolerance to high temperatures, other processing steps may have to be altered.
- a high-temperature tolerant silver-tin solder paste may need to be used to secure the LED assembly 14 to the top surface 22 of the substrate 12 instead of a gold-tin solder paste.
- different light output characteristics for the LED package 80 may be obtained by changing the surface shape of the inner surfaces of the reflector cup 82.
- the reflector cup can be used with different reflective elements as described above to obtain different light output characteristics. Referring now to FIGs.
- an encapsulating material such as liquid silicone gel
- an encapsulating material such as liquid silicone gel
- secondary optics such as a lens 92 can be placed over the cavity 90 of the reflector cup 16 and in contact with the encapsulating material .
- the die package 10 is typically heat-cured, which causes the encapsulating material to solidify and adhere to the lens 92, holding lens 92 in place over the reflector cup cavity 90.
- Many different lenses and encapsulating materials can be used in die packages according to the present invention to provide different output characteristics. It will be apparent from the foregoing that while particular forms of the invention have been illustrated and described, various modifications can be made without departing from the spirit and scope of the invention. Accordingly, it is not intended that the invention be limited, except as by the appended claims.
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008515699A JP2008544488A (en) | 2005-06-10 | 2006-04-27 | LED package |
DE112006001539T DE112006001539T5 (en) | 2005-06-10 | 2006-04-27 | Power control lamp housing |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/149,998 US8669572B2 (en) | 2005-06-10 | 2005-06-10 | Power lamp package |
US11/149,998 | 2005-06-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2006135496A2 true WO2006135496A2 (en) | 2006-12-21 |
WO2006135496A3 WO2006135496A3 (en) | 2007-04-26 |
Family
ID=37523361
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2006/016259 WO2006135496A2 (en) | 2005-06-10 | 2006-04-27 | Led package |
Country Status (5)
Country | Link |
---|---|
US (1) | US8669572B2 (en) |
JP (1) | JP2008544488A (en) |
DE (1) | DE112006001539T5 (en) |
TW (1) | TW200735414A (en) |
WO (1) | WO2006135496A2 (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009094282A (en) * | 2007-10-09 | 2009-04-30 | Cosmo Electronics Corp | High-power light emitting diode structure |
JP2012060181A (en) * | 2007-01-22 | 2012-03-22 | Cree Inc | Wafer level phosphor coating method and devices fabricated utilizing the method |
EP2454765A1 (en) * | 2009-07-15 | 2012-05-23 | OSRAM Opto Semiconductors GmbH | Light-emitting diode and method for producing a light-emitting diode |
US8878219B2 (en) | 2008-01-11 | 2014-11-04 | Cree, Inc. | Flip-chip phosphor coating method and devices fabricated utilizing method |
US9024349B2 (en) | 2007-01-22 | 2015-05-05 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
US9041285B2 (en) | 2007-12-14 | 2015-05-26 | Cree, Inc. | Phosphor distribution in LED lamps using centrifugal force |
US9093616B2 (en) | 2003-09-18 | 2015-07-28 | Cree, Inc. | Molded chip fabrication method and apparatus |
US9166126B2 (en) | 2011-01-31 | 2015-10-20 | Cree, Inc. | Conformally coated light emitting devices and methods for providing the same |
US9841175B2 (en) | 2012-05-04 | 2017-12-12 | GE Lighting Solutions, LLC | Optics system for solid state lighting apparatus |
US9951938B2 (en) | 2009-10-02 | 2018-04-24 | GE Lighting Solutions, LLC | LED lamp |
US10340424B2 (en) | 2002-08-30 | 2019-07-02 | GE Lighting Solutions, LLC | Light emitting diode component |
US10546846B2 (en) | 2010-07-23 | 2020-01-28 | Cree, Inc. | Light transmission control for masking appearance of solid state light sources |
Families Citing this family (72)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006186297A (en) * | 2004-12-03 | 2006-07-13 | Toshiba Corp | Semiconductor light emitting device and its manufacturing method |
US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
US7939842B2 (en) * | 2005-01-27 | 2011-05-10 | Cree, Inc. | Light emitting device packages, light emitting diode (LED) packages and related methods |
JP4991173B2 (en) * | 2005-04-27 | 2012-08-01 | 京セラ株式会社 | Light-emitting element mounting substrate and light-emitting device using the same |
US7554177B2 (en) * | 2005-10-05 | 2009-06-30 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Attachment system incorporating a recess in a structure |
US7378686B2 (en) * | 2005-10-18 | 2008-05-27 | Goldeneye, Inc. | Light emitting diode and side emitting lens |
KR100648628B1 (en) * | 2005-12-29 | 2006-11-24 | 서울반도체 주식회사 | Light emitting diode |
US7521728B2 (en) * | 2006-01-20 | 2009-04-21 | Cree, Inc. | Packages for semiconductor light emitting devices utilizing dispensed reflectors and methods of forming the same |
US7675145B2 (en) * | 2006-03-28 | 2010-03-09 | Cree Hong Kong Limited | Apparatus, system and method for use in mounting electronic elements |
US8748915B2 (en) * | 2006-04-24 | 2014-06-10 | Cree Hong Kong Limited | Emitter package with angled or vertical LED |
US8735920B2 (en) | 2006-07-31 | 2014-05-27 | Cree, Inc. | Light emitting diode package with optical element |
US7485480B2 (en) * | 2006-09-21 | 2009-02-03 | Harvatek Corporation | Method of manufacturing high power light-emitting device package and structure thereof |
US9711703B2 (en) | 2007-02-12 | 2017-07-18 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
TW200839378A (en) * | 2007-03-21 | 2008-10-01 | Chi Mei Optoelectronics Corp | Light emitting element, backlight module and plane display apparatus |
CN101711434B (en) * | 2007-06-25 | 2012-03-21 | 新灯源科技有限公司 | Led lighting device |
US7652297B2 (en) * | 2007-09-11 | 2010-01-26 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Light emitting device |
US8866169B2 (en) | 2007-10-31 | 2014-10-21 | Cree, Inc. | LED package with increased feature sizes |
US10256385B2 (en) | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
TWI385781B (en) * | 2008-01-23 | 2013-02-11 | I Chiun Precision Ind Co Ltd | Lead frame |
US8791471B2 (en) | 2008-11-07 | 2014-07-29 | Cree Hong Kong Limited | Multi-chip light emitting diode modules |
CN101430052A (en) * | 2008-12-15 | 2009-05-13 | 伟志光电(深圳)有限公司 | PCB rubber shell integrated packaging LED illumination light source and its production technique |
US20110037083A1 (en) * | 2009-01-14 | 2011-02-17 | Alex Chi Keung Chan | Led package with contrasting face |
US8368112B2 (en) | 2009-01-14 | 2013-02-05 | Cree Huizhou Opto Limited | Aligned multiple emitter package |
JP5331512B2 (en) * | 2009-02-26 | 2013-10-30 | 株式会社アイ・ライティング・システム | LED lighting equipment |
JP2012532441A (en) | 2009-07-03 | 2012-12-13 | ソウル セミコンダクター カンパニー リミテッド | Light emitting diode package |
TWI364122B (en) * | 2009-07-06 | 2012-05-11 | Led package structure for increasing light-emitting efficiency and controlling light-projecting angle and method for manufacturing the same | |
JPWO2011007874A1 (en) | 2009-07-17 | 2012-12-27 | 電気化学工業株式会社 | LED chip assembly, LED package, and manufacturing method of LED package |
JP5359817B2 (en) * | 2009-11-26 | 2013-12-04 | セイコーエプソン株式会社 | Light emitting device and projector |
CN102751426B (en) * | 2010-01-20 | 2015-08-12 | 光宝电子(广州)有限公司 | Encapsulating structure and package structure for LED |
US8525213B2 (en) * | 2010-03-30 | 2013-09-03 | Lg Innotek Co., Ltd. | Light emitting device having multiple cavities and light unit having the same |
TWM394578U (en) | 2010-04-20 | 2010-12-11 | Sdi Corp | Frame substrate of illumination device and its package structure |
JP5488310B2 (en) * | 2010-07-30 | 2014-05-14 | 市光工業株式会社 | Light source unit of semiconductor light source for vehicle lamp, vehicle lamp |
US10309627B2 (en) | 2012-11-08 | 2019-06-04 | Cree, Inc. | Light fixture retrofit kit with integrated light bar |
US9822951B2 (en) | 2010-12-06 | 2017-11-21 | Cree, Inc. | LED retrofit lens for fluorescent tube |
KR20120108437A (en) * | 2011-03-24 | 2012-10-05 | 삼성전자주식회사 | Light emitting device package |
KR101259052B1 (en) | 2011-03-30 | 2013-04-29 | 박재훈 | Light emitting diode package with reflector having thermal radiation funtion, light emitting diode package assembly with reflector having thermal radiation funtion and method of manufacturing the same |
CN103081132B (en) * | 2011-04-07 | 2017-09-29 | 惠州科锐半导体照明有限公司 | Light-emitting diode display with the LED component for tilting peak emission and comprising such devices |
JP5681035B2 (en) * | 2011-04-25 | 2015-03-04 | 電気化学工業株式会社 | LED light source package |
WO2013061228A1 (en) * | 2011-10-28 | 2013-05-02 | Koninklijke Philips Electronics N.V. | Light emitting device with integral shaped reflector |
US10043960B2 (en) * | 2011-11-15 | 2018-08-07 | Cree, Inc. | Light emitting diode (LED) packages and related methods |
KR20130087249A (en) * | 2012-01-27 | 2013-08-06 | 삼성전자주식회사 | Semiconductor apparatus and image sensor package using the same |
CN103378252B (en) | 2012-04-16 | 2016-01-06 | 展晶科技(深圳)有限公司 | Light emitting diode module |
CN103515520B (en) * | 2012-06-29 | 2016-03-23 | 展晶科技(深圳)有限公司 | Package structure for LED and manufacture method thereof |
JP2014082453A (en) * | 2012-09-25 | 2014-05-08 | Toyoda Gosei Co Ltd | Method of manufacturing light-emitting device |
US9482396B2 (en) | 2012-11-08 | 2016-11-01 | Cree, Inc. | Integrated linear light engine |
US9441818B2 (en) | 2012-11-08 | 2016-09-13 | Cree, Inc. | Uplight with suspended fixture |
US9494304B2 (en) | 2012-11-08 | 2016-11-15 | Cree, Inc. | Recessed light fixture retrofit kit |
US10788176B2 (en) | 2013-02-08 | 2020-09-29 | Ideal Industries Lighting Llc | Modular LED lighting system |
US8727567B1 (en) | 2012-12-18 | 2014-05-20 | Jds Uniphase Corporation | Semiconductor light source having a reflector |
JP5998962B2 (en) * | 2013-01-31 | 2016-09-28 | 三菱電機株式会社 | Semiconductor optical device |
US9874333B2 (en) | 2013-03-14 | 2018-01-23 | Cree, Inc. | Surface ambient wrap light fixture |
US10584860B2 (en) | 2013-03-14 | 2020-03-10 | Ideal Industries, Llc | Linear light fixture with interchangeable light engine unit |
US9461024B2 (en) | 2013-08-01 | 2016-10-04 | Cree, Inc. | Light emitter devices and methods for light emitting diode (LED) chips |
JP5956396B2 (en) * | 2013-09-06 | 2016-07-27 | 京セラコネクタプロダクツ株式会社 | lighting equipment |
US10900653B2 (en) | 2013-11-01 | 2021-01-26 | Cree Hong Kong Limited | LED mini-linear light engine |
US10612747B2 (en) * | 2013-12-16 | 2020-04-07 | Ideal Industries Lighting Llc | Linear shelf light fixture with gap filler elements |
US10100988B2 (en) | 2013-12-16 | 2018-10-16 | Cree, Inc. | Linear shelf light fixture with reflectors |
DE102013114345A1 (en) * | 2013-12-18 | 2015-06-18 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component |
USD757324S1 (en) | 2014-04-14 | 2016-05-24 | Cree, Inc. | Linear shelf light fixture with reflectors |
US9601670B2 (en) | 2014-07-11 | 2017-03-21 | Cree, Inc. | Method to form primary optic with variable shapes and/or geometries without a substrate |
US10622522B2 (en) | 2014-09-05 | 2020-04-14 | Theodore Lowes | LED packages with chips having insulated surfaces |
US10453825B2 (en) * | 2014-11-11 | 2019-10-22 | Cree, Inc. | Light emitting diode (LED) components and methods |
DE102015112042B4 (en) * | 2015-07-23 | 2021-07-01 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelectronic lighting device |
CN106449954A (en) * | 2015-08-13 | 2017-02-22 | 比亚迪股份有限公司 | Power type LED bracket and preparing method thereof |
CN205037120U (en) * | 2015-08-21 | 2016-02-17 | 全亿大科技(佛山)有限公司 | Light emitting diode (LED) lamp |
JP1563810S (en) * | 2016-03-24 | 2016-11-21 | ||
US10263587B2 (en) | 2016-12-23 | 2019-04-16 | Avago Technologies International Sales Pte. Limited | Packaged resonator with polymeric air cavity package |
US10511285B1 (en) * | 2017-02-28 | 2019-12-17 | Avago Technologies International Sales Pte. Limited | Anchored polymeric package for acoustic resonator structures |
CN108540086A (en) * | 2018-01-18 | 2018-09-14 | 浙江人和光伏科技有限公司 | A kind of conductive module of solar battery connecting box |
US10957736B2 (en) | 2018-03-12 | 2021-03-23 | Cree, Inc. | Light emitting diode (LED) components and methods |
JP7082280B2 (en) * | 2018-03-30 | 2022-06-08 | 日亜化学工業株式会社 | Light emitting device |
TWI737505B (en) * | 2020-09-29 | 2021-08-21 | 力成科技股份有限公司 | Package structure |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5130761A (en) * | 1990-07-17 | 1992-07-14 | Kabushiki Kaisha Toshiba | Led array with reflector and printed circuit board |
JP2001060072A (en) * | 1999-08-23 | 2001-03-06 | Matsushita Electric Ind Co Ltd | Display device |
WO2002017405A1 (en) * | 2000-08-23 | 2002-02-28 | Osram Opto Semiconductors Gmbh | Optoelectronic component and method for the production thereof, module and device comprising a module of this type |
EP1187228A1 (en) * | 2000-02-09 | 2002-03-13 | Nippon Leiz Corporation | Light source |
WO2004044877A2 (en) * | 2002-11-11 | 2004-05-27 | Cotco International Limited | A display device and method for making same |
EP1521313A2 (en) * | 2003-10-03 | 2005-04-06 | LumiLeds Lighting U.S., LLC | Integrated reflector cup for a light emitting device mount |
WO2005043627A1 (en) * | 2003-10-22 | 2005-05-12 | Cree, Inc. | Power surface mount light emitting die package |
Family Cites Families (201)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3760237A (en) | 1972-06-21 | 1973-09-18 | Gen Electric | Solid state lamp assembly having conical light director |
JPS53126570U (en) | 1977-03-15 | 1978-10-07 | ||
FR2436505A1 (en) | 1978-09-12 | 1980-04-11 | Radiotechnique Compelec | OPTOELECTRONIC DEVICE WITH COUPLED TRANSMITTER AND RECEIVER |
JPS604991B2 (en) | 1979-05-11 | 1985-02-07 | 株式会社東芝 | display device |
US4511425A (en) | 1983-06-13 | 1985-04-16 | Dennison Manufacturing Company | Heated pad decorator |
JPH0416467Y2 (en) | 1986-03-31 | 1992-04-13 | ||
DE58909875D1 (en) | 1989-05-31 | 2000-08-31 | Osram Opto Semiconductors Gmbh | Method for mounting a surface mount opto component |
US5167556A (en) | 1990-07-03 | 1992-12-01 | Siemens Aktiengesellschaft | Method for manufacturing a light emitting diode display means |
US5122943A (en) | 1991-04-15 | 1992-06-16 | Miles Inc. | Encapsulated light emitting diode and method for encapsulation |
US5351106A (en) | 1991-07-01 | 1994-09-27 | Amergraph Corporation | Exposure system |
AU4782293A (en) | 1992-07-24 | 1994-02-14 | Tessera, Inc. | Semiconductor connection components and methods with releasable lead support |
US5790298A (en) * | 1994-05-03 | 1998-08-04 | Gentex Corporation | Method of forming optically transparent seal and seal formed by said method |
JPH08156324A (en) * | 1994-12-12 | 1996-06-18 | Rohm Co Ltd | Protective cover attaching device in led array head |
DE4446566A1 (en) | 1994-12-24 | 1996-06-27 | Telefunken Microelectron | Multipole, surface-mountable, electronic component |
JPH10503330A (en) | 1995-05-10 | 1998-03-24 | フィリップス エレクトロニクス ネムローゼ フェンノートシャップ | Small semiconductor device for surface mounting |
DE19549818B4 (en) | 1995-09-29 | 2010-03-18 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor device |
AU2304997A (en) | 1996-03-19 | 1997-10-10 | Donnelly Mirrors Limited | Electro-optic rearview mirror system |
DE19621124A1 (en) | 1996-05-24 | 1997-11-27 | Siemens Ag | Optoelectronic converter and its manufacturing process |
JPH09321343A (en) | 1996-05-31 | 1997-12-12 | Dowa Mining Co Ltd | Component device for optical communication |
DE19638667C2 (en) | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mixed-color light-emitting semiconductor component with luminescence conversion element |
JP3316838B2 (en) * | 1997-01-31 | 2002-08-19 | 日亜化学工業株式会社 | Light emitting device |
JP3741512B2 (en) | 1997-04-14 | 2006-02-01 | ローム株式会社 | LED chip parts |
US5813753A (en) | 1997-05-27 | 1998-09-29 | Philips Electronics North America Corporation | UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light |
DE29825062U1 (en) | 1997-07-29 | 2004-07-22 | Osram Opto Semiconductors Gmbh | Optoelectronic component |
US6183100B1 (en) * | 1997-10-17 | 2001-02-06 | Truck-Lite Co., Inc. | Light emitting diode 360° warning lamp |
DE19755734A1 (en) | 1997-12-15 | 1999-06-24 | Siemens Ag | Method for producing a surface-mountable optoelectronic component |
DE19829197C2 (en) | 1998-06-30 | 2002-06-20 | Siemens Ag | Component emitting and / or receiving radiation |
US5959316A (en) | 1998-09-01 | 1999-09-28 | Hewlett-Packard Company | Multiple encapsulation of phosphor-LED devices |
US6274924B1 (en) | 1998-11-05 | 2001-08-14 | Lumileds Lighting, U.S. Llc | Surface mountable LED package |
JP3334864B2 (en) | 1998-11-19 | 2002-10-15 | 松下電器産業株式会社 | Electronic equipment |
JP2000223751A (en) | 1998-11-25 | 2000-08-11 | Nichia Chem Ind Ltd | Led lamp and display device using the led lamp |
US6429583B1 (en) | 1998-11-30 | 2002-08-06 | General Electric Company | Light emitting device with ba2mgsi2o7:eu2+, ba2sio4:eu2+, or (srxcay ba1-x-y)(a1zga1-z)2sr:eu2+phosphors |
JP3784976B2 (en) | 1998-12-22 | 2006-06-14 | ローム株式会社 | Semiconductor device |
JP4279388B2 (en) | 1999-01-29 | 2009-06-17 | 日亜化学工業株式会社 | Optical semiconductor device and method for forming the same |
JP3349109B2 (en) | 1999-03-04 | 2002-11-20 | 株式会社シチズン電子 | Surface mount type light emitting diode and method of manufacturing the same |
US6259608B1 (en) | 1999-04-05 | 2001-07-10 | Delphi Technologies, Inc. | Conductor pattern for surface mount devices and method therefor |
JP2001042792A (en) | 1999-05-24 | 2001-02-16 | Sony Corp | Led display device |
JP2001044506A (en) | 1999-07-26 | 2001-02-16 | Ichikoh Ind Ltd | Fixation structure for light emitting diode |
CA2314679A1 (en) * | 1999-07-28 | 2001-01-28 | William Kelly | Improvements in and relating to ring lighting |
US6710373B2 (en) | 1999-09-27 | 2004-03-23 | Shih-Yi Wang | Means for mounting photoelectric sensing elements, light emitting diodes, or the like |
US6296367B1 (en) | 1999-10-15 | 2001-10-02 | Armament Systems And Procedures, Inc. | Rechargeable flashlight with step-up voltage converter and recharger therefor |
JP2001168400A (en) | 1999-12-09 | 2001-06-22 | Rohm Co Ltd | Chip type light emitting device with case and its manufacturing method |
DE19964252A1 (en) | 1999-12-30 | 2002-06-06 | Osram Opto Semiconductors Gmbh | Surface mount component for an LED white light source |
DE10002521A1 (en) | 2000-01-21 | 2001-08-09 | Infineon Technologies Ag | Electro-optical data transmission module |
US6224216B1 (en) | 2000-02-18 | 2001-05-01 | Infocus Corporation | System and method employing LED light sources for a projection display |
JP3729012B2 (en) | 2000-02-24 | 2005-12-21 | 松下電工株式会社 | LED module |
US6517218B2 (en) | 2000-03-31 | 2003-02-11 | Relume Corporation | LED integrated heat sink |
EP1204151A4 (en) | 2000-04-24 | 2006-10-18 | Rohm Co Ltd | Edge-emitting light-emitting semiconductor device and method of manufacture thereof |
US20020066905A1 (en) | 2000-06-20 | 2002-06-06 | Bily Wang | Wing-shaped surface mount package for light emitting diodes |
US7129638B2 (en) * | 2000-08-09 | 2006-10-31 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Light emitting devices with a phosphor coating having evenly dispersed phosphor particles and constant thickness |
EP1187226B1 (en) | 2000-09-01 | 2012-12-26 | Citizen Electronics Co., Ltd. | Surface-mount type light emitting diode and method of manufacturing same |
US7064355B2 (en) | 2000-09-12 | 2006-06-20 | Lumileds Lighting U.S., Llc | Light emitting diodes with improved light extraction efficiency |
US6940704B2 (en) | 2001-01-24 | 2005-09-06 | Gelcore, Llc | Semiconductor light emitting device |
JP2002223005A (en) | 2001-01-26 | 2002-08-09 | Toyoda Gosei Co Ltd | Light emitting diode and display device |
IE20020300A1 (en) | 2001-04-23 | 2003-03-19 | Plasma Ireland Ltd | An Illuminator |
US20020163001A1 (en) | 2001-05-04 | 2002-11-07 | Shaddock David Mulford | Surface mount light emitting device package and fabrication method |
JP2002344029A (en) * | 2001-05-17 | 2002-11-29 | Rohm Co Ltd | Method of adjusting color tone of light-emitting diode |
JP2002374007A (en) | 2001-06-15 | 2002-12-26 | Toyoda Gosei Co Ltd | Light-emitting apparatus |
TW543128B (en) | 2001-07-12 | 2003-07-21 | Highlink Technology Corp | Surface mounted and flip chip type LED package |
US6686580B1 (en) * | 2001-07-16 | 2004-02-03 | Amkor Technology, Inc. | Image sensor package with reflector |
US6700136B2 (en) | 2001-07-30 | 2004-03-02 | General Electric Company | Light emitting device package |
CN2498694Y (en) | 2001-08-14 | 2002-07-03 | 北京利亚德电子科技有限公司 | Inclined LED image module |
US6812481B2 (en) | 2001-09-03 | 2004-11-02 | Toyoda Gosei Co., Ltd. | LED device and manufacturing method thereof |
CN1265338C (en) | 2001-11-21 | 2006-07-19 | 佳能株式会社 | Display device, image signal controller and driving controller thereof |
DE10241989A1 (en) | 2001-11-30 | 2003-06-18 | Osram Opto Semiconductors Gmbh | Optoelectronic component |
JP4009097B2 (en) | 2001-12-07 | 2007-11-14 | 日立電線株式会社 | LIGHT EMITTING DEVICE, ITS MANUFACTURING METHOD, AND LEAD FRAME USED FOR MANUFACTURING LIGHT EMITTING DEVICE |
KR100439402B1 (en) | 2001-12-24 | 2004-07-09 | 삼성전기주식회사 | Light emission diode package |
US6480389B1 (en) | 2002-01-04 | 2002-11-12 | Opto Tech Corporation | Heat dissipation structure for solid-state light emitting device package |
JP3973082B2 (en) | 2002-01-31 | 2007-09-05 | シチズン電子株式会社 | Double-sided LED package |
US6924514B2 (en) | 2002-02-19 | 2005-08-02 | Nichia Corporation | Light-emitting device and process for producing thereof |
JP2003258305A (en) | 2002-02-27 | 2003-09-12 | Oki Degital Imaging:Kk | Semiconductor element array |
KR100951626B1 (en) | 2002-03-08 | 2010-04-09 | 로무 가부시키가이샤 | Semiconductor device using semiconductor chip |
JP3924481B2 (en) | 2002-03-08 | 2007-06-06 | ローム株式会社 | Semiconductor device using semiconductor chip |
JP3939177B2 (en) * | 2002-03-20 | 2007-07-04 | シャープ株式会社 | Method for manufacturing light emitting device |
JP3707688B2 (en) * | 2002-05-31 | 2005-10-19 | スタンレー電気株式会社 | Light emitting device and manufacturing method thereof |
JP3912607B2 (en) | 2002-06-19 | 2007-05-09 | サンケン電気株式会社 | Manufacturing method of semiconductor light emitting device |
TW546799B (en) | 2002-06-26 | 2003-08-11 | Lingsen Precision Ind Ltd | Packaged formation method of LED and product structure |
DE10229067B4 (en) | 2002-06-28 | 2007-08-16 | Osram Opto Semiconductors Gmbh | Optoelectronic component and method for its production |
JP2004047748A (en) | 2002-07-12 | 2004-02-12 | Stanley Electric Co Ltd | Light-emitting diode |
TWI226598B (en) | 2002-07-15 | 2005-01-11 | Au Optronics Corp | Display driving device and the method thereof |
WO2004038759A2 (en) | 2002-08-23 | 2004-05-06 | Dahm Jonathan S | Method and apparatus for using light emitting diodes |
JP4407204B2 (en) | 2002-08-30 | 2010-02-03 | 日亜化学工業株式会社 | Light emitting device |
US7224000B2 (en) | 2002-08-30 | 2007-05-29 | Lumination, Llc | Light emitting diode component |
US7264378B2 (en) | 2002-09-04 | 2007-09-04 | Cree, Inc. | Power surface mount light emitting die package |
JP2004103775A (en) | 2002-09-09 | 2004-04-02 | Eeshikku Kk | Chip led light emitting body and method for manufacturing the same |
DE10243247A1 (en) | 2002-09-17 | 2004-04-01 | Osram Opto Semiconductors Gmbh | Leadframe-based component housing, leadframe tape, surface-mountable electronic component and method of manufacture |
JP2004146815A (en) | 2002-09-30 | 2004-05-20 | Sanyo Electric Co Ltd | Light emitting device |
US6686609B1 (en) | 2002-10-01 | 2004-02-03 | Ultrastar Limited | Package structure of surface mounting led and method of manufacturing the same |
TW200414572A (en) | 2002-11-07 | 2004-08-01 | Matsushita Electric Ind Co Ltd | LED lamp |
DE10255932A1 (en) | 2002-11-29 | 2004-06-17 | Osram Opto Semiconductors Gmbh | Optoelectronic component |
US7692206B2 (en) | 2002-12-06 | 2010-04-06 | Cree, Inc. | Composite leadframe LED package and method of making the same |
JP4299535B2 (en) | 2002-12-16 | 2009-07-22 | パナソニック株式会社 | Light emitting diode display device |
CN2617039Y (en) | 2003-02-21 | 2004-05-19 | 游尚桦 | Sticking LED lead frame |
EP1597764A1 (en) | 2003-02-28 | 2005-11-23 | Osram Opto Semiconductors GmbH | Optoelectronic component comprising a housing body which is metallised in a structured manner, method for producing one such component, and method for the structured metallisation of a body containing plastic |
USD517025S1 (en) | 2003-03-17 | 2006-03-14 | Nichia Corporation | Light emitting diode |
US20040188696A1 (en) | 2003-03-28 | 2004-09-30 | Gelcore, Llc | LED power package |
JP4504662B2 (en) | 2003-04-09 | 2010-07-14 | シチズン電子株式会社 | LED lamp |
EP1620903B1 (en) | 2003-04-30 | 2017-08-16 | Cree, Inc. | High-power solid state light emitter package |
US7005679B2 (en) | 2003-05-01 | 2006-02-28 | Cree, Inc. | Multiple component solid state white light |
JP4341951B2 (en) | 2003-05-07 | 2009-10-14 | シチズン電子株式会社 | Light emitting diode and its package structure |
JP2004335880A (en) | 2003-05-09 | 2004-11-25 | Toshiba Lighting & Technology Corp | Light emitting device |
US7021797B2 (en) | 2003-05-13 | 2006-04-04 | Light Prescriptions Innovators, Llc | Optical device for repositioning and redistributing an LED's light |
JP2004356506A (en) | 2003-05-30 | 2004-12-16 | Stanley Electric Co Ltd | Glass sealed type light emitting diode |
JP3977774B2 (en) | 2003-06-03 | 2007-09-19 | ローム株式会社 | Optical semiconductor device |
JP4120813B2 (en) | 2003-06-12 | 2008-07-16 | セイコーエプソン株式会社 | Optical component and manufacturing method thereof |
JP4645071B2 (en) | 2003-06-20 | 2011-03-09 | 日亜化学工業株式会社 | Package molded body and semiconductor device using the same |
JP4034241B2 (en) | 2003-06-27 | 2008-01-16 | 日本ライツ株式会社 | LIGHT SOURCE DEVICE AND LIGHT SOURCE DEVICE MANUFACTURING METHOD |
TWI312582B (en) | 2003-07-24 | 2009-07-21 | Epistar Corporatio | Led device, flip-chip led package and light reflecting structure |
JP4360858B2 (en) | 2003-07-29 | 2009-11-11 | シチズン電子株式会社 | Surface mount type LED and light emitting device using the same |
US6876008B2 (en) | 2003-07-31 | 2005-04-05 | Lumileds Lighting U.S., Llc | Mount for semiconductor light emitting device |
JP3969660B2 (en) * | 2003-08-05 | 2007-09-05 | スタンレー電気株式会社 | White LED lamp |
JP2005064047A (en) | 2003-08-13 | 2005-03-10 | Citizen Electronics Co Ltd | Light emitting diode |
JP2005079167A (en) | 2003-08-28 | 2005-03-24 | Kyocera Corp | Light emitting element housing package and light emitting device |
US20050077535A1 (en) | 2003-10-08 | 2005-04-14 | Joinscan Electronics Co., Ltd | LED and its manufacturing process |
CN2646873Y (en) | 2003-10-16 | 2004-10-06 | 上海三思科技发展有限公司 | A surface sticking type LED with tilted light axis |
US20050117325A1 (en) | 2003-11-14 | 2005-06-02 | Hsieh Hsin-Mao | Desk lamp with function of generating negative ions |
JP4231391B2 (en) | 2003-11-19 | 2009-02-25 | パナソニック株式会社 | Lead frame for semiconductor device and surface light emitting device using the same |
JP2005159081A (en) * | 2003-11-27 | 2005-06-16 | Kyocera Corp | Package for light emitting element housing, and light emitting device |
JP2005191530A (en) | 2003-12-03 | 2005-07-14 | Sumitomo Electric Ind Ltd | Light emitting device |
JP2005183531A (en) | 2003-12-17 | 2005-07-07 | Sharp Corp | Semiconductor light emitting device |
US7321161B2 (en) | 2003-12-19 | 2008-01-22 | Philips Lumileds Lighting Company, Llc | LED package assembly with datum reference feature |
JP4442216B2 (en) | 2003-12-19 | 2010-03-31 | 豊田合成株式会社 | LED lamp device |
JP2005197369A (en) * | 2004-01-05 | 2005-07-21 | Toshiba Corp | Optical semiconductor device |
US7675231B2 (en) * | 2004-02-13 | 2010-03-09 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Light emitting diode display device comprising a high temperature resistant overlay |
US20050179041A1 (en) | 2004-02-18 | 2005-08-18 | Lumileds Lighting U.S., Llc | Illumination system with LEDs |
US7326583B2 (en) * | 2004-03-31 | 2008-02-05 | Cree, Inc. | Methods for packaging of a semiconductor light emitting device |
US7514867B2 (en) | 2004-04-19 | 2009-04-07 | Panasonic Corporation | LED lamp provided with optical diffusion layer having increased thickness and method of manufacturing thereof |
JP2005310935A (en) | 2004-04-20 | 2005-11-04 | Sumitomo Metal Electronics Devices Inc | Storing package for light-emitting element |
JP2005347401A (en) | 2004-06-01 | 2005-12-15 | Meiko:Kk | Optical element chip component |
TWM258416U (en) | 2004-06-04 | 2005-03-01 | Lite On Technology Corp | Power LED package module |
WO2006001352A1 (en) | 2004-06-25 | 2006-01-05 | Sanyo Electric Co., Ltd. | Light-emitting device |
JP2006019557A (en) | 2004-07-02 | 2006-01-19 | Fujikura Ltd | Light emitting device, its mounting method, lighting apparatus and display |
JP4547569B2 (en) | 2004-08-31 | 2010-09-22 | スタンレー電気株式会社 | Surface mount type LED |
JP5192811B2 (en) | 2004-09-10 | 2013-05-08 | ソウル セミコンダクター カンパニー リミテッド | Light emitting diode package with multiple mold resin |
JP2006114854A (en) | 2004-10-18 | 2006-04-27 | Sharp Corp | Semiconductor light emitting device, and backlight device for liquid crystal display |
JP2006119357A (en) | 2004-10-21 | 2006-05-11 | Koha Co Ltd | Display device |
US8816369B2 (en) | 2004-10-29 | 2014-08-26 | Led Engin, Inc. | LED packages with mushroom shaped lenses and methods of manufacturing LED light-emitting devices |
JP4796293B2 (en) | 2004-11-04 | 2011-10-19 | 株式会社 日立ディスプレイズ | Manufacturing method of lighting device |
JP2006140281A (en) | 2004-11-11 | 2006-06-01 | Stanley Electric Co Ltd | Power led and its manufacturing method |
US7419839B2 (en) | 2004-11-12 | 2008-09-02 | Philips Lumileds Lighting Company, Llc | Bonding an optical element to a light emitting device |
GB2420221B (en) | 2004-11-12 | 2009-09-09 | Unity Opto Technology Co Ltd | Solid-state semiconductor light emitting device |
US7119422B2 (en) | 2004-11-15 | 2006-10-10 | Unity Opto Technology Co., Ltd. | Solid-state semiconductor light emitting device |
ATE541320T1 (en) | 2004-11-18 | 2012-01-15 | Koninkl Philips Electronics Nv | ILLUMINATOR AND METHOD FOR PRODUCING SUCH AN ILLUMINATOR |
WO2006065007A1 (en) | 2004-12-16 | 2006-06-22 | Seoul Semiconductor Co., Ltd. | Leadframe having a heat sink supporting ring, fabricating method of a light emitting diodepackage using the same and light emitting diodepackage fabbricated by the method |
US7285802B2 (en) * | 2004-12-21 | 2007-10-23 | 3M Innovative Properties Company | Illumination assembly and method of making same |
CN100389503C (en) | 2005-01-07 | 2008-05-21 | 北京大学 | Method for preparing LED chip with separate crystal grain vertical structure |
US9793247B2 (en) | 2005-01-10 | 2017-10-17 | Cree, Inc. | Solid state lighting component |
TWI255566B (en) | 2005-03-04 | 2006-05-21 | Jemitek Electronics Corp | Led |
JP4915052B2 (en) | 2005-04-01 | 2012-04-11 | パナソニック株式会社 | LED component and manufacturing method thereof |
US7994702B2 (en) | 2005-04-27 | 2011-08-09 | Prysm, Inc. | Scanning beams displays based on light-emitting screens having phosphors |
JP2006324331A (en) | 2005-05-17 | 2006-11-30 | Sony Corp | Light emitting diode and its manufacturing method, integrated light emitting diode and its manufacturing method, growing method of nitride- based group iii-v compound semiconductor, nitride-based group iii-v compound semiconductor growing substrate, light emitting diode backlight, light emitting diode lighting apparatus, light emitting diode display, and electronic equipment |
CN1874011A (en) | 2005-06-03 | 2006-12-06 | 邢陈震仑 | LED device |
JP2007012323A (en) | 2005-06-28 | 2007-01-18 | Cheil Ind Co Ltd | Surface light source device, and liquid crystal display device |
KR100757196B1 (en) | 2005-08-01 | 2007-09-07 | 서울반도체 주식회사 | Light emitting device with a lens of silicone |
US20070034886A1 (en) | 2005-08-11 | 2007-02-15 | Wong Boon S | PLCC package with integrated lens and method for making the package |
JP2007094088A (en) | 2005-09-29 | 2007-04-12 | Matsushita Electric Ind Co Ltd | Display device |
US20070096139A1 (en) | 2005-11-02 | 2007-05-03 | 3M Innovative Properties Company | Light emitting diode encapsulation shape control |
JP4724618B2 (en) | 2005-11-11 | 2011-07-13 | 株式会社 日立ディスプレイズ | LIGHTING DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE USING THE SAME |
JP3992059B2 (en) | 2005-11-21 | 2007-10-17 | 松下電工株式会社 | Method for manufacturing light emitting device |
JP2007184542A (en) | 2005-12-09 | 2007-07-19 | Matsushita Electric Ind Co Ltd | Light-emitting module, manufacturing method thereof, and backlight apparatus using same |
JP2007165029A (en) | 2005-12-12 | 2007-06-28 | Hitachi Displays Ltd | Display device |
JP2007201420A (en) | 2005-12-27 | 2007-08-09 | Sharp Corp | Semiconductor light-emitting device, semiconductor light-emitting element, and method of manufacturing semiconductor light-emitting device |
JP2007189150A (en) | 2006-01-16 | 2007-07-26 | Enomoto Co Ltd | Lead frame for low-height led device and method for manufacturing same |
JP2009087538A (en) | 2006-01-20 | 2009-04-23 | Sharp Corp | Light source unit, lighting device using it, and display device using it |
US20070170449A1 (en) | 2006-01-24 | 2007-07-26 | Munisamy Anandan | Color sensor integrated light emitting diode for LED backlight |
USD572670S1 (en) | 2006-03-30 | 2008-07-08 | Nichia Corporation | Light emitting diode |
JP2007273763A (en) | 2006-03-31 | 2007-10-18 | Sony Corp | Semiconductor device and its manufacturing method |
JP2007287981A (en) | 2006-04-18 | 2007-11-01 | Konica Minolta Opto Inc | Light emitting device |
WO2007127029A2 (en) | 2006-04-24 | 2007-11-08 | Cree, Inc. | Side-view surface mount white led |
US7635915B2 (en) | 2006-04-26 | 2009-12-22 | Cree Hong Kong Limited | Apparatus and method for use in mounting electronic elements |
JP2007299905A (en) | 2006-04-28 | 2007-11-15 | Nichia Chem Ind Ltd | Semiconductor device |
US20070269586A1 (en) | 2006-05-17 | 2007-11-22 | 3M Innovative Properties Company | Method of making light emitting device with silicon-containing composition |
KR100789951B1 (en) | 2006-06-09 | 2008-01-03 | 엘지전자 주식회사 | Apparatus and method for manufacturing Light Emitting Unit |
KR100904152B1 (en) | 2006-06-30 | 2009-06-25 | 서울반도체 주식회사 | Leadframe having a heat sink supporting part, fabricating method of the light emitting diode package using the same and light emitting diode package fabricated by the method |
TWM303325U (en) | 2006-07-13 | 2006-12-21 | Everlight Electronics Co Ltd | Light emitting diode package |
US7960819B2 (en) | 2006-07-13 | 2011-06-14 | Cree, Inc. | Leadframe-based packages for solid state emitting devices |
TWI313943B (en) | 2006-10-24 | 2009-08-21 | Chipmos Technologies Inc | Light emitting chip package and manufacturing thereof |
USD572210S1 (en) | 2006-11-01 | 2008-07-01 | Lg Innotek Co., Ltd. | Light-emitting diode (LED) |
KR101329413B1 (en) | 2006-12-19 | 2013-11-14 | 엘지디스플레이 주식회사 | Optical lens, optical module having the optical lens and backlight unit having the optical module |
US7687823B2 (en) | 2006-12-26 | 2010-03-30 | Nichia Corporation | Light-emitting apparatus and method of producing the same |
US7800304B2 (en) | 2007-01-12 | 2010-09-21 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Multi-chip packaged LED light source |
JP5106862B2 (en) | 2007-01-15 | 2012-12-26 | 昭和電工株式会社 | Light emitting diode package |
US7777412B2 (en) | 2007-03-22 | 2010-08-17 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Phosphor converted LED with improved uniformity and having lower phosphor requirements |
US7923831B2 (en) | 2007-05-31 | 2011-04-12 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | LED-based light source having improved thermal dissipation |
US7999283B2 (en) | 2007-06-14 | 2011-08-16 | Cree, Inc. | Encapsulant with scatterer to tailor spatial emission pattern and color uniformity in light emitting diodes |
USD576574S1 (en) | 2007-07-17 | 2008-09-09 | Rohm Co., Ltd. | Light emitting diode module |
CN100574543C (en) | 2007-07-30 | 2009-12-23 | 深圳莱特光电有限公司 | The method of isolating silver layer in a kind of warm white LED encapsulation process |
US11114594B2 (en) | 2007-08-24 | 2021-09-07 | Creeled, Inc. | Light emitting device packages using light scattering particles of different size |
US7791093B2 (en) | 2007-09-04 | 2010-09-07 | Koninklijke Philips Electronics N.V. | LED with particles in encapsulant for increased light extraction and non-yellow off-state color |
JP2007329516A (en) | 2007-09-14 | 2007-12-20 | Sharp Corp | Semiconductor light-emitting apparatus |
CN101388161A (en) | 2007-09-14 | 2009-03-18 | 科锐香港有限公司 | LED surface mounting device and LED display with the device |
US7524087B1 (en) | 2007-11-16 | 2009-04-28 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Optical device |
EP2223352B8 (en) | 2007-12-11 | 2018-08-29 | Lumileds Holding B.V. | Side emitting device with hybrid top reflector |
US8049230B2 (en) | 2008-05-16 | 2011-11-01 | Cree Huizhou Opto Limited | Apparatus and system for miniature surface mount devices |
GB2458972B (en) | 2008-08-05 | 2010-09-01 | Photonstar Led Ltd | Thermally optimised led chip-on-board module |
JP5284006B2 (en) | 2008-08-25 | 2013-09-11 | シチズン電子株式会社 | Light emitting device |
GB2466633A (en) | 2008-12-12 | 2010-07-07 | Glory Science Co Ltd | Method of manufacturing a light emitting unit |
US20110049545A1 (en) | 2009-09-02 | 2011-03-03 | Koninklijke Philips Electronics N.V. | Led package with phosphor plate and reflective substrate |
CN102648426B (en) | 2009-11-05 | 2015-07-15 | 鲁米尼特有限责任公司 | Method to provide microstructure for encapsulated high-brightness LED chips |
JP5678629B2 (en) | 2010-02-09 | 2015-03-04 | ソニー株式会社 | Method for manufacturing light emitting device |
KR101659357B1 (en) | 2010-05-12 | 2016-09-23 | 엘지이노텍 주식회사 | Light emitting device |
-
2005
- 2005-06-10 US US11/149,998 patent/US8669572B2/en active Active
-
2006
- 2006-04-27 WO PCT/US2006/016259 patent/WO2006135496A2/en active Search and Examination
- 2006-04-27 JP JP2008515699A patent/JP2008544488A/en active Pending
- 2006-04-27 DE DE112006001539T patent/DE112006001539T5/en not_active Withdrawn
- 2006-06-08 TW TW095120386A patent/TW200735414A/en unknown
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5130761A (en) * | 1990-07-17 | 1992-07-14 | Kabushiki Kaisha Toshiba | Led array with reflector and printed circuit board |
JP2001060072A (en) * | 1999-08-23 | 2001-03-06 | Matsushita Electric Ind Co Ltd | Display device |
EP1187228A1 (en) * | 2000-02-09 | 2002-03-13 | Nippon Leiz Corporation | Light source |
WO2002017405A1 (en) * | 2000-08-23 | 2002-02-28 | Osram Opto Semiconductors Gmbh | Optoelectronic component and method for the production thereof, module and device comprising a module of this type |
WO2004044877A2 (en) * | 2002-11-11 | 2004-05-27 | Cotco International Limited | A display device and method for making same |
EP1521313A2 (en) * | 2003-10-03 | 2005-04-06 | LumiLeds Lighting U.S., LLC | Integrated reflector cup for a light emitting device mount |
WO2005043627A1 (en) * | 2003-10-22 | 2005-05-12 | Cree, Inc. | Power surface mount light emitting die package |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10340424B2 (en) | 2002-08-30 | 2019-07-02 | GE Lighting Solutions, LLC | Light emitting diode component |
US9093616B2 (en) | 2003-09-18 | 2015-07-28 | Cree, Inc. | Molded chip fabrication method and apparatus |
US10546978B2 (en) | 2003-09-18 | 2020-01-28 | Cree, Inc. | Molded chip fabrication method and apparatus |
US10164158B2 (en) | 2003-09-18 | 2018-12-25 | Cree, Inc. | Molded chip fabrication method and apparatus |
US9105817B2 (en) | 2003-09-18 | 2015-08-11 | Cree, Inc. | Molded chip fabrication method and apparatus |
US9159888B2 (en) | 2007-01-22 | 2015-10-13 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
US9024349B2 (en) | 2007-01-22 | 2015-05-05 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
JP2012060181A (en) * | 2007-01-22 | 2012-03-22 | Cree Inc | Wafer level phosphor coating method and devices fabricated utilizing the method |
JP2009094282A (en) * | 2007-10-09 | 2009-04-30 | Cosmo Electronics Corp | High-power light emitting diode structure |
US9041285B2 (en) | 2007-12-14 | 2015-05-26 | Cree, Inc. | Phosphor distribution in LED lamps using centrifugal force |
US8878219B2 (en) | 2008-01-11 | 2014-11-04 | Cree, Inc. | Flip-chip phosphor coating method and devices fabricated utilizing method |
EP2454765A1 (en) * | 2009-07-15 | 2012-05-23 | OSRAM Opto Semiconductors GmbH | Light-emitting diode and method for producing a light-emitting diode |
US9951938B2 (en) | 2009-10-02 | 2018-04-24 | GE Lighting Solutions, LLC | LED lamp |
US10546846B2 (en) | 2010-07-23 | 2020-01-28 | Cree, Inc. | Light transmission control for masking appearance of solid state light sources |
US9166126B2 (en) | 2011-01-31 | 2015-10-20 | Cree, Inc. | Conformally coated light emitting devices and methods for providing the same |
US9841175B2 (en) | 2012-05-04 | 2017-12-12 | GE Lighting Solutions, LLC | Optics system for solid state lighting apparatus |
US10139095B2 (en) | 2012-05-04 | 2018-11-27 | GE Lighting Solutions, LLC | Reflector and lamp comprised thereof |
Also Published As
Publication number | Publication date |
---|---|
US8669572B2 (en) | 2014-03-11 |
TW200735414A (en) | 2007-09-16 |
WO2006135496A3 (en) | 2007-04-26 |
JP2008544488A (en) | 2008-12-04 |
US20060278882A1 (en) | 2006-12-14 |
DE112006001539T5 (en) | 2008-04-30 |
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